Abstract: Systems, apparatuses, and methods are provided for increasing the throughput of a particle inspection system. During a first portion of an exposure time period of the particle inspection system, an example method can include irradiating a first region of a substrate surface, blocking all reflected radiation outside the first region, and generating a first sub-image of the first region based on radiation reflected from the first region. During a second portion of the exposure time period, the example method can further include irradiating a second region of the substrate surface, blocking all reflected radiation outside the second region, and generating a second sub-image of the second region based on radiation reflected from the second region. Subsequently, the example method can include generating a composite image based on the first sub-image and the second sub-image.

Abstract: A system (400) includes an illumination system (402), a detector (404), and a comparator (406). The illumination system includes a radiation source (408) and a spatial light modulator (410). The radiation source generates a beam of radiation (442). The spatial light modulator directs the beam toward a surface (436) of an object (428) and adjusts a spatial intensity distribution of the beam at the surface. The detector receives radiation (444) scattered at the surface and by a structure (434) near the surface. The detector generates a detection signal based on the received radiation. The comparator receives the detection signal, generates a first image based on the detection signal, and distinguishes between a spurious signal and a signal corresponding to a presence of a foreign particle on the surface based on the first image and the adjusted spatial intensity distribution.

Abstract: An inspection system (1600), a lithography apparatus, and an inspection method are provided. The inspection system (1600) includes an illumination system (1602), a detection system (1606), and processing circuitry (1622). The illumination system generates a first illumination beam (1610) at a first wavelength and a second illumination beam (1618) at a second wavelength. The first wavelength is different from the second wavelength. The illumination system irradiates an object (1612) simultaneously with the first illumination beam and the second illumination beam. The detection system receives radiation (1620) scattered by a particle (1624) present at a surface (1626) of the object at the first wavelength. The detection system generates a detection signal. The processing circuitry determines a characteristic of the particle based on the detection signal.

Abstract: An inspection system, a lithography apparatus, and an inspection method are provided. The inspection system includes an illumination system, a detection system, and processing circuitry. The illumination system generates a broadband beam and illuminates surface of an object with the broadband illumination beam. The broadband beam has a continuous spectral range. The detection system receives radiation scattered at the surface and by a structure near the surface. The detection system generates a detection signal based on an optical response to the broadband illumination beam. The processing circuitry analyzes the detection signal. The processing circuitry distinguishes between a spurious signal and a signal corresponding to a defect on the surface based on the analyzing The spurious signal is diminished for at least a portion of the continuous spectral range.

Abstract: A system (400) includes an illumination system (402), a detector (404), and a comparator (406). The illumination system includes a radiation source (408) and a spatial light modulator (410). The radiation source generates a beam of radiation (442). The spatial light modulator directs the beam toward a surface (436) of an object (428) and adjusts a spatial intensity distribution of the beam at the surface. The detector receives radiation (444) scattered at the surface and by a structure (434) near the surface. The detector generates a detection signal based on the received radiation. The comparator receives the detection signal, generates a first image based on the detection signal, and distinguishes between a spurious signal and a signal corresponding to a presence of a foreign particle on the surface based on the first image and the adjusted spatial intensity distribution.

Abstract: An inspection system includes a radiation source that generates a beam of radiation and irradiates a first surface of an object, defining a region of the first surface of the object. The radiation source also irradiates a second surface of the object, defining a region of the second surface, wherein the second surface is at a different depth level within the object than the first surface. The inspection system may also include a detector that defines a field of view (FOV) of the first surface including the region of the first surface, and receives radiation scattered from the region of the first surface and the region of the second surface. The inspection system may also include a processor that discards image data not received from the region of the first surface, and constructs a composite image comprising the image data from across the region of the first surface.

Abstract: Three-dimensional shape measuring instrument (white interferometer) for measuring the three-dimensional shape of an object to be measured by using white interference fringes, which detects the position where the amplitude of the white interference fringes takes on a maximum value with high accuracy in a short calculation processing time. An envelope distribution of the amplitude of the white interference fringes produced by the interference between the returning light from a reference mirror (6) and the returning light from an object (7) to be measured is determined, and an approximate position where the contrast of the white interference fringes is the highest is determined using this envelope distribution.

Abstract: Three-dimensional shape measuring instrument (white interferometer) for measuring the three-dimensional shape of an object to be measured by using white interference fringes, which detects the position where the amplitude of the white interference fringes takes on a maximum value with high accuracy in a short calculation processing time. An envelope distribution of the amplitude of the white interference fringes produced by the interference between the returning light from a reference mirror (6) and the returning light from an object (7) to be measured is determined, and an approximate position where the contrast of the white interference fringes is the highest is determined using this envelope distribution.