Patents by Inventor Michel Varrot

Michel Varrot has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Integrated circuit connecting pad
    Patent number: 6822329
    Abstract: Each connecting pad includes a continuous top metal layer on the top metallization level and having on its top face an area for welding a connecting wire. Also, the pad has a reinforcing structure under the welding area and includes at least one discontinuous metal layer on the immediately next lower metallization level, metal vias connecting the discontinuous metal layer to the bottom surface of the top metal layer, and an isolating cover covering the discontinuous metal layer and its discontinuities as well as the inter-via spaces between the two metallic layers.
    Type: Grant
    Filed: May 14, 2002
    Date of Patent: November 23, 2004
    Assignee: STMicroelectronics SA
    Inventors: Michel Varrot, Guillaume Bouche, Roberto Gonella, Eric Sabouret
  • Integrated circuit connecting pad
    Publication number: 20020179991
    Abstract: Each connecting pad includes a continuous top metal layer on the top metallization level and having on its top face an area for welding a connecting wire. Also, the pad has a reinforcing structure under the welding area and includes at least one discontinuous metal layer on the immediately next lower metallization level, metal vias connecting the discontinuous metal layer to the bottom surface of the top metal layer, and an isolating cover covering the discontinuous metal layer and its discontinuities as well as the inter-via spaces between the two metallic layers.
    Type: Application
    Filed: May 14, 2002
    Publication date: December 5, 2002
    Applicant: STMicroelectronics S.A.
    Inventors: Michel Varrot, Guillaume Bouche, Roberto Gonella, Eric Sabouret