Abstract: A sensor array for detecting particles, the sensor array comprising a substrate having a plurality of holes, a plurality of electronic sensor chips each having a sensor active region being sensitive to the presence of particles to be detected, and an electric contacting structure adapted for electrically contacting the plurality of electronic sensor chips, wherein the plurality of electronic sensor chips and/or the electric contacting structure are connected to the substrate in such a manner that the plurality of holes in combination with the plurality of electronic sensor chips and/or the electric contacting structure form a plurality of wells with integrated particle sensors.

Abstract: A biosensor assembly includes a fluidic system. A biosensor is positioned for direct contact with a fluid as the fluid flows through the fluidic system. An electrostatic discharge (ESD) electrode provides ESD protection for the biosensor. The ESD electrode can be engaged while the fluidic system of the assembly is primed, and then disengaged to prevent leakage currents from the fluid while the biosensor is in operation.

Abstract: A sensor array (100) for detecting particles, the sensor array (100) comprising a substrate (102) having a plurality of holes (104), a plurality of electronic sensor chips (106) each having a sensor active region (202) being sensitive to the presence of particles to be detected, and an electric contacting structure (110) adapted for electrically contacting the plurality of electronic sensor chips (106), wherein the plurality of electronic sensor chips (106) and/or the electric contacting structure (110) are connected to the substrate (102) in such a manner that the plurality of holes (104) in combination with the plurality of electronic sensor chips (106) and/or the electric contacting structure (110) form a plurality of wells with integrated particle sensors.

Abstract: A device and method for measuring a sensor chip with bond pads uses a plurality of conductive elements configured to be sufficiently rigid to penetrate oxidation on the bond pads to electrically connect to the bond pads of the sensor chip to exchange measurement information with the sensor chip.