Patents by Inventor Michal L. SABOTTA

Michal L. SABOTTA has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • HEATSINK WITH ADJUSTABLE FIN PITCH
    Publication number: 20230363104
    Abstract: An apparatus includes at least one heat pipe that is adapted to be thermally coupled to an integrated circuit and has an evaporator portion and a first condenser portion, wherein the first condenser portion extends away from the evaporator portion; a first plurality of cooling fins that is attached to the first condenser portion; a first movable support that is thermally coupled to the first condenser portion and is configured to move a second plurality of cooling fins relative to the first plurality of cooling fins; and the second plurality of cooling fins, which is attached to the first movable support.
    Type: Application
    Filed: July 21, 2023
    Publication date: November 9, 2023
    Inventors: Susheela NARASIMHAN, Michal L. SABOTTA
  • Heat sink with adjustable fin pitch
    Patent number: 11711905
    Abstract: An apparatus includes at least one heat pipe that is adapted to be thermally coupled to an integrated circuit and has an evaporator portion and a first condenser portion, wherein the first condenser portion extends away from the evaporator portion; a first plurality of cooling fins that is attached to the first condenser portion; a first movable support that is thermally coupled to the first condenser portion and is configured to move a second plurality of cooling fins relative to the first plurality of cooling fins; and the second plurality of cooling fins, which is attached to the first movable support.
    Type: Grant
    Filed: August 12, 2020
    Date of Patent: July 25, 2023
    Assignee: NVIDIA Corporation
    Inventors: Susheela Narasimhan, Michal L. Sabotta
  • HEAT SINK WITH ADJUSTABLE FIN PITCH
    Publication number: 20210259133
    Abstract: An apparatus includes at least one heat pipe that is adapted to be thermally coupled to an integrated circuit and has an evaporator portion and a first condenser portion, wherein the first condenser portion extends away from the evaporator portion; a first plurality of cooling fins that is attached to the first condenser portion; a first movable support that is thermally coupled to the first condenser portion and is configured to move a second plurality of cooling fins relative to the first plurality of cooling fins; and the second plurality of cooling fins, which is attached to the first movable support.
    Type: Application
    Filed: August 12, 2020
    Publication date: August 19, 2021
    Inventors: Susheela NARASIMHAN, Michal L. SABOTTA