Abstract: A layout for devices under test formed on a semiconductor wafer for use in wafer testing includes a first array of devices under test and a first pad set formed adjacent to the first array. The first pad set includes a gate force pad, a source pad, and a drain pad. Each of the devices under test in the first array is connected to the gate pad of the first pad set. Each of the devices under test in the first array is connected to the source pad of the first pad set. Each of the devices under test in the first array is connected to the drain pad of the first pad set.

Abstract: A layout for devices under test formed on a semiconductor wafer for use in wafer testing includes a first array of devices under test and a first pad set formed adjacent to the first array. The first pad set includes a gate force pad, a source pad, and a drain pad. Each of the devices under test in the first array is connected to the gate pad of the first pad set. Each of the devices under test in the first array is connected to the source pad of the first pad set. Each of the devices under test in the first array is connected to the drain pad of the first pad set.

Abstract: An integrated circuit is designed to improve yield when manufacturing the integrated circuit, by obtaining a design element from a set of design elements used in designing integrated circuits. A variant design element is created based on the obtained design element, where a feature of the obtained design element is modified to create the variant design element. A yield to area ratio for the variant design element is determined. If the yield to area ratio of the variant design element is greater than a yield to area ratio of the obtained design element, the variant design element is retained to be used in designing the integrated circuit.

Abstract: A layout for devices under test formed on a semiconductor wafer for use in wafer testing includes a first array of devices under test and a first pad set formed adjacent to the first array. The first pad set includes a gate force pad, a source pad, and a drain pad. Each of the devices under test in the first array is connected to the gate pad of the first pad set. Each of the devices under test in the first array is connected to the source pad of the first pad set. Each of the devices under test in the first array is connected to the drain pad of the first pad set.

Abstract: An integrated circuit is designed to improve yield when manufacturing the integrated circuit, by obtaining a design element from a set of design elements used in designing integrated circuits. A variant design element is created based on the obtained design element, where a feature of the obtained design element is modified to create the variant design element. A yield to area ratio for the variant design element is determined.

Abstract: A sensing circuit for sensing a memory cell, the sensing circuit having a first circuit branch electrically connectable to the memory cell to receive a memory cell current, the first circuit branch having at least one first transistor that, when the first circuit branch is connected to the memory cell, is coupled thereto substantially in a cascode configuration. A bias current generator is operatively associated with the first transistor for forcing a bias current to flow therethrough.

Abstract: A sensing circuit for sensing a memory cell, the sensing circuit having a first circuit branch electrically connectable to the memory cell to receive a memory cell current, the first circuit branch having at least one first transistor that, when the first circuit branch is connected to the memory cell, is coupled thereto substantially in a cascode configuration. A bias current generator is operatively associated with the first transistor for forcing a bias current to flow therethrough.