Patents by Inventor Michel Streel
Michel Streel has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20230243058Abstract: The present invention provides an electrodeposited copper foil suitable for a lithium-ion secondary battery, in which a tensile strength in an ordinary state is 50 kgf/mm2 or more and a tensile strength after continuous heat treatment at 190° C. for 24 hours is 35 to 30 kgf/mm2.Type: ApplicationFiled: July 19, 2022Publication date: August 3, 2023Applicant: Circuit Foil LuxembourgInventors: THOMAS DEVAHIF, MICHEL STREEL
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Patent number: 11639557Abstract: A composite copper foil contains a carrier layer, a release layer and an ultra-thin copper layer in this order. In the composite copper foil, the release layer includes a binary alloy or a ternary alloy comprising nickel, and is formed into an amorphous layer, and the ultra-thin copper layer is peelable from the carrier layer. A method of fabricating the composite copper foil includes preparing a carrier layer, forming a release layer which is amorphous on the carrier layer by electroplating using an electrolyte that comprises nickel, and forming an ultra-thin copper layer on the release layer by electroplating.Type: GrantFiled: February 28, 2019Date of Patent: May 2, 2023Assignee: Circuit Foil LuxembourgInventors: Zainhia Kaidi, Thomas Devahif, Adrien Kersten, Michel Streel
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Publication number: 20220127743Abstract: A composite copper foil contains a carrier layer, a release layer and an ultra-thin copper layer in this order. In the composite copper foil, the release layer includes a binary alloy or a ternary alloy comprising nickel, and is formed into an amorphous layer, and the ultra-thin copper layer is peelable from the carrier layer. A method of fabricating the composite copper foil includes preparing a carrier layer, forming a release layer which is amorphous on the carrier layer by electroplating using an electrolyte that comprises nickel, and forming an ultra-thin copper layer on the release layer by electroplating.Type: ApplicationFiled: February 28, 2019Publication date: April 28, 2022Applicant: Circuit Foil LuxembourgInventors: Zainhia KAIDI, Thomas DEVAHIF, Adrien KERSTEN, Michel STREEL
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Publication number: 20210371997Abstract: Disclosed herein relates to a copper foil having a low roughness property by roughening a matte side, wherein a thickness of the copper foil is from 5 ?m to 70 ?m, and profilometer-measured mean roughness of the roughened surface of the copper foil is from 0.5 ?m to 2.0 ?m, and wherein profilometer-measured mean roughness Rz JIS of the roughened matte side of the copper foil is lower than that of a shiny side of the copper foil. The copper foil provided in the present invention has excellent adhesion with a resin and an electrical property while having low roughness through surface roughening.Type: ApplicationFiled: July 31, 2017Publication date: December 2, 2021Applicant: Circuit Foil Luxembourg, SarlInventors: Thomas DEVAHIF, Michel STREEL, Zainhia KAIDI
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Publication number: 20210368628Abstract: A copper-clad laminate including at least one of a copper layer having a roughened surface is disclosed. The copper-clad laminate is obtained by roughening at least one surface of a base copper layer so as to have a low profile comprising a copper layer having a thickness of from 5 ?m to 70 ?m and a resin layer on the copper layer, wherein a peeling strength between the copper layer and the resin layer is more than 0.6 N/mm when the thickness of the copper layer is more than 5 ?m, wherein a ten-point mean roughness Sz of the roughened surface is lower than that of the base copper layer.Type: ApplicationFiled: July 31, 2017Publication date: November 25, 2021Applicant: Circuit Foil Luxembourg, SàrlInventors: Thomas DEVAHIF, Michel STREEL, Zainhia KAIDI
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Publication number: 20210298213Abstract: A surface-treated copper foil, which is excellent in adhesiveness with an insulating substrate for a high-frequency circuit, and particularly is capable of producing a copper clad laminate where occurrence of blisters are suppressed even when a thermal load due to high temperature press-working is applied. More particularly, it is a surface-treated copper foil for a high-frequency circuit having a heat resisting treated layer formed on a copper foil of 35 ?m or less in thickness, in which the heat resisting treated layer is characterized by a film including a quaternary metal oxide of chromium, molybdenum, zinc, and nickel and a compound thereof, characterizes the present invention.Type: ApplicationFiled: February 25, 2021Publication date: September 23, 2021Applicant: Circuit Foil LuxembourgInventors: ROMAN MICHEZ, Thomas DEVAHIF, Zainhia Kaidi, Michel Streel
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Patent number: 7153590Abstract: A composite copper foil (10) comprises a carrier foil (12) formed by electrodeposition onto a cathode, the carrier foil (12) having a cathode side formed in contact with the cathode and an opposite electrolyte side. A very thin release layer (14) is on the electrolyte side of said carrier foil (12). A thin functional foil (16) formed by deposition of copper has a front side in contact with the release layer (14) and an opposite back side. The electrolyte side of the carrier foil (12) has a surface roughness Rz less than or equal to 3.5 ?m. There is also presented a method for manufacturing such a composite copper foil.Type: GrantFiled: January 18, 2001Date of Patent: December 26, 2006Assignee: Circuit Foil Luxembourg Trading S.a.R.L.Inventors: Raymond Gales, René Lanners, Michel Streel, Akitoshi Suzuki
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Patent number: 7049007Abstract: A peelable composite foil includes a metallic carrier foil, a first barrier layer on one side of the metallic carrier and a second metallic layer on the first barrier layer. The second metallic layer includes a combination of a metal selected from the group including zinc, molybdenum, antimony and tungsten, and an electrodeposited, ultra-thin metal foil on the second metallic layer.Type: GrantFiled: July 10, 2002Date of Patent: May 23, 2006Assignee: Circuit Foil Luxembourg SarlInventors: Raymond Gales, Michel Streel, Rene Lanners
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Publication number: 20040209106Abstract: A peelable composite foil includes a metallic carrier foil, a first barrier layer on one side of the metallic carrier and a second metallic layer on the first barrier layer. The second metallic layer includes a combination of a metal selected from the group including zinc, molybdenum, antimony and tungsten, and an electrodeposited, ultra-thin metal foil on the second metallic layer.Type: ApplicationFiled: January 16, 2004Publication date: October 21, 2004Inventors: Raymond Gales, Michel Streel, Rene Lanners
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Publication number: 20030012975Abstract: A composite copper foil (10) comprises a carrier foil (12) formed by electrodeposition onto a cathode, the carrier foil (12) having a cathode side formed in contact with the cathode and an opposite electrolyte side. A very thin release layer (14) is on the electrolyte side of said carrier foil (12). A thin functional foil (16) formed by deposition of copper has a front side in contact with the release layer (14) and an opposite back side. The electrolyte side of the carrier foil (12) has a surface roughness Rz less than or equal to 3.5 &mgr;m. There is also presented a method for manufacturing such a composite copper foil.Type: ApplicationFiled: August 19, 2002Publication date: January 16, 2003Inventors: Raymond Gales, Rene ` Lanners, Michel Streel, Akitoshi Suzuki
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Patent number: 5834140Abstract: The present invention is an electrodeposited copper foil characterised in that roughening treatment is performed on a matte side of an untreated copper foil wherein the surface roughness R.sub.z of the matte side of the untreated copper foil is the same as or less than the surface roughness R.sub.z of the shiny side of this untreated copper foil. The electrodeposited copper foil is made by electrodepositing copper onto a drum from an electrolyte which contains 0.05 to 5 ppm 3-mercapto 1-propanesulfonate; at least one organic compound selected from 0.1 to 15 ppm of a polysaccharide which is a carbohydrate such as starches, celluloses and vegetable rubbers, and 0.3 to 35 ppm of a low molecular weight glue having a weight average molecular weight of 10,000 or less; and 10 to 60 ppm of a chloride ion. The copper foil may be used in making a printed circuit board or as a component of a secondary battery cell.Type: GrantFiled: September 18, 1996Date of Patent: November 10, 1998Assignee: Circuit Foil Japan Co., Ltd.Inventors: Adam M. Wolski, Michel Streel, Akitoshi Suzuki, Hideo Otsuka
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Patent number: 5207889Abstract: An improved treatment for copper foil comprising electrodepositing a metallic barrier layer of copper, zinc and antimony on at least one side of the foil which, preferably, has a matte surface formed prior to forming the barrier layer. The so-treated foil provides a high bonding strength when laminated to polymeric substrates and resists undercutting by mineral acid etchants and rinses during production of printed circuit boards.Type: GrantFiled: January 16, 1991Date of Patent: May 4, 1993Assignee: Circuit Foil USA, Inc.Inventors: Adam M. Wolski, Laurette M. Maguet, Michel Streel