Patents by Inventor Michal Chajneta

Michal Chajneta has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 12109645
    Abstract: A method of welding includes providing first and second joining partners, providing a welding apparatus that includes a sonotrode comprising a structured working surface, arranging the first and second joining partners to contact one another, and forming a welded connection between the first and second joining partners by contacting the first joining partner with the structured working surface and vibrating the sonotrode at an ultrasonic frequency, wherein the structured working surface comprises a plurality of apexes, a plurality of nadirs between immediately adjacent ones of the apexes, and planar sidewalls that extend between the nadirs and the apexes, and wherein for each of the apexes the planar sidewalls on either side of the respective apex extend along first and second planes that intersect one another at an acute angle.
    Type: Grant
    Filed: August 18, 2023
    Date of Patent: October 8, 2024
    Assignee: Infineon Technologies AG
    Inventors: Till Neddermann, Michal Chajneta, Alparslan Takkac
  • Publication number: 20240332136
    Abstract: A power semiconductor device includes: at least one substrate; at least one power semiconductor die arranged over the at least one substrate; a first leadframe arranged over the at least one power semiconductor substrate and over the at least one power semiconductor die, the first leadframe being arranged at least partially in a first plane and including one or more connecting portions extending out of the first plane in a first direction; and a second leadframe at least partially arranged in a second plane above or below the first plane and including one or more attachment sites. The one or more connecting portions extend into the second plane at the one or more attachment sites. The one or more connecting portions are arranged at a non-zero distance from the second leadframe, the non-zero distance being bridged by weld seams at the one or more attachment sites.
    Type: Application
    Filed: March 19, 2024
    Publication date: October 3, 2024
    Inventors: Marco Bäßler, Michal Chajneta, Thorsten Scharf, Egbert Lamminger
  • Publication number: 20230390859
    Abstract: A method of welding includes providing first and second joining partners, providing a welding apparatus that includes a sonotrode comprising a structured working surface, arranging the first and second joining partners to contact one another, and forming a welded connection between the first and second joining partners by contacting the first joining partner with the structured working surface and vibrating the sonotrode at an ultrasonic frequency, wherein the structured working surface comprises a plurality of apexes, a plurality of nadirs between immediately adjacent ones of the apexes, and planar sidewalls that extend between the nadirs and the apexes, and wherein for each of the apexes the planar sidewalls on either side of the respective apex extend along first and second planes that intersect one another at an acute angle.
    Type: Application
    Filed: August 18, 2023
    Publication date: December 7, 2023
    Inventors: Till Neddermann, Michal Chajneta, Alparslan Takkac
  • Patent number: 11772187
    Abstract: An ultrasonic welding apparatus includes a sonotrode comprising a structured working surface that comprises a plurality of apexes, a plurality of nadirs between immediately adjacent ones of the apexes, and planar sidewalls that extend between the nadirs and the apexes, and for each of the apexes the planar sidewalls on either side of the respective apex extend along first and second planes that intersect one another at an acute angle.
    Type: Grant
    Filed: April 30, 2021
    Date of Patent: October 3, 2023
    Assignee: Infineon Technologies AG
    Inventors: Till Neddermann, Michal Chajneta, Alparslan Takkac
  • Patent number: 11646291
    Abstract: A method for calibrating a second bonding machine based on a calibrated first bonding machine is disclosed. The first bonding machine includes a first ultrasonic transducer. The second bonding machine includes a second ultrasonic transducer and a power supply. The method includes providing a first electrical calibration supply that causes the first ultrasonic transducer to oscillate at a first calibration amplitude when it is damped by a mechanical damping, providing a second electrical calibration supply that causes the second ultrasonic transducer to oscillate at the same calibration amplitude when it is damped by the same mechanical damping.
    Type: Grant
    Filed: July 31, 2019
    Date of Patent: May 9, 2023
    Assignee: Infineon Technologies AG
    Inventors: Florian Eacock, Michal Chajneta, Stefan Tophinke
  • Publication number: 20220347786
    Abstract: An ultrasonic welding apparatus includes a sonotrode comprising a structured working surface that comprises a plurality of apexes, a plurality of nadirs between immediately adjacent ones of the apexes, and planar sidewalls that extend between the nadirs and the apexes, and for each of the apexes the planar sidewalls on either side of the respective apex extend along first and second planes that intersect one another at an acute angle.
    Type: Application
    Filed: April 30, 2021
    Publication date: November 3, 2022
    Inventors: Till Neddermann, Michal Chajneta, Alparslan Takkac
  • Publication number: 20200043883
    Abstract: A method for calibrating a second bonding machine based on a calibrated first bonding machine is disclosed. The first bonding machine includes a first ultrasonic transducer. The second bonding machine includes a second ultrasonic transducer and a power supply. The method includes providing a first electrical calibration supply that causes the first ultrasonic transducer to oscillate at a first calibration amplitude when it is damped by a mechanical damping, providing a second electrical calibration supply that causes the second ultrasonic transducer to oscillate at the same calibration amplitude when it is damped by the same mechanical damping.
    Type: Application
    Filed: July 31, 2019
    Publication date: February 6, 2020
    Inventors: Florian Eacock, Michal Chajneta, Stefan Tophinke