Patents by Inventor Michel Lebailly

Michel Lebailly has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Carrier for a card carrying electronic components and of low heat resistance
    Patent number: 5404272
    Abstract: A carrier for a printed circuit board or card on which electronic components are mounted, the carrier making it possible to disperse an increased quantity of heat given off by the components in the direction of an energy dissipating frame with which the carrier is in contact. The carrier comprises two flat parallel metal plates of identical perimeter defining between them a space which is entirely closed along the perimeter, the space containing a porous metallic material in contact with the plates, and being partially filled by a liquid which evaporates at the working temperature of the carrier.
    Type: Grant
    Filed: February 14, 1994
    Date of Patent: April 4, 1995
    Assignee: Transcal
    Inventors: Michel Lebailly, Jean-Claude Taverdet
  • Electronic device including a passive electronic component
    Patent number: 5347426
    Abstract: An electronic device comprising at least one heat-generating electronic component and a passive electronic component in association with the heat generating component. The passive component comprises a porous preform of green silicon carbide or polygranular graphite, and a metal filling the porosities of the preform which can be aluminum, an aluminum alloy, magnesium or a magnesium alloy. The preform forms about 50 to 90% by volume of the passive component.
    Type: Grant
    Filed: September 9, 1993
    Date of Patent: September 13, 1994
    Assignee: Pechiney Recherche
    Inventors: Salim Dermarkar, Xavier Dumant, Michel Lebailly
  • Housing carrier for integrated circuit
    Patent number: 4568796
    Abstract: The present invention concerns a housing carrier for an integrated circuit.It comprises at least two rows of output conductors disposed at regular intervals on the periphery of a housing along a given pitch, these conductors presenting end parts extending from the housing with a view to electrically connecting the housing on an utilization circuit, and wherein the rows are staggered with respect to one another.
    Type: Grant
    Filed: December 29, 1983
    Date of Patent: February 4, 1986
    Assignee: LCC.CICE-Compagnie Europenne de Composants Electroniques
    Inventors: Michel Lebailly, Bernard Lacruche
  • Package providing high heat dissipation, in particular for microelectronics
    Patent number: 4563541
    Abstract: A package of the flatpack type for microelectronic circuits comprises a metal base of material having good heat conductivity on which a metal frame is mounted by means of a hard brazing alloy. The frame has the function of supporting connections by means of insulating lead-in bushings of the glass bead type. The coefficient of expansion of the frame and of the base are matched so as to ensure that the base of the package does not exhibit any defect of surface planarity after cooling.
    Type: Grant
    Filed: January 3, 1984
    Date of Patent: January 7, 1986
    Assignee: L.C.C.-C.I.C.E.-Compagnie Europeenne de Composants Electroniques
    Inventors: Michel Lebailly, Maurice Jacquemin