Abstract: Solder joints coupling pins to a microelectronic package substrate are enshrouded with an encapsulation material. In this manner, pin movement is limited even if the pin solder subsequently melts.

Abstract: An assembly including a heat dissipation device having an attachment surface, a substrate having an attachment surface, and a plurality of metal balls extending between the heat dissipation device attachment surface and the substrate attachment surface. The assembly may include at least one microelectronic die disposed between the heat dissipation device attachment surface and the substrate attachment surface.

Abstract: Solder joints coupling pins to a microelectronic package substrate are enshrouded with an encapsulation material. In this manner, pin movement is limited even if the pin solder subsequently melts.

Abstract: In one embodiment, the invention provides a method comprising supporting a plurality of active electronic components on a first wafer; shaping a second wafer to define a plurality of spaces, each to accommodate one of the active electronic components when the second wafer is aligned and brought into face-to-face contact with that first wafer in a contact position; moving the second wafer into the contact position; and bonding the second wafer to the first wafer in the contact position.

Abstract: An assembly including a heat dissipation device having an attachment surface, a substrate having an attachment surface, and a plurality of metal balls extending between the heat dissipation device attachment surface and the substrate attachment surface. The assembly may include at least one microelectronic die disposed between the heat dissipation device attachment surface and the substrate attachment surface.

Abstract: In one embodiment, the invention provides a method comprising supporting a plurality of active electronic components on a first wafer; shaping a second wafer to define a plurality of spaces, each to accommodate one of the active electronic components when the second wafer is aligned and brought into face-to-face contact with that first wafer in a contact position; moving the second wafer into the contact position; and bonding the second wafer to the first wafer in the contact position.

Abstract: A packaged microelectromechanical system may be formed in a hermetic cavity by forming the system on a semiconductor structure and covering the system with a thermally decomposing film. That film may then be covered by a sealing cover. Subsequently, the thermally decomposing material may be decomposed, forming a cavity, which can then be sealed to hermetically enclose the system.

Abstract: Solder joints coupling pins to a microelectronic package substrate are enshrouded with an encapsulation material. In this manner, pin movement is limited even if the pin solder subsequently melts.

Abstract: A micro-relay module includes a substrate and a lid in spaced apart relation, and a solder ring which bonds the lid to the substrate to define a chamber therebetween. A micromachined relay is integrally formed on the substrate or on the lid within the chamber. A gas is contained in the chamber at a gas pressure which is above atmospheric pressure. Input/output pads are included outside the chamber and electrically connected to the micromachined relay. Large numbers of encapsulated modules may be fabricated on a single substrate by integrally forming an array of relays on a face of a first substrate. A second substrate is placed adjacent the face with a corresponding array of solder rings therebetween, such that a respective solder ring surrounds a respective relay. The solder rings are reflowed in a gas atmosphere which is above atmospheric pressure to thereby form an array of high pressure gas encapsulating chambers.

Abstract: A defective area on a microelectronic substrate is repaired using an image reversal photoresist and image reversal process. The defective area on a microelectronic substrate is identified and a layer of image reversal photoresist is applied to the microelectronic substrate. The image reversal photoresist is then exposed twice in an image reversal process, and the image reversal photoresist is then removed over the defective area. A repair material is then blanket deposited, and the image reversal photoresist is removed in a lift-off operation such that the material on the defective area remains. Missing lines and broken lines may be repaired. Conductive and dielectric materials may be repaired.