Patents by Inventor Michael Zipparo

Michael Zipparo has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Interference profile of a bursty channel
    Patent number: 10560729
    Abstract: A network test instrument is operable to generate an interference profile for a bursty channel of a cable television network. Frequency spectrum data of a received signal is cross-correlated with predetermined frequency spectrum data to identify traces representative of noise. The interference profile may be built from the traces.
    Type: Grant
    Filed: May 21, 2019
    Date of Patent: February 11, 2020
    Assignee: VIAVI SOLUTIONS INC.
    Inventors: Cinna Soltanpur, Vincent Michael Zipparo, Daniel Keith Chappel
  • INTERFERENCE PROFILE OF A BURSTY CHANNEL
    Publication number: 20190342593
    Abstract: A network test instrument is operable to generate an interference profile for a bursty channel of a cable television network. Frequency spectrum data of a received signal is cross-correlated with predetermined frequency spectrum data to identify traces representative of noise. The interference profile may be built from the traces.
    Type: Application
    Filed: May 21, 2019
    Publication date: November 7, 2019
    Applicant: VIAVI SOLUTIONS INC.
    Inventors: Cinna Soltanpur, Vincent Michael Zipparo, Daniel Keith Chappell
  • Interference profile of a bursty channel
    Patent number: 10321169
    Abstract: A network test instrument is operable to generate an interference profile for a bursty channel of a cable television network. Frequency spectrum data of a received signal is cross-correlated with predetermined frequency spectrum data to identify traces representative of noise. The interference profile may be built from the traces.
    Type: Grant
    Filed: December 1, 2017
    Date of Patent: June 11, 2019
    Assignee: VIAVI SOLUTIONS INC.
    Inventors: Cinna Soltanpur, Vincent Michael Zipparo, Daniel Keith Chappell
  • INTERFERENCE PROFILE OF A BURSTY CHANNEL
    Publication number: 20190174162
    Abstract: A network test instrument is operable to generate an interference profile for a bursty channel of a cable television network. Frequency spectrum data of a received signal is cross-correlated with predetermined frequency spectrum data to identify traces representative of noise. The interference profile may be built from the traces.
    Type: Application
    Filed: December 1, 2017
    Publication date: June 6, 2019
    Applicant: VIAVI SOLUTIONS INC.
    Inventors: Cinna SOLTANPUR, Vincent Michael Zipparo, Daniel Keith Chappell
  • ULTRASOUND PROBE TRANSDUCER ASSEMBLY AND PRODUCTION METHOD
    Publication number: 20070226976
    Abstract: An improved ultrasound transducer assembly, e.g. a thickness-mode transducer assembly includes a plurality of elements comprising piezoelectric material, and a backing material disposed adjacent to a back surface of the plurality of elements. The piezoelectric material and backing material define at least a portion of a side surface, wherein an electrically conductive material is disposed upon and in contact with at least a portion of the side surface. The elements may comprise one or a plurality of front electrodes, and one or a plurality of back electrodes, wherein the front electrode(s) is electrically interconnected to the electrically conductive material disposed on the side surface portion. In a mass processing method, a plurality of thickness-mode ultrasound probe transducer assemblies may be produced, wherein a plurality of interconnected transducer subassemblies comprising a mass backing are processed in tandem.
    Type: Application
    Filed: June 11, 2007
    Publication date: October 4, 2007
    Inventors: Michael Zipparo, Monica Johnson, Clyde Oakley, Dennis Dietz, Michael LaBree, Mark Donhowe
  • Ultrasound probe transducer assembly and production method
    Publication number: 20070046149
    Abstract: An improved ultrasound transducer assembly, e.g. a thickness-mode transducer assembly includes a plurality of elements comprising piezoelectric material, and a backing material disposed adjacent to a back surface of the plurality of elements. The piezoelectric material and backing material define at least a portion of a side surface, wherein an electrically conductive material is disposed upon and in contact with at least a portion of the side surface. The elements may comprise one or a plurality of front electrodes, and one or a plurality of back electrodes, wherein the front electrode(s) is electrically interconnected to the electrically conductive material disposed on the side surface portion. In a mass processing method, a plurality of thickness-mode ultrasound probe transducer assemblies may be produced, wherein a plurality of interconnected transducer subassemblies comprising a mass backing are processed in tandem.
    Type: Application
    Filed: August 23, 2005
    Publication date: March 1, 2007
    Inventors: Michael Zipparo, Monica Johnson, Clyde Oakley, Dennis Dietz, Michael LaBree, Mark Donhowe