Patents by Inventor Michel Dautriche

Michel Dautriche has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Encapsulation package for electronic component
    Patent number: 5196651
    Abstract: A package for the encapsulation of an electronic component (50) includes a bottom (40), lateral faces (41) positioned around a main axis of the package and an open face (42) opposite the bottom (40). Each lateral face (41) includes guides (48) for guiding connection wires (45) of the component (50). These guides (48) are distributed evenly around the main axis of the package. The sides of the bottom (40) are equal.
    Type: Grant
    Filed: November 30, 1990
    Date of Patent: March 23, 1993
    Assignee: Compagnie Europeenne de Composants Electroniques LCC
    Inventors: Michel Pageaud, Michel Dautriche
  • Foil capacitor and method for the manufacture of such a capacitor
    Patent number: 5144523
    Abstract: Disclosed is a foil capacitor made by the stacking of metallized films. The multiple-layer type output plate has intermediate layers made of alloys of the layers that are contiguous to them. Also disclosed is a method for the manufacture of the capacitor, wherein the intermediate layers are formed by the spraying of molten metal.
    Type: Grant
    Filed: June 7, 1991
    Date of Patent: September 1, 1992
    Assignee: Compagnie Europeenne de Composants Electroniques LCC
    Inventors: Michel Pageaud, Michel Dautriche