Patents by Inventor Michelle Ann Parziale

Michelle Ann Parziale has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • BIOPROCESSING SYSTEM AND TUBING AND COMPONENT MANAGEMENT APPARATUS FOR A BIOPROCESSING SYSTEM
    Publication number: 20220235304
    Abstract: A bioreactor vessel includes a bottom, a peripheral sidewall, the bottom and the peripheral sidewall defining an interior space for receiving a flexible bioprocessing bag, a recess in the bottom for receiving a base plate of the flexible bioprocessing bag, and a locking mechanism configured to retain the base plate in the recess.
    Type: Application
    Filed: June 9, 2020
    Publication date: July 28, 2022
    Applicant: GLOBAL LIFE SCIENCES SOLUTIONS USA LLC
    Inventors: TIMOTHY BECKER, MANAS DASH, RALPH STANKOWSKI, COLIN TUOHEY, MICHELLE ANN PARZIALE, ELIZABETH STEGNER, ALEXANDER MARK KILAR, KANDAKUMAR MURUGESAN, PRASAD BAGIYANATHAN, SAIRAM CHERUNNI, NIKHIL VAGGA CHANDRAMOULI
  • Circuit card assembly including heat transfer assembly and method of manufacturing such
    Patent number: 9750127
    Abstract: A circuit card assembly includes a first printed circuit board and a first electronic component mounted on the first printed circuit board. A heat transfer assembly is coupled to the first printed circuit board. The heat transfer assembly includes a first plate extending adjacent the first printed circuit board and a second plate extending adjacent the first plate. At least one of the first plate and the second plate includes an accommodation feature to accommodate the first electronic component. The heat transfer assembly further includes a first set of heat pipes between the first plate and the second plate. The first set of heat pipes is configured to remove heat from the first electronic component. At least one heat pipe of the first set of heat pipes extends adjacent the accommodation feature.
    Type: Grant
    Filed: December 4, 2015
    Date of Patent: August 29, 2017
    Assignee: General Electric Company
    Inventors: Joo Han Kim, Michelle Ann Parziale, Jerry Leon Wright, Hendrik Pieter Jacobus de Bock, Brian Patrick Hoden
  • CIRCUIT CARD ASSEMBLY INCLUDING HEAT TRANSFER ASSEMBLY AND METHOD OF MANUFACTURING SUCH
    Publication number: 20170164459
    Abstract: A circuit card assembly includes a first printed circuit board and a first electronic component mounted on the first printed circuit board. A heat transfer assembly is coupled to the first printed circuit board. The heat transfer assembly includes a first plate extending adjacent the first printed circuit board and a second plate extending adjacent the first plate. At least one of the first plate and the second plate includes an accommodation feature to accommodate the first electronic component. The heat transfer assembly further includes a first set of heat pipes between the first plate and the second plate. The first set of heat pipes is configured to remove heat from the first electronic component. At least one heat pipe of the first set of heat pipes extends adjacent the accommodation feature.
    Type: Application
    Filed: December 4, 2015
    Publication date: June 8, 2017
    Inventors: Joo Han Kim, Michelle Ann Parziale, Jerry Leon Wright, Hendrik Pieter Jacobus de Bock, Brian Patrick Hoden