Patents by Inventor Micheal William Price

Micheal William Price has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20210221100
    Abstract: A laminated glass structure is provided that includes: a substrate, a flexible glass sheet, a buffer layer, a first adhesive and a second adhesive. The substrate has a thickness from about 2.5 mm to about 50 mm and primary surfaces. The buffer layer has a thickness from about 0.1 mm to about 2.5 mm and is laminated to the substrate with the first adhesive. The flexible glass sheet has a thickness of no greater than 0.3 mm and is laminated to the buffer layer with the second adhesive. Further, the buffer layer is characterized by an elastic modulus of at least 70 GPa and a coefficient of thermal expansion between about 4 and 25 ppm*° C.?1.
    Type: Application
    Filed: June 1, 2017
    Publication date: July 22, 2021
    Inventors: Dhananjay Joshi, Micheal William Price, James Ernest Webb, Chunhe Zhang