Patents by Inventor Micheal Wise

Micheal Wise has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Multi-Layer Electrode and Method of Forming the Same
    Publication number: 20080108203
    Abstract: An interconnect includes an opening formed in a dielectric layer. A conductive barrier is deposited in the opening, over which a first conductive layer is deposited. A conductive oxide is deposited over the first conductive layer, and a second conductive layer, formed from the same material as the first conductive layer, is deposited over the conductive liner.
    Type: Application
    Filed: January 10, 2008
    Publication date: May 8, 2008
    Inventors: Jingyu Lian, Chenting Lin, Nicolas Nagel, Micheal Wise