Abstract: The invention relates to a housing for an electronic device including a ceramic substrate 120 on which a multilayer circuit 110 is deposited by screen-printing. The circuit serves to bring about the connection between the terminals 7 of the electronic device and mounting pins 2 of the housing, which are provided in metallized holes in the substrate. The holes are provided with conducting rings (11 and 12) by means of screen-printing the conducting layers are formed from a compound which can be screen-printed and which comprises, at least, copper and a vitreous-crystalline material. This compound is to be fired in a neutral atmosphere at a temperature which is lower than the melting temperature of copper.

Abstract: A method of manufacturing a moulded body, such as an aerial, of a plastic material covered with a metallic layer according to which an intermediate layer for facilitating removal from the mould has been previously formed on the surface of the mould. The metallic layer is deposited in the mould before the plastic material is introduced. The mould (3 and 4) is metallic, and the intermediate layer is formed by passivation of the metal. A metallic coating layer (15) is then deposited in the mould by an electrolytic method and the plastic material (50) is introduced into the mould thus prepared. Finally, after hardening of the plastic material removal from the mould is effected by applying a thermal treatment.

Abstract: A portable identifying element has the general shape of a laminated credit card, and comprises a front sheet (6), a central sheet (1) and a rear sheet (6'), all of plastic material. An active electronic circuit (3) is positioned within a cavity (2) of the central sheet. A thin layer of copper (7) is juxtaposed with the electronic circuit between the front sheet and rear sheet for removing heat dissipated within the circuit.