Patents by Inventor Michael Z. Eckblad
Michael Z. Eckblad has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20190038932Abstract: Mesh networks of radio node pods for measuring performance of teams and individual athletes by first stimulating and then by measuring a parameter of motion selected from velocity, vector, acceleration, force, and rebound. The system includes one or more radio node pods, each radio node pod having a microprocessor, supporting circuitry, a machine layer with one or more sensors and actuators, firmware for essential functions, and a soft socket for receiving “codelets” on the fly, each codelet containing a soft mini-script and attendant variables for iteration of a stimulus-response-sequence (SRS) customized to a previous iteration or training goal. Radio node pods may work in clusters and are typically multipotent, each pod performing specialized functions as dictated by a resident codelet but otherwise all pods having the same or similar hardware. Shared resources, either internal or external to the mesh network, are used for data analysis.Type: ApplicationFiled: October 8, 2018Publication date: February 7, 2019Inventors: Michael Z. Eckblad, Kenneth DeMile
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Patent number: 10057994Abstract: In one embodiment, a biasing device is actuated using an actuator which is aligned with the biasing device along an alignment axis. A first frame is thereby biased toward a second frame along the alignment axis to bias an integrated circuit package toward a socket. The actuator also latches the first and second frames together and biased towards each other with the integrated circuit package and the socket biased toward each other. Other aspects and features are also described.Type: GrantFiled: December 18, 2015Date of Patent: August 21, 2018Assignee: INTEL CORPORATIONInventors: Thomas A. Boyd, Michael Z. Eckblad
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Publication number: 20170135609Abstract: A wireless system of a plurality of independent pods initiates, collects, and processes absolute and/or relative response data of a biological system to stimulus. The data is then wirelessly transmitted to any one or combination of external communication devices via a bridge pod. The system is well adapted to collect response measurement data related to a plurality of sequences of stimulus.Type: ApplicationFiled: January 31, 2017Publication date: May 18, 2017Inventors: Michael Z. Eckblad, Ken DeMile
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Publication number: 20160105974Abstract: In one embodiment, a biasing device is actuated using an actuator which is aligned with the biasing device along an alignment axis. A first frame is thereby biased toward a second frame along the alignment axis to bias an integrated circuit package toward a socket. The actuator also latches the first and second frames together and biased towards each other with the integrated circuit package and the socket biased toward each other. Other aspects and features are also described.Type: ApplicationFiled: December 18, 2015Publication date: April 14, 2016Inventors: Thomas A. BOYD, Michael Z. ECKBLAD
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Patent number: 9245818Abstract: In one embodiment, a biasing device is actuated using an actuator which is aligned with the biasing device along an alignment axis. A first frame is thereby biased toward a second frame along the alignment axis to bias an integrated circuit package toward a socket. The actuator also latches the first and second frames together and biased towards each other with the integrated circuit package and the socket biased toward each other. Other aspects and features are also described.Type: GrantFiled: September 28, 2012Date of Patent: January 26, 2016Assignee: INTEL CORPORATIONInventors: Thomas A. Boyd, Michael Z. Eckblad
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Publication number: 20140092547Abstract: In one embodiment, a biasing device is actuated using an actuator which is aligned with the biasing device along an alignment axis. A first frame is thereby biased toward a second frame along the alignment axis to bias an integrated circuit package toward a socket. The actuator also latches the first and second frames together and biased towards each other with the integrated circuit package and the socket biased toward each other. Other aspects and features are also described.Type: ApplicationFiled: September 28, 2012Publication date: April 3, 2014Inventors: Thomas A. BOYD, Michael Z. ECKBLAD
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Patent number: 7035107Abstract: A method and an apparatus for releasably retaining a heatsink in contact with an IC attached to a circuitboard in which the heatsink is inserted into a spring cage that is pivotally connected with an actuation lever, wherein at least a pair of spring tabs engage the heatsink to press a thermal conductive surface of the heatsink towards a circuitboard and an IC attached to the circuitboard when the combination of the heatsink, actuation lever and spring cage are inserted into the rectangular frame of a retention module mounted on the circuitboard so as to surround the IC and the lever portion of the actuation lever is pivoted towards the spring cage so as to cause retention points on the actuator portions of the actuation lever and on the rectangular frame of the spring cage to engage corresponding retention points on the rectangular frame of the retention module.Type: GrantFiled: July 11, 2003Date of Patent: April 25, 2006Assignee: Intel CorporationInventors: Michael Z. Eckblad, Eric D. McAfee, Andy F. Thompson, Glen P. Gordon
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Patent number: 7017258Abstract: A system for mounting heatsinks, in particular, high-mass heatsinks, on printed circuit boards, such as motherboards. The mounting system includes a backplate, disposed beneath the motherboard, with pins protruding up through the motherboard, and a linkage assembly, which is fixably attached to a base portion of a heatsink assembly. The linkage assembly includes scoops, for grasping the pins during engagement, and a ratcheting system, for compressing the heatsink and thermal interface material onto the package. The mounting system is designed to effectively distribute the heatsink weight, as well as the forces caused by chronic and dynamic stresses, through, rather than upon the motherboard, such as to a chassis. The mounting system thus alleviates stress cracks, component pullout, solderball stress, and other damaging conditions to the motherboard. The mounting system may be engaged and disengaged without the use of tools.Type: GrantFiled: January 26, 2004Date of Patent: March 28, 2006Assignee: Intel CorporationInventors: Michael Z. Eckblad, Mark W. Anderson
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Publication number: 20040212079Abstract: A heat dissipation device having an integral load centering mechanism adapted to provide a location for contact between a spring clip and the heat dissipation device. The load centering mechanism is located in an area on the heat dissipation device which will provide a centered loading to a microelectronic die and constitutes substantially the only place where the spring clip contacts the heat dissipation device when the spring clip is providing a force against the heat dissipation device.Type: ApplicationFiled: May 17, 2004Publication date: October 28, 2004Inventors: Casey R. Winkel, Michael Z. Eckblad, Jeffrey J. Sopko
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Patent number: 6803652Abstract: A heat dissipation device having an integral load centering mechanism adapted to provide a location for contact between a spring clip and the heat dissipation device. The load centering mechanism is located in an area on the heat dissipation device which will provide a centered loading to a microelectronic die and constitutes substantially the only place where the spring clip contacts the heat dissipation device when the spring clip is providing a force against the heat dissipation device.Type: GrantFiled: May 30, 2001Date of Patent: October 12, 2004Assignee: Intel CorporationInventors: Casey R. Winkel, Michael Z. Eckblad, Jeffrey J. Sopko
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Patent number: 6704825Abstract: A system to connect cards in a chassis is provided. The system includes a chassis frame having a slot to receive a card. A rocker is coupled to the chassis frame and positioned in a closed state when the card is in the slot. A magnetic element is positioned on the rocker and a sensor positioned to detect a magnetic field generated by the magnetic element. The sensor then determines whether the rocker is positioned an open state or said closed state.Type: GrantFiled: June 30, 2000Date of Patent: March 9, 2004Assignee: Intel CorporationInventors: Michael A. Lascu, Michael Z. Eckblad, Brian R. Peil, Glen P. Gordon, Ron Flamm, Dan C. Plitt, Eryan Eylon, Ronald B. Sutherland, Mark W. Anderson
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Patent number: 6512678Abstract: An apparatus, and method for using same, is described for a distributed load board stiffener. The apparatus may include a body having a central axis portion and multiple protusions extending away from the central axis portion towards respective ends. Each of the ends of the protrusions having a mounting point to mount a printed circuit board to a chassis support. The protrusions may operate to mount the board stiffener to a printed circuit board away from trace routing areas disposed centrally on the printed circuit board. The protrusions may operate to distribute a load around a periphery of the printed circuit board.Type: GrantFiled: March 30, 2001Date of Patent: January 28, 2003Assignee: Intel CorporationInventors: Rob W. Sims, Uppalapati V. Ramgopal, Ronald C. Flamm, Michael Z. Eckblad
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Patent number: 6496371Abstract: A method and apparatus for safely and quickly mounting a heat sink in heat conducting relation with an electronic component on a supporting member such as a printed circuit board, allow sequential assembly of the heat sink and a wire clip for mounting the heat sink on the supporting member in a manner which reduces the possibility of damaging the electronic component or components on the supporting member. A load centering part is arranged between an elongated central portion of the wire clip and the heat sink to help locate the clip force on the heat sink generally opposite the electronic component without retaining the central portion of the mounting device on the heat sink.Type: GrantFiled: March 30, 2001Date of Patent: December 17, 2002Assignee: Intel CorporationInventors: Casey R. Winkel, Michael Z. Eckblad
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Publication number: 20020180034Abstract: A heat dissipation device having an integral load centering mechanism adapted to provide a location for contact between a spring clip and the heat dissipation device. The load centering mechanism is located in an area on the heat dissipation device which will provide a centered loading to a microelectronic die and constitutes substantially the only place where the spring clip contacts the heat dissipation device when the spring clip is providing a force against the heat dissipation device.Type: ApplicationFiled: May 30, 2001Publication date: December 5, 2002Inventors: Casey R. Winkel, Michael Z. Eckblad, Jeffrey J. Sopko
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Publication number: 20020141157Abstract: A method and apparatus for safely and quickly mounting a heat sink in heat conducting relation with an electronic component on a supporting member such as a printed circuit board, allow sequential assembly of the heat sink and a wire clip for mounting the heat sink on the supporting member in a manner which reduces the possibility of damaging the electronic component or components on the supporting member. A load centering part is arranged between an elongated central portion of the wire clip and the heat sink to help locate the clip force on the heat sink generally opposite the electronic component without retaining the central portion of the mounting device on the heat sink.Type: ApplicationFiled: March 30, 2001Publication date: October 3, 2002Inventors: Casey R. Winkel, Michael Z. Eckblad
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Publication number: 20020141165Abstract: An apparatus, and method for using same, is described for a distributed load board stiffener. The apparatus may include a body having a central axis portion and multiple protrusions extending away from the central axis portion toward respective ends. Each of the ends of the protrusions having a mounting point to amount a printed circuit board to a chassis support. The protrusions may operate to mount the board stiffener to a printed circuit board away from trace routing areas disposed centrally on the printed circuit board. The protrusions may operate to distribute a load around a periphery of the printed circuit board.Type: ApplicationFiled: March 30, 2001Publication date: October 3, 2002Inventors: Rob W. Sims, Uppalapati V. Ramgopal, Ronald C. Flamm, Michael Z. Eckblad
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Patent number: 6407922Abstract: A heat spreader, method of making the heat spreader, and incorporation of the heat spreader in an assembly such as an electronic assembly, are disclosed. The heat spreader includes a matrix material, which has incorporated therein carbon nanotubes and/or thermal pyrolytic graphite flakes. The carbon nanotubes and/or thermal pyrolytic graphite flakes are situated between a first surface and a second surface of the heat spreader, to transfer heat from a heat source (e.g., an electronic component) adjacent the first surface to, e.g., a heat sink adjacent the second surface when the heat spreader is incorporated in the assembly. The first surface has a smaller surface area than that of the second surface. Desirably, the carbon nanotubes and/or thermal pyrolytic graphite flakes are aligned extending between the first and second surfaces, and spread out in a direction from the first surface to the second surface, to provide more effective heat transfer and uniform spreading of the heat.Type: GrantFiled: September 29, 2000Date of Patent: June 18, 2002Assignee: Intel CorporationInventors: Michael Z. Eckblad, Pardeep K. Bhatti
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Patent number: 6390475Abstract: A method and assembly for utilizing a gasket to protect an exposed die from damage, such as chipping and cracking, caused by external forces such as shock, vibrations, installation and/or handling, as well as to prevent electromagnetic interference (EMI) emissions from the exposed die.Type: GrantFiled: August 31, 1999Date of Patent: May 21, 2002Assignee: Intel CorporationInventors: Michael Z. Eckblad, Russell S. Aoki, Chia-Pin Chiu, Correy D. Cooks, Richard Zhao
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Patent number: 6350136Abstract: A socket comprising an electrically conductive element, the element situated within a well such that a first end of the element extends above a first surface of the socket, the element capable of flexing to exert a first force on a pin inserted into the well upon application of a second force by a descending surface to the first end of the element.Type: GrantFiled: December 14, 1998Date of Patent: February 26, 2002Assignee: Intel CorporationInventors: Michael Z. Eckblad, James G. Maveety