Patents by Inventor Michel PELLAT

Michel PELLAT has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Method for manufacturing a handle substrate for the temporary bonding of a substrate
    Patent number: 9934995
    Abstract: This process includes steps: a) providing a carrier substrate including a receiving face; b) depositing a nonstick coating on the receiving face, the nonstick coating including a central region and a peripheral region; and c) trimming the carrier substrate so as to remove the peripheral region of the nonstick coating and to form a recess on the periphery of the carrier substrate, in order to obtain the handle wafer. Also relates to a process for temporarily bonding a substrate to a handle wafer fabricated using the process described above. Furthermore relates to a handle wafer fabricated using the process described above.
    Type: Grant
    Filed: December 15, 2014
    Date of Patent: April 3, 2018
    Assignee: COMMISSARIAT À L'ENERGIE ATOMIQUE ET AUX ENERGIES ALTERNATIVES
    Inventors: Pierre Montmeat, Laurent Bally, Frank Fournel, Michel Pellat
  • Method of transforming an electronic device
    Patent number: 9824912
    Abstract: There is provided a method for transforming an electronic device from an initial state, wherein the device includes a first substrate and a second substrate, the first and second substrates being joined by means of a bonding interfaced using their respective first faces, wherein the first substrate includes at least one cavity, produced using the first face of the first substrate, the cavity including a bottom bordered by at least one peripheral region and being at least partially filled with a buffer layer, in the bottom of the cavity, and wherein the first face of the second substrate is at least partly opposite the cavity of the first substrate. The method also includes a step of removing the bottom of the cavity of the first substrate from a first face, opposite to the first face of the first substrate.
    Type: Grant
    Filed: December 16, 2015
    Date of Patent: November 21, 2017
    Assignee: COMMISSARIAT A L'ENERGIE ATOMIQUE ET AUX ENERGIES ALTERNATIVES
    Inventors: Michel Pellat, Franck Fournel, Pierre Montmeat
  • A METHOD FOR MANUFACTURING A HANDLE SUBSTRATE FOR THE TEMPORARY BONDING OF A SUBSTRATE
    Publication number: 20170025301
    Abstract: This process includes steps: a) providing a carrier substrate including a receiving face; b) depositing a nonstick coating on the receiving face, the nonstick coating including a central region and a peripheral region; and c) trimming the carrier substrate so as to remove the peripheral region of the nonstick coating and to form a recess on the periphery of the carrier substrate, in order to obtain the handle wafer. Also relates to a process for temporarily bonding a substrate to a handle wafer fabricated using the process described above. Furthermore relates to a handle wafer fabricated using the process described above.
    Type: Application
    Filed: December 15, 2014
    Publication date: January 26, 2017
    Applicant: COMMISSARIAT À L'ENERGIE ATOMIQUE ET AUX ENERGIES ALTERNATIVES
    Inventors: Pierre MONTMEAT, Laurent BALLY, Frank FOURNEL, Michel PELLAT
  • METHOD OF TRANSFORMING AN ELECTRONIC DEVICE
    Publication number: 20160181139
    Abstract: There is provided a method for transforming an electronic device from an initial state, wherein the device includes a first substrate and a second substrate, the first and second substrates being joined by means of a bonding interfaced using their respective first faces, wherein the first substrate includes at least one cavity, produced using the first face of the first substrate, the cavity including a bottom bordered by at least one peripheral region and being at least partially filled with a buffer layer, in the bottom of the cavity, and wherein the first face of the second substrate is at least partly opposite the cavity of the first substrate. The method also includes a step of removing the bottom of the cavity of the first substrate from a first face, opposite to the first face of the first substrate.
    Type: Application
    Filed: December 16, 2015
    Publication date: June 23, 2016
    Applicant: Commissariat a L'Energie Atomique et aux Energies Alternatives
    Inventors: Michel PELLAT, Franck Fournel, Pierre Montmeat