Patents by Inventor Michel Despont
Michel Despont has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 11822289Abstract: Disclosed is a method including: a) obtaining a substrate extending in a predetermined plane with a first layer parallel to the plane; b) forming a through-hole in the first layer; c) depositing a second layer on the first, the second layer filling the a through-hole to form a bridge of material; d) etching a hairspring in an etching layer made up of the second layer or the substrate, the one of the second layer and the substrate in which the a hairspring is not etched constituting a support, the bridge of material connecting the hairspring to the support perpendicular to the predetermined plane; e) removing the first layer, the hairspring remaining attached to the support by the bridge of material; f) subjecting the hairspring to a thermal treatment; and g) detaching the hairspring from the support.Type: GrantFiled: February 21, 2019Date of Patent: November 21, 2023Assignee: CSEM CENTRE SUISSE D'ELECTRONIQUE ET DE MICROTECHNIQUE SA—RECHERCHE ET DEVELOPPEMENTInventors: Michel Despont, Frédéric Kohler, Olivier Hunziker, Jean-Luc Bucaille
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Patent number: 11809136Abstract: A micromechanical timepiece, and a method for making the same, having a plurality of mutually secured functional sub-assemblies stacked in a direction (Z) to form a multistage assembly, wherein each functional sub-assembly comprises a single semiconductor material and is secured to another sub-assembly via bridges made of the semiconductor material, and in that at least one sub-assembly comprises at least two portions, the portions being movable relative to each other and relative to another sub-assembly to which at least one of the portions is secured via at least one deformable link integrally formed between the portions.Type: GrantFiled: February 7, 2018Date of Patent: November 7, 2023Assignee: CSEM Centre Suisse d'Electronique et de Microtechnique SA—Recherche et DéveloppmentInventors: Michel Despont, Philippe Niedermann
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Publication number: 20230350346Abstract: A micromechanical timepiece, and a method for making the same, having a plurality of mutually secured functional sub-assemblies stacked in a direction (Z) to form a multistage assembly, wherein each functional sub-assembly comprises a single semiconductor material and is secured to another sub-assembly via bridges made of the semiconductor material, and in that at least one sub-assembly comprises at least two portions, the portions being movable relative to each other and relative to another sub-assembly to which at least one of the portions is secured via at least one deformable link integrally formed between the portions.Type: ApplicationFiled: March 30, 2023Publication date: November 2, 2023Inventors: Michel Despont, Philippe Niedermann
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Patent number: 11342149Abstract: The present invention provides an integrated electro-mechanical actuator and a manufacturing method for manufacturing such an integrated electro-mechanical actuator. The integrated electro-mechanical actuator comprises an electrostatic actuator gap between actuator electrodes and an electrical contact gap between contact electrodes. An inclination with an inclination angle is provided between the actuator electrodes and the contact electrodes. The thickness of this electrical contact gap is equal to the thickness of a sacrificial layer which is etched away in a manufacturing process.Type: GrantFiled: September 14, 2018Date of Patent: May 24, 2022Assignee: International Business Machines CorporationInventor: Michel Despont
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Publication number: 20200379408Abstract: Disclosed is a method including: a) obtaining a substrate extending in a predetermined plane with a first layer parallel to the plane; b) forming a through-hole in the first layer; c) depositing a second layer on the first, the second layer filling the a through-hole to form a bridge of material; d) etching a hairspring in an etching layer made up of the second layer or the substrate, the one of the second layer and the substrate in which the a hairspring is not etched constituting a support, the bridge of material connecting the hairspring to the support perpendicular to the predetermined plane; e) removing the first layer, the hairspring remaining attached to the support by the bridge of material; f) subjecting the hairspring to a thermal treatment; and g) detaching the hairspring from the support.Type: ApplicationFiled: February 21, 2019Publication date: December 3, 2020Inventors: Michel DESPONT, Frédéric KOHLER, Olivier HUNZIKER, Jean-Luc BUCAILLE
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Publication number: 20200050150Abstract: The present invention relates to a micromechanical timepiece (1) having a plurality of mutually secured functional sub-assemblies (1a, 1b) stacked in a direction (Z) to form a multistage assembly, characterised in that each functional sub-assembly (1a, 1b) consists of a single semiconductor material and is secured to another sub-assembly (1a, 1b) via bridges (5) made of said semiconductor material, and in that at least one sub-assembly (1a, 1b) comprises at least two portions (2, 3), said portions being movable relative to each other and relative to another sub-assembly (1a, 1b) to which at least one of said portions (2, 3) is secured via at least one deformable link integrally formed between said portions (2, 3). The invention also relates to a method for making such a timepiece.Type: ApplicationFiled: February 7, 2018Publication date: February 13, 2020Inventors: Michel Despont, Philippe Niedermann
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Publication number: 20190027331Abstract: The present invention provides an integrated electro-mechanical actuator and a manufacturing method for manufacturing such an integrated electro-mechanical actuator. The integrated electro-mechanical actuator comprises an electrostatic actuator gap between actuator electrodes and an electrical contact gap between contact electrodes. An inclination with an inclination angle is provided between the actuator electrodes and the contact electrodes. The thickness of this electrical contact gap is equal to the thickness of a sacrificial layer which is etched away in a manufacturing process.Type: ApplicationFiled: September 14, 2018Publication date: January 24, 2019Inventor: Michel Despont
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Patent number: 10079128Abstract: The present invention provides an integrated electro-mechanical actuator and a manufacturing method for manufacturing such an integrated electro-mechanical actuator. The integrated electro-mechanical actuator comprises an electrostatic actuator gap between actuator electrodes and an electrical contact gap between contact electrodes. An inclination with an inclination angle is provided between the actuator electrodes and the contact electrodes. The thickness of this electrical contact gap is equal to the thickness of a sacrificial layer which is etched away in a manufacturing process.Type: GrantFiled: January 2, 2013Date of Patent: September 18, 2018Assignee: International Business Machines CorporationInventor: Michel Despont
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Patent number: 9611134Abstract: A nano-electromechanical switch and a method for designing a nano-electromechanical switch. The nano-electromechanical switch includes at least one actuator electrode and a curved cantilever beam. The curved cantilever beam is adapted to flex in response to an activation voltage applied between the actuator electrode and the curved cantilever beam to provide an electrical contact between the curved cantilever beam and an output electrode of the nano-electromechanical switch. Before, during and after the curved cantilever beam flex in response to the activation voltage, a remaining gap between the curved cantilever beam and the actuator electrode is uniform.Type: GrantFiled: April 27, 2015Date of Patent: April 4, 2017Assignee: INTERNATIONAL BUSINESS MACHINES CORPORATIONInventors: Michel Despont, Daniel Grogg, Armin W. Knoll
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Patent number: 9297704Abstract: A method and circuit for determining a working temperature of a device, the method comprising: providing a first signal to a device having a temperature-sensitive characteristic; performing a function on the first signal by the device; demodulating a second signal output by the device to obtain a third signal thus generating a signal having reduced 1/f noise component; and based upon the first signal and the second signal, determining a working temperature of the device.Type: GrantFiled: January 20, 2014Date of Patent: March 29, 2016Assignee: International Business Machines CorporationInventors: Dan Corcos, Michel Despont, Danny Elad, Thomas Morf, Mehmet Soyuer
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Patent number: 9276578Abstract: A dynamic logic gate includes a nano-electro-mechanical-switch, preferably a four-terminal-nano-electro-mechanical-switch. The invention further refers to dynamic logic cascade circuits comprising such a dynamic logic gate. In particular, embodiments of the invention concern dynamic logic cascade circuits comprising single or dual rail dynamic logic gates.Type: GrantFiled: August 26, 2013Date of Patent: March 1, 2016Assignee: International Business Machines CorporationInventors: Michel Despont, Daniel Grogg, Christoph Hagleitner, Yu Pu
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Patent number: 9276579Abstract: A dynamic logic gate includes a nano-electro-mechanical-switch, preferably a four-terminal-nano-electro-mechanical-switch. The invention further refers to dynamic logic cascade circuits comprising such a dynamic logic gate. In particular, embodiments of the invention concern dynamic logic cascade circuits comprising single or dual rail dynamic logic gates.Type: GrantFiled: September 25, 2013Date of Patent: March 1, 2016Assignee: International Business Machines CorporationInventors: Michel Despont, Daniel Grogg, Christoph Hagleitner, Yu Pu
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Patent number: 9230564Abstract: In one general embodiment, a method is provided for fabricating magnetic structures using post-deposition tilting. A thin film magnetic transducer structure is formed on a substantially planar portion of a substrate such that a plane of deposition of the thin film transducer structure is substantially parallel to a plane of the substrate. Additionally, the thin film transducer structure is caused to tilt at an angle relative to the plane of the substrate. The thin film transducer is fixed at the angle after being tilted.Type: GrantFiled: June 25, 2012Date of Patent: January 5, 2016Assignee: GLOBALFOUNDRIES INC.Inventors: Robert Glenn Biskeborn, Laurent Dellmann, Michel Despont, Philipp Herget, Pierre-Olivier Jubert
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Patent number: 9171680Abstract: The present invention is directed to a nanoelectromechanical (NEM) switch comprising two electrodes (12, 18), wherein: at least one (18) of the electrodes comprises an active layer (10) thereon; and at least one (12) of the electrodes is movable along a given direction (z), from a: non-contact position to a contact position where one of the electrodes contacts the other one (18) of the electrodes, at the level of a contact point (P); and the active layer exhibits a conductive pathway (16), which pathway: extends along said given direction (z) to enable electrical conduction from one of the electrodes to the other one of the electrodes in the contact position; and is confined to a given region (R1) of the active layer, the region having nanoscale dimensions in a sectional plane (x, y) perpendicular to the given direction. The present invention is further directed to related devices, systems and methods.Type: GrantFiled: September 27, 2013Date of Patent: October 27, 2015Assignee: International Business Machines CorporationInventors: Daniel Grogg, Laurent A. Dellmann, Michel Despont, Abu Sebastian
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Publication number: 20150232324Abstract: A nano-electromechanical switch and a method for designing a nano-electromechanical switch. The nano-electromechanical switch includes at least one actuator electrode and a curved cantilever beam. The curved cantilever beam is adapted to flex in response to an activation voltage applied between the actuator electrode and the curved cantilever beam to provide an electrical contact between the curved cantilever beam and an output electrode of the nano-electromechanical switch. Before, during and after the curved cantilever beam flex in response to the activation voltage, a remaining gap between the curved cantilever beam and the actuator electrode is uniform.Type: ApplicationFiled: April 27, 2015Publication date: August 20, 2015Inventors: Michel Despont, Daniel Grogg, Armin W. Knoll
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Publication number: 20150204731Abstract: A method and circuit for determining a working temperature of a device, the method comprising: providing a first signal to a device having a temperature-sensitive characteristic; performing a function on the first signal by the device; demodulating a second signal output by the device to obtain a third signal thus generating a signal having reduced 1/f noise component; and based upon the first signal and the second signal, determining a working temperature of the device.Type: ApplicationFiled: January 20, 2014Publication date: July 23, 2015Applicant: International Business Machines CorporationInventors: Dan Corcos, Michel Despont, Danny Elad, Thomas Morf, Mehmet Soyuer
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Patent number: 9070578Abstract: The present invention is notably directed to an electromechanical switching device having: two electrodes, including: a first electrode, having layers of a first 2D layered material, which layers exhibit a first surface; and a second electrode, having layers of a second 2D layered material, which layers exhibit a second surface vis-à-vis said first surface; and an actuation mechanism, where: each of the first and second 2D layered materials is electrically conducting; and at least one of said two electrodes is actuatable by the actuation mechanism to modify a distance between the first surface and the second surface, such as to modify an electrical conductivity transverse to each of the first surface and the second surface and thereby enable current modulation between the first electrode and the second electrode.Type: GrantFiled: August 1, 2014Date of Patent: June 30, 2015Assignee: International Business Machines CorporationInventors: Michel Despont, Urs T. Duerig, Daniel Grogg, Armin W. Knoll, Elad Koren
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Patent number: 9055681Abstract: Techniques for producing a flexible structure attached to a device. One embodiment includes the steps of providing a first substrate, providing a second substrate with a releasably attached flexible structure, providing a bonding layer on at least one of the first substrate and the flexible structure, adjoining the first and second substrate such that the flexible structure is attached at the first substrate by means of the bonding layer, and detaching the second substrate in such a way that the flexible structure remains on the first substrate.Type: GrantFiled: July 15, 2012Date of Patent: June 9, 2015Assignee: International Business Machines CorporationInventors: Roger Dangel, Laurent Dellmann, Michel Despont, Bert Jan Offrein, Stefano Sergio Oggioni
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Patent number: 9055701Abstract: An improved alignment precision of Micro-Electromechanical Systems (MEMS). A method includes two parts of MEMS separated by at least one rolling element having a first diameter, where the rolling element is maintained on one of the two parts using a thermally dissipative material, horizontally aligning the two parts by pivoting one of the two parts about the rolling element, and locking the two parts together.Type: GrantFiled: March 13, 2013Date of Patent: June 9, 2015Assignee: International Business Machines CorporationInventors: Stefano S. Oggioni, Michel Despont, Mark Lantz, Thomas Albrecht
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Patent number: 9041499Abstract: A nano-electromechanical switch and a method for designing a nano-electromechanical switch. The nano-electromechanical switch includes at least one actuator electrode and a curved cantilever beam. The curved cantilever beam is adapted to flex in response to an activation voltage applied between the actuator electrode and the curved cantilever beam to provide an electrical contact between the curved cantilever beam and an output electrode of the nano-electromechanical switch. Before, during and after the curved cantilever beam flex in response to the activation voltage, a remaining gap between the curved cantilever beam and the actuator electrode is uniform.Type: GrantFiled: December 6, 2012Date of Patent: May 26, 2015Assignee: INTERNATIONAL BUSINESS MACHINES CORPORATIONInventors: Michel Despont, Daniel Grogg, Armin W. Knoll