Abstract: An electronic device includes: a water impermeable substrate; at least one electronic circuit on the water impermeable substrate; a dielectric encapsulant on the electronic circuit; a capping layer comprising a polymer on the dielectric encapsulant; and a barrier layer on the capping layer, the water impermeable substrate, the dielectric encapsulant, the capping layer, and the barrier layer forming a hermetically sealed micro-cavity.

Abstract: An electronic device includes: a water impermeable substrate; at least one electronic circuit on the water impermeable substrate; a dielectric encapsulant on the electronic circuit; a capping layer comprising a polymer on the dielectric encapsulant; and a barrier layer on the capping layer, the water impermeable substrate, the dielectric encapsulant, the capping layer, and the barrier layer forming a hermetically sealed micro-cavity.

Abstract: A portable and reusable installation platform for easing the installation or maintenance of an air conditioner on a vertical wall includes at least one support base upon which at least part of the air conditioner is positioned during the installation or maintenance thereof. At least one connector extends from the first end of the support base and is configured to releaseably engage the wall. At least one support leg extends downwardly from the support base and is configured to abut the wall to support the weight of the air conditioner placed upon the support base.

Abstract: A portable and reusable installation platform for easing the installation or maintenance of an air conditioner on a vertical wall includes at least one support base upon which at least part of the air conditioner is positioned during the installation or maintenance thereof. At least one connector extends from the first end of the support base and is configured to releaseably engage the wall. At least one support leg extends downwardly from the support base and is configured to abut the wall to support the weight of the air conditioner placed upon the support base.

Abstract: A portable and reusable installation platform for easing the installation or maintenance of an air conditioner on a vertical wall includes at least one support base upon which at least part of the air conditioner is positioned during the installation or maintenance thereof. At least one connector extends from the first end of the support base and is configured to releasably engage the wall. At least one support leg extends downwardly from the support base and is configured to abut the wall to support the weight of the air conditioner placed upon the support base.

Abstract: A process for increasing the production of monoalkylbenzenes is presented. The process includes utilizing a transalkylation process to convert dialkylbenzenes to monoalkylbenzenes. The feed to the transalkylation process has alkylated toluenes and alkylated ethylbenzenes and other alkylated aromatics having small alkyl groups with less than 8 carbons removed to improve the efficiency of the transalkylation process. The recycled dialkylbenzenes and a portion of the recycled benzene are converted to monoalkylbenzenes.

Abstract: A process for regenerating a catalyst used in a reaction zone. In a regeneration zone, the catalyst may be cooled before passing into a chloride rich zone. The regeneration zone may also receive a heated ambient oxygen in a catalyst heating zone. The regeneration zone may also receive recovered chloride from a chloride recovering zone which removes and recovers chloride from regeneration gas taken from the regeneration zone. Heated ambient oxygen may also be introduced into a chlorination zone.

Abstract: A process for regenerating a catalyst used in a reaction zone. In a regeneration zone, the catalyst may be cooled before passing into a chloride rich zone. The regeneration zone may also receive a heated ambient oxygen in a catalyst heating zone. The regeneration zone may also receive recovered chloride from a chloride recovering zone which removes and recovers chloride from regeneration gas taken from the regeneration zone. Heated ambient oxygen may also be introduced into a chlorination zone.

Abstract: A radome is provided and includes a substrate formed of moisture permeable material and a coating disposed on a surface of the SCFS substrate. The coating includes a layer of inorganic material disposed adjacent to at least one layer of organic material.

Abstract: A radome is provided and includes a substrate formed of moisture permeable material and a coating disposed on a surface of the SCFS substrate. The coating includes a layer of inorganic material disposed adjacent to at least one layer of organic material.

Abstract: A process for increasing the production of monoalkylbenzenes is presented. The process includes utilizing a transalkylation process to convert dialkylbenzenes to monoalkylbenzenes. The feed to the transalkylation process has alkylated toluenes and alkylated ethylbenzenes and other alkylated aromatics having small alkyl groups with less than 8 carbons removed to improve the efficiency of the transalkylation process. The recycled dialkylbenzenes and a portion of the recycled benzene are converted to monoalkylbenzenes.

Abstract: A portable and reusable installation platform for easing the installation or maintenance of an air conditioner on a vertical wall includes at least one support base upon which at least part of the air conditioner is positioned during the installation or maintenance thereof. At least one connector extends from the first end of the support base and is configured to releasably engage the wall. At least one support leg extends downwardly from the support base and is configured to abut the wall to support the weight of the air conditioner placed upon the support base.

Abstract: A method includes providing a circuit board having an outer surface, the outer surface configured with a plurality of discrete electrical components that are each manufactured independently of one another, and coating the outer surface and the plurality of discrete electrical components with a first protective dielectric layer. The method further includes coating the first protective dielectric layer with a second dielectric layer. The second dielectric layer includes a dielectric material having a modulus of elasticity less than 3.5 Giga-Pascal (GPa), a dielectric constant less than 2.7, a dielectric loss less than 0.002, a breakdown voltage strength in excess of 2 million volts/centimeter (MV/cm), a temperature stability to 3000 Celsius, a defect densities less than 0.5/centimeter, a pinhole free in films greater than 50 Angstroms, and is capable of being deposited conformally over and under 3D structures with thickness uniformity less than or equal to 10%.

Abstract: Embodiments of the invention are directed toward a novel printed antenna that provides a low-loss transition into waveguide. The antenna is integrated with a heat spreader and the interconnection between the antenna and the output device (such as a power amplifier) is a simple conductive connection, such as (but not limited to), a wirebond. Integrating the antenna with the heat spreader in accordance with the concepts, circuits, and techniques described herein drastically shortens the distance from the output device to the waveguide, thus reducing losses and increasing bandwidth. The transition and technique described herein may be easily scaled for both higher and lower frequencies. Embodiments of the present apparatus also eliminate the complexity of the prior art circuit boards and transitions and enable the use of a wider range of substrates while greatly simplifying assembly.

Abstract: Embodiments of the invention are directed toward a novel printed antenna that provides a low-loss transition into waveguide. The antenna is integrated with a heat spreader and the interconnection between the antenna and the output device (such as a power amplifier) is a simple conductive connection, such as (but not limited to), a wirebond. Integrating the antenna with the heat spreader in accordance with the concepts, circuits, and techniques described herein drastically shortens the distance from the output device to the waveguide, thus reducing losses and increasing bandwidth. The transition and technique described herein may be easily scaled for both higher and lower frequencies. Embodiments of the present apparatus also eliminate the complexity of the prior art circuit boards and transitions and enable the use of a wider range of substrates while greatly simplifying assembly.

Abstract: Processes and apparatuses for regenerating catalyst particles are provided. The processes include introducing spent catalyst particles to a burn zone in a continuous catalyst regenerator. When introduced, the catalyst particles, which contain a platinum group metal, carry coke deposits. In the process, a combustion gas at a temperature of at least 490° C. with an oxygen content of at least 0.5 mol % is fed to the burn zone. There, the coke deposits on the catalyst particles are combusted with the combustion gas. The catalyst particles are passed from the burn zone to a halogenation zone in the continuous catalyst regenerator and the catalyst particles are oxyhalogenated to redisperse the platinum group metal to form regenerated catalyst particles.

Abstract: A circuit board assembly includes a circuit board having an outer surface, the outer surface being configured with a plurality of discrete electrical components that are each manufactured independently of one another. The circuit board assembly further includes a domed lid enclosure disposed over one of the plurality of discrete electrical components and an additional dielectric coating overlying the outer surface and the domed lid enclosure.

Abstract: According to one embodiment of the disclosure, an environmental protection coating comprises a circuit assembly having a first protective dielectric layer and a second dielectric layer. The circuit assembly has an outer surface on which a plurality of discrete electrical components are attached. The first protective dielectric layer overlays the circuit assembly. The second dielectric layer overlays the first protective dielectric layer and is made of a dielectric material having modulus of elasticity less than 3.5 Giga-Pascal (GPa), dielectric constant less than 2.7, dielectric loss less than 0.008, breakdown voltage strength in excess of 2 million volts/centimeter (MV/cm), temperature stability to 300° Celsius, defect densities less than 0.5/centimeter, pinhole free in films greater than 50 Angstroms, capable of being deposited conformally over and under 3D structures with thickness uniformity less than or equal to 10%.

Abstract: A circuit board assembly includes a circuit board having an outer surface configured with a plurality of discrete electrical components. The assembly includes a first protective dielectric layer overlying the outer surface, and a second dielectric layer overlying the first protective dielectric layer and the discrete electrical components. The second dielectric layer includes a dielectric material having modulus of elasticity less than 3.5 Giga-Pascal (GPa), a dielectric constant less than 3.0, a dielectric loss less than 0.008, a moisture absorption less than 0.04 percent, a breakdown voltage strength in excess of 2 million volts/centimeter (MV/cm), a temperature stability to 300° Celsius, pinhole free in films greater than 50 Angstroms, hydrophobic with a wetting angle greater than 45 degrees, capable of being deposited conformally over and under 3D structures with thickness uniformity less than or equal to 30%.

Abstract: According to one embodiment of the disclosure, a method for passivating a circuit device generally includes providing a substrate having a substrate surface, forming an electrical component on the substrate surface, and coating the substrate surface and the electrical component with a first protective dielectric layer. The first protective dielectric layer is made of a generally moisture insoluble material having a moisture permeability less than 0.01 gram/meter2/day, a moisture absorption less than 0.04 percent, a dielectric constant less than 10, a dielectric loss less than 0.005, a breakdown voltage strength greater than 8 million volts/centimeter, a sheet resistivity greater than 1015 ohm-centimeter, and a defect density less than 0.5/centimeter2.