Patents by Inventor Michelle Broyles

Michelle Broyles has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 6383606
    Abstract: A semiconductor wafer diaphragm comprising a non-flat film coupled to a mounting lip is disclosed. The semiconductor wafer diaphragm is useful for reducing the edge fracture of semiconductor wafer die due to sagging of prior art semiconductor wafer tape after a semiconductor wafer adhered thereto is cut. The non-flat film of the semiconductor wafer diaphragm preferably has a surface of a convex shape and is either inherently sticky or has an adhesive layer applied to said surface. The semiconductor wafer diaphragm is used by mounting an uncut semiconductor wafer to the diaphragm in the ordinary way thereby collapsing the diaphragm, cutting the semiconductor wafer, thereafter restoring the diaphragm to the original expanded shape of the semiconductor wafer diaphragm, and removing the individually created die.
    Type: Grant
    Filed: February 2, 1999
    Date of Patent: May 7, 2002
    Inventor: Michelle Broyles
  • Publication number: 20010049162
    Abstract: A semiconductor wafer diaphragm comprising a non-flat film coupled to a mounting lip is disclosed. The semiconductor wafer diaphragm is useful for reducing the edge fracture of semiconductor wafer die due to sagging of prior art semiconductor wafer tape after a semiconductor wafer adhered thereto is cut. The non-flat film of the semiconductor wafer diaphragm preferably has a surface of a convex shape and is either inherently sticky or has an adhesive layer applied to said surface. The semiconductor wafer diaphragm is used by mounting an uncut semiconductor wafer to the diaphragm in the ordinary way thereby collapsing the diaphragm, cutting the semiconductor wafer, thereafter restoring the diaphragm to the original expanded shape of the semiconductor wafer diaphragm, and removing the individually created die.
    Type: Application
    Filed: February 2, 1999
    Publication date: December 6, 2001
    Inventor: MICHELLE BROYLES
  • Patent number: 6227515
    Abstract: The present invention is a platform, or tabletop, that is useful for mounting and supporting items, such as scientific equipment and the like, wherein the overall mass of the platform may be varied as desired. The platform primarily consists of a rigid tabletop, and may include a supporting vibration isolation system. The platform, or tabletop, of this invention includes an upper surface, a lower surface, and an intervening side wall, that, together with the upper and lower surfaces, defines an interior cavity, or cavity enclosure. An intermediate surface partitions the interior cavity into two sections, a bottom section and a top section. The intermediate surface should seal the bottom section of the interior cavity thereby making the bottom section capable of containing fluids. This further ensures the platform is watertight and represents another material barrier to any vibrations between the upper surface and the main mass of the platform.
    Type: Grant
    Filed: October 27, 1999
    Date of Patent: May 8, 2001
    Inventor: Michelle Broyles