Abstract: Certain aspects of the present disclosure provide techniques for committing log data in an application to a log data repository. An example method generally includes receiving, from an application, data to be committed to a remote storage location. A type of the received data is determined. The type of the received data is generally associated with a prioritization level and a compression mechanism to be used in committing the data to the remote storage location. An application execution context associated with the received data is determined. At a dispatch time associated with the prioritization level of the received data and the application execution context associated with the received data, a compressed data payload is generated and transmitted to the remote storage location. Generally, to compress the data payload, at least the received data is generally compressed based on the determined compression mechanism.

Abstract: A housing for an electronic component, in particular for a laser diode, is provided. The housing includes a mounting area for the electronic component and has a lateral wall provided with a feedthrough for a light guide. The base wall of a basic body of the housing has both a heat sink for a thermoelectric cooler and a plurality of feedthroughs for pins for electrically connecting the electronic component.

Abstract: A housing for an electronic component, in particular for a laser diode, is provided. The housing includes a mounting area for the electronic component and has a lateral wall provided with a feedthrough for a light guide. The base wall of a basic body of the housing has both a heat sink for a thermoelectric cooler and a plurality of feedthroughs for pins for electrically connecting the electronic component.

Abstract: A housing for an electronic component, in particular for a laser diode, is provided. The housing includes a mounting area for the electronic component and has a lateral wall provided with a feedthrough for a light guide. The base wall of a basic body of the housing has both a heat sink for a thermoelectric cooler and a plurality of feedthroughs for pins for electrically connecting the electronic component.

Abstract: A housing for an electronic component, in particular for a laser diode, is provided. The housing includes a mounting area for the electronic component and has a lateral wall provided with a feedthrough for a light guide. The base wall of a basic body of the housing has both a heat sink for a thermoelectric cooler and a plurality of feedthroughs for pins for electrically connecting the electronic component.