Patents by Inventor Michele Berry

Michele Berry has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Encapsulation of pin solder for maintaining accuracy in pin position
    Publication number: 20050275094
    Abstract: Solder joints coupling pins to a microelectronic package substrate are enshrouded with an encapsulation material. In this manner, pin movement is limited even if the pin solder subsequently melts.
    Type: Application
    Filed: July 23, 2003
    Publication date: December 15, 2005
    Inventor: Michele Berry
  • Packaging microelectromechanical structures
    Publication number: 20050062120
    Abstract: A MEMS device may be formed in a hermetic cavity by sealing a pair of semiconductor structures to one another, enclosing the MEMS device. The two structures may be coupled using surface mount techniques as one example, so that the temperatures utilized may be compatible with many MEMS applications. Electrical interconnection layers in one or the other of these structures may be utilized to allow electrical interconnections from the exterior world to the MEMS components within the cavity.
    Type: Application
    Filed: November 3, 2004
    Publication date: March 24, 2005
    Inventors: Qing Ma, Valluri Rao, John Heck, Daniel Wong, Michele Berry
  • Packaging microelectromechanical structures
    Patent number: 6852926
    Abstract: A MEMS device may be formed in a hermetic cavity by sealing a pair of semiconductor structures to one another, enclosing the MEMS device. The two structures may be coupled using surface mount techniques as one example, so that the temperatures utilized may be compatible with many MEMS applications. Electrical interconnection layers in one or the other of these structures may be utilized to allow electrical interconnections from the exterior world to the MEMS components within the cavity.
    Type: Grant
    Filed: March 26, 2002
    Date of Patent: February 8, 2005
    Assignee: Intel Corporation
    Inventors: Qing Ma, Valluri Rao, John Heck, Daniel Wong, Michele Berry
  • Packaging microelectromechanical structures
    Publication number: 20030183407
    Abstract: A MEMS device may be formed in a hermetic cavity by sealing a pair of semiconductor structures to one another, enclosing the MEMS device. The two structures may be coupled using surface mount techniques as one example, so that the temperatures utilized may be compatible with many MEMS applications. Electrical interconnection layers in one or the other of these structures may be utilized to allow electrical interconnections from the exterior world to the MEMS components within the cavity.
    Type: Application
    Filed: March 26, 2002
    Publication date: October 2, 2003
    Inventors: Qing Ma, Valluri Rao, John Heck, Daniel Wong, Michele Berry