Patents by Inventor Michel DEVERS

Michel DEVERS has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20230100750
    Abstract: An electronic device includes an electronic die in a package and a heat diffusion element. The heat diffusion element is made of a thermally-conductive material and is formed of a single block (unitary body) that includes: a main portion resting on at least a portion of an upper surface of the electronic die; at least one secondary portion flush with an upper surface of the package; and at least one intermediate portion coupling the main portion to the at least one secondary portion.
    Type: Application
    Filed: September 15, 2022
    Publication date: March 30, 2023
    Applicant: STMicroelectronics (Grenoble 2) SAS
    Inventor: Michel DEVERS