Abstract: A method of assembling an integrated circuit component onto a substrate by the use of a polymer adhesive having fluxing properties and a specified adhesive strength and temperature control volumetric change which is greater than that of a solder to be used between terminals of the component to terminals of the substrate. In the method the uncured polymer adhesive is located between the circuit component and the substrate and as the second component moves into its site position upon the substrate, the uncured polymer adhesive is compressed and is displaced outwardly from between the body of the component and the substrate. In the method, as an exterior force is required to displace the adhesive in this manner, glass microspheres are provided within the adhesive to limit the movement of the integrated circuit components towards the substrate.

Abstract: An EMI shield for a component mounted upon a printed circuit board. The shield is an open sided box made from plastic insulating material supporting an electrically conductive shield layer. A surrounding flange is provided by the plastic at the open side of the box, the flange having a surface facing outwards in the same direction as the open side. The conductive shield layer extends onto the outward facing surface.