Abstract: A microlens structure is mounted directly onto the upper surface of a packaged VCSEL device and positioned to locate microlenses directly over corresponding VCSEL elements. The microlens structure includes a block-like pedestal having a lower surface that faces the upper surface of the VSCEL device. The microlenses are formed in a central region of the lower surface, and several legs (stand-offs) extend from peripheral edges of the lower surface. During assembly, the VCSEL device is positioned under the microlens structure such that each microlens is aligned over its corresponding VCSEL element, and then raised until the legs contact the upper surface of the VCSEL device. The legs serve to self-align the microlenses to the VCSEL device, and are sized to maintain an optimal distance between the microlenses and the VCSEL elements. The pedestal is attached to a carrier plate that is secured to an IC package housing the VCSEL device.

Abstract: Wafer scale fabrication of three dimentional substantially enclosed structures on a MEMS/IC die use a combination of electrodeposition of structural and sacrificial layers and flip-chip alignment and bonding technology. A first wafer contains a die with MEMS and/or IC structures. On this MEMS/IC processed die, a first three dimensional structural component is formed using standard lithographic processes and electrodeposition of a structural layer. A second sacrificial wafer is separately processed using similar lithographic and electrodeposition processes to form a corresponding second three dimensional structural component. The wafers are placed in a flip-chip bonder and aligned. Once aligned, the structural components are bonded together. The bonded wafers are then removed from the bonder and the second sacrificial wafer substrate removed. The resultant die includes a three dimensional structural component with a substantially enclosed cavity as well as MEMS and IC elements.

Abstract: Mechanical and/or structural devices are formed using electroplating techniques in conjunction with sacrifical materials that can also be formed using electroplated techniques. This can produce devices that are attached at only selected points to a substrate and/or structures having enclosed cavities on or above a working substrate. A particularly relevant use of such structure forming techniques is in the fabrication of an ink jet manifold and nozzle structure for use in an ink jet print head, particularly a MEMS-based ink jet print head.

Abstract: Fluidic conduits, which can be used in microarraying systems, dip pen nanolithography systems, fluidic circuits, and microfluidic systems, are disclosed that use channel spring probes that include at least one capillary channel. Formed from spring beams (e.g., stressy metal beams) that curve away from the substrate when released, channels can either be integrated into the spring beams or formed on the spring beams. Capillary forces produced by the narrow channels allow liquid to be gathered, held, and dispensed by the channel spring probes. Because the channel spring beams can be produced using conventional semiconductor processes, significant design flexibility and cost efficiencies can be achieved.

Abstract: A data transmission interconnect assembly capable of transmission speeds in excess of 40 Gbps in which, for example, a line-card is detachably coupled to a backplane using flexible flat cables that are bent to provide a continuous, smooth curve between the connected boards, and connected by a connection apparatus that employs cable-to-cable interface members that are transparent to the transmitted signal waves. Microspring interface members are formed on the contact structure pressed against the cables to provide interface arrangements that are smaller than a wavelength of the transmitted signal. A connector apparatus uses a cam mechanism to align the cables, and then to press the contact structure, having the microspring interface members formed thereon, against the cables. An alterative contact structure uses anisotropic conductive film.

Abstract: A MEMS system including a fixed electrode and a suspended moveable electrode that is controllable over a wide range of motion. In traditional systems where an fixed electrode is positioned under the moveable electrode, the range of motion is limited because the support structure supporting the moveable electrode becomes unstable when the moveable electrode moves too close to the fixed electrode. By repositioning the fixed electrode from being directly underneath the moving electrode, a much wider range of controllable motion is achievable. Wide ranges of controllable motion are particularly important in optical switching applications.

Abstract: A data transmission interconnect assembly (e.g., a router) capable of transmission speeds in excess of 40 Gbps in which a line-card is detachably coupled to a backplane using flexible flat cables that are bent to provide a continuous, smooth curve between the connected boards, and connected by a connection apparatus that employs cable-to-cable interface members that are transparent to the transmitted signal waves. Microspring contact structures are formed on the cables, or on a contact structure pressed against the cables, to provide interface arrangements that are smaller than a wavelength of the transmitted signal. A connector apparatus uses a cam mechanism to align the cables, and then to press a contact structure, having micro spring interface members formed thereon, against the cables. An alterative contact structure uses anisotropic conductive film.