Abstract: The invention relates to circuit breaker apparatus for a high- or medium-voltage direct current network, the circuit breaker apparatus comprising a branch (A-A?) with a mechanical circuit breaker (S1) inserted in the network line, and, connected in parallel therewith, firstly a lightning arrestor (5) branch, and secondly a series connection of a first capacitor bank (C), a make switch (S2), and an inductor. According to the invention, the circuit breaker apparatus includes at least one resistive voltage divider (Rs) connected to the network voltage and presenting a low voltage stage (R1s) connected in parallel with the capacitor bank (C) in order to charge the capacitor bank.

Abstract: A power converter enclosure, intended in particular to equip a rail vehicle traction system including power electronic modules comprising one or more power semiconductor components mounted on a substrate, includes a base including a bottom panel with double walls having an inside wall on the side toward the interior of the enclosure in contact with at least one substrate supporting a power component. The bottom panel is extended by at least two lateral panels with double walls whose outside walls are cooled by cooling fins. The two walls of the bottom panel delimit a hollow volume partly filled with a cooling liquid and containing a thermally conductive permeable material providing a thermal bridge between the two walls.

Abstract: A power converter enclosure, intended in particular to equip a rail vehicle traction system including power electronic modules comprising one or more power semiconductor components mounted on a substrate, includes a base including a bottom panel with double walls having an inside wall on the side toward the interior of the enclosure in contact with at least one substrate supporting a power component. The bottom panel is extended by at least two lateral panels with double walls whose outside walls are cooled by cooling fins. The two walls of the bottom panel delimit a hollow volume partly filled with a cooling liquid and containing a thermally conductive permeable material providing a thermal bridge between the two walls.

Abstract: The power electric component comprises first and second heat transfer and electrical insulation composite structures and at least one power semiconductor circuit which has connecting terminals. The first composite structure includes respective conductive or semiconductor layers adjacent to the semiconductor circuit and conductive or semiconductor layers opposite to the semiconductor circuit. The connecting terminals are attached on the side opposite the first composite structure to a plane array of mutually insulated conductive members, wherein the array is integrated into the second composite structure which includes a conductive or semiconductor layer opposite to the semiconductor circuit. The opposite layer of at least the first composite structure or the second composite structure includes flow passages for a heat transfer fluid so that the component can be cooled from its top and bottom faces.

Abstract: The device comprises a conductive substrate on which rests a first plane arrangement of semiconductor circuits formed by diodes and IGBT having connecting terminals. The device comprises at least one second plane arrangement of semiconductor circuits, two adjacent plane arrangements being separated by a plane conductor array comprising at least one electrically conductive and heat dissipative busbar connected to terminals of circuits of a first arrangement, said busbar further supporting circuits of a second plane arrangement, at least one conductive member electrically insulated from said busbar being connected to other terminals of the circuits of said first arrangement and being disposed within the volume of said busbar.

Abstract: The invention relates to the encapsulation of integrated circuits, and more particularly encapsulation in a multi-layer ceramic case. In order to permit the disposition of chips of variable size on a monolithic chip (22, 24, 26) reception site (23, 25, 27) without the risk of having excessively long connection wires between the chip and the conductive regions (44) surrounding the reserved site, it is proposed according to the invention to cover the chip-reception site with a number of mutually insulated conductive contacts which can serve as soldering relays for these connection wires (80, 90, 100). If the chip is large (chip 24) it is bonded or soldered to these contacts; if it is small (chip 22) it is surrounded by relay-contacts.

Abstract: A device for reducing dynamic impedances in a molded case integrated circuit comprises a chip (15) and several annular metal planes (21, 22) separated from each other by an insulating film (27, 28), each plane comprising, on its external border, legs (23, 24) coupled to the exterior of the case and, on its internal border, legs (25, 26) coupled to pads of the chip (15). The legs (23-26) are connected to the exterior and to the pads of the chip through leads (20) of a conventional connection network.

Abstract: A furnace for soldering integrated circuit chips on a ceramic substrate has a heating plate supporting the substrate, the plate comprising perforations at the places where the integrated circuit chips will be soldered, behind the plate, a heat radiation source and a device to direct the radiation as desired towards only one of the apertures of the plate at a time.