Patents by Inventor Michele Haler

Michele Haler has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Wafer carrier
    Patent number: 7008308
    Abstract: A wafer carrier for retaining at least one semiconductor wafer in a processing apparatus during a processing operation which removes wafer material by at least one of abrading and chemical reaction. The processing apparatus is adapted for removing wafer material from a front side and a back side of each wafer simultaneously. The carrier includes a plate including wafer contaminating material and having an opening and a thickness. An insert has a thickness and is disposed in the opening for receiving at least one wafer and engaging a peripheral edge of the wafer to hold the wafer as the carrier rotates. The thickness of the insert is significantly greater than the thickness of the plate to inhibit removal of material from the plate and thereby inhibit bulk metal contamination of the wafer.
    Type: Grant
    Filed: May 20, 2003
    Date of Patent: March 7, 2006
    Assignee: MEMC Electronic Materials, Inc.
    Inventors: Mick Bjelopavlic, Alexis Grabbe, Michele Haler, Tracy M. Ragan
  • Wafer carrier
    Publication number: 20040235402
    Abstract: A wafer carrier for retaining at least one semiconductor wafer in a processing apparatus during a processing operation which removes wafer material by at least one of abrading and chemical reaction. The processing apparatus is adapted for removing wafer material from a front side and a back side of each wafer simultaneously. The carrier includes a plate including wafer contaminating material and having an opening and a thickness. An insert has a thickness and is disposed in the opening for receiving at least one wafer and engaging a peripheral edge of the wafer to hold the wafer as the carrier rotates. The thickness of the insert is significantly greater than the thickness of the plate to inhibit removal of material from the plate and thereby inhibit bulk metal contamination of the wafer.
    Type: Application
    Filed: May 20, 2003
    Publication date: November 25, 2004
    Applicant: MEMC Electronic Materials, Inc.
    Inventors: Mick Bjelopavlic, Alexis Grabbe, Michele Haler, Tracy M. Ragan