Patents by Inventor Micheal Miller

Micheal Miller has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20230409205
    Abstract: Disclosed herein are techniques for implementing high-throughput low-latency hybrid memory modules with improved data backup and restore throughput, enhanced non-volatile memory controller (NVC) resource access, and enhanced mode register setting programmability. Embodiments comprise a command replicator to generate sequences of one or more DRAM read and/or write and/or other commands to be executed in response to certain local commands from a non-volatile memory controller (NVC) during data backup and data restore operations. Other embodiments comprise an access engine to enable an NVC in a host control mode to trigger entry into a special mode and issue commands to access a protected register space. Some embodiments comprise a mode register controller to capture and store the data comprising mode register setting commands issued during a host control mode, such that an NVC can program the DRAM mode registers in an NVC control mode.
    Type: Application
    Filed: June 22, 2023
    Publication date: December 21, 2023
    Inventors: Aws Shallal, Micheal Miller, Stephen Horn
  • Publication number: 20050105281
    Abstract: An electronic module and method that enable circuitry required by one form of the module (e.g., a developmental unit) to be omitted in a second form of the module (e.g., a production unit), without necessitating additional changes in the module. The electronic module includes a motherboard, a multichip module (MCM) mounted to the motherboard, and a circuit unit connected to the MCM. The circuit unit comprises a flexible substrate, instrumentation circuitry mounted on the flexible substrate, and a connector coupled to the flexible substrate. The flexible substrate has signal lines that electrically communicate with the MCM, the instrumentation circuitry, and the connector. A portion of the flexible substrate is located between the MCM and the motherboard and permits electrical communication therebetween. The instrumentation circuitry does not occupy space on the motherboard.
    Type: Application
    Filed: November 13, 2003
    Publication date: May 19, 2005
    Inventors: Scott Brandenburg, Todd Oman, Micheal Miller