Abstract: Centering device for inserting pins in a multipin housing designed to receive an integrated circuit, whose pins are in the form of stems fitted with flat heads. The stem goes through a plane part, called the housing substrate, through holes which have first been metallized, with the pins protruding from one of the faces of the substrate by a length sufficient to ensure the fastening of the housing. The flat head bears upon the other face of the substrate via a metal preform of an alloy which is suitable for ensuring the fusion or melting for fastening the pins. This centering device consists of three parts. The first part is formed by a first metallic plate; the second part is formed by a second metallic plate used for calibrating the centering of the pins, said metallic plate being drilled with holes arranged in a geometrical pattern in compliance with the pattern chosen for the arrangement of the pins on the housing and calibrated so as to hold and to center the stems in the housing holes.

Abstract: The invention relates to a coupler for connecting optical fibers and electro-optical elements by means of a flexible polyimide substrate which is provided with a hole for positioning the fiber. The substrate is also provided with small metallized holes, covered with a metal bump, for connection of the electro-optical element.

Abstract: Method of providing metal bumps on an apertured substrate and substrate having metal bumps.

Abstract: A method for manufacturing a lead-through of a metal element consisting of a fernico alloy through a component of ceramic material. A suspension is supplied of glass powder having molar percentage compositions within defined limits. The suspension is deposited on the ceramic material at the area of the lead-through and the assembly is heated for several minutes in an nitrogen atmosphere at a temperature near 1000.degree. C. followed by cooling of the assembly to room temperature.