Patents by Inventor Michelle Jensen
Michelle Jensen has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 9259820Abstract: A chemical mechanical polishing pad is provided having a polishing layer; and an endpoint detection window incorporated into the chemical mechanical polishing pad, wherein the endpoint detection window is a plug in place window; wherein the endpoint detection window comprises a reaction product of ingredients, comprising: a window prepolymer, and, a window curative system, comprising: at least 5 wt % of a window difunctional curative; at least 5 wt % of a window amine initiated polyol curative; and, 25 to 90 wt % of a window high molecular weight polyol curative.Type: GrantFiled: March 28, 2014Date of Patent: February 16, 2016Assignees: Rohm and Haas Electronic Materials CMP Holdings, Inc., Dow Global Technologies LLCInventors: Bainian Qian, Marty W. DeGroot, James Murnane, Angus Repper, Michelle Jensen, Jeffrey J. Hendron, John G. Nowland, David B. James, Fengji Yeh
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Publication number: 20150273652Abstract: A chemical mechanical polishing pad is provided having a polishing layer; and an endpoint detection window incorporated into the chemical mechanical polishing pad, wherein the endpoint detection window is a plug in place window; wherein the endpoint detection window comprises a reaction product of ingredients, comprising: a window prepolymer, and, a window curative system, comprising: at least 5 wt % of a window difunctional curative; at least 5 wt % of a window amine initiated polyol curative; and, 25 to 90 wt % of a window high molecular weight polyol curative.Type: ApplicationFiled: March 28, 2014Publication date: October 1, 2015Inventors: Bainian Qian, Marty W. DeGroot, James Murnane, Angus Repper, Michelle Jensen, Jeffrey J. Hendron, John G. Nowland, David B. James, Fengji Yeh
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Patent number: 9102034Abstract: A method of chemical mechanical polishing a substrate is provided, including: providing a substrate; providing a chemical mechanical polishing pad, comprising: a polishing layer having a composition and a polishing surface, wherein the composition of polishing layer is selected to exhibit an initial hydrolytic stability; coupled with a sustained hydrolytic instability; a rigid layer having a top surface and a bottom surface; a hot melt adhesive interposed between the base surface of the polishing layer and the top surface of the rigid layer; wherein the hot melt adhesive bonds the polishing layer to the rigid layer; a pressure sensitive platen adhesive layer having a stack side and a platen side; wherein the stack side of the pressure sensitive platen adhesive layer is adjacent to the bottom surface of the rigid layer; and, creating dynamic contact between the polishing surface and substrate to polish a surface of the substrate.Type: GrantFiled: August 30, 2013Date of Patent: August 11, 2015Assignees: Rohm and Haas Electronic Materials CMP Holdings, Inc., Dow Global Technologies LLCInventors: Michelle Jensen, Bainian Qian, Fengji Yeh, Marty W. DeGroot, Mohammad T. Islam, Matthew Richard Van Hanehem, Darrell String, James Murnane, Jeffrey James Hendron, John G. Nowland
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Patent number: 9064806Abstract: A chemical mechanical polishing pad is provided having a polishing layer; and a window incorporated into the polishing layer; wherein the polishing layer comprises a reaction product of ingredients, including: a polishing layer prepolymer and a polishing layer curative system; wherein the polishing layer curative system includes a polishing layer amine initiated polyol curative, a polishing layer high molecular weight polyol curative and a polishing layer difunctional curative; and, wherein the window comprises a reaction product of ingredients, including: a window prepolymer and a window curative system; wherein the window curative system includes a window difunctional curative, a window amine initiated polyol curative and a window high molecular weight polyol curative; and, wherein the polishing layer exhibits a density of ?0.6 g/cm3; a Shore D hardness of 5 to 40; an elongation to break of 100 to 450%; and, a cut rate of 25 to 150 ?m/hr.Type: GrantFiled: March 28, 2014Date of Patent: June 23, 2015Assignees: Rohm and Haas Electronics Materials CMP Holdings, Inc., Dow Global Technologies LLCInventors: Bainian Qian, Marty W. DeGroot, Michelle Jensen, James Murnane, Jeffrey J. Hendron, John G. Nowland, David B. James, Fengji Yeh
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Patent number: 9053470Abstract: Card security apparatus and methods are provided. An obstruction layer (e.g., a hot-stamped scratch off foil label) may be provided in at least partially overlapping relation to a data field of a card (e.g., including proprietary information unique to the specific card). The obstruction layer may render all or at least a portion of the card data field unreadable in the presentation position. All or at least a portion of an exposed data field, such e.g., as an activation field, may be disposed on an outer surface of the obstruction layer such that the activation field is readable with the obstruction layer in the presentation position. Displacement of the obstruction layer may render the exposed data field, e.g., activation field, unreadable (e.g., via destruction of all or at least a portion of the obstruction layer) and the data field readable.Type: GrantFiled: May 7, 2014Date of Patent: June 9, 2015Assignee: CPI Card Group—Colorado, Inc.Inventors: Paul Boge, John P. Dwyer, Stacy Michelle Jensen
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Publication number: 20150065014Abstract: A method of chemical mechanical polishing a substrate is provided, including: providing a substrate; providing a chemical mechanical polishing pad, comprising: a polishing layer having a composition and a polishing surface, wherein the composition of polishing layer is selected to exhibit an initial hydrolytic stability; coupled with a sustained hydrolytic instability; a rigid layer having a top surface and a bottom surface; a hot melt adhesive interposed between the base surface of the polishing layer and the top surface of the rigid layer; wherein the hot melt adhesive bonds the polishing layer to the rigid layer; a pressure sensitive platen adhesive layer having a stack side and a platen side; wherein the stack side of the pressure sensitive platen adhesive layer is adjacent to the bottom surface of the rigid layer; and, creating dynamic contact between the polishing surface and substrate to polish a surface of the substrate.Type: ApplicationFiled: August 30, 2013Publication date: March 5, 2015Inventors: Michelle Jensen, Bainian Qian, Fengji Yeh, Marty W. DeGroot, Mohammad T. Islam, Matthew Richard Van Hanehem, Darrell String, James Murnane, Jeffrey James Hendron, John G. Nowland
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Publication number: 20150065013Abstract: A chemical mechanical polishing pad is provided containing: a polishing layer; a rigid layer; and, a hot melt adhesive bonding the polishing layer to the rigid layer; wherein the polishing layer exhibits a specific gravity of greater than 0.6; a Shore D hardness of 60 to 90; an elongation to break of 100 to 300%; and, a unique combination of an initial hydrolytic stability and a sustained hydrolytic instability.Type: ApplicationFiled: August 30, 2013Publication date: March 5, 2015Inventors: Michelle Jensen, Bainian Qian, Fengji Yeh, Marty W. DeGroot, Mohammad T. Islam, Matthew Richard Van Hanehem, Darrell String, James Murnane, Jeffrey James Hendron, John G. Nowland
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Publication number: 20140319223Abstract: Card security apparatus and methods are provided. An obstruction layer (e.g., a hot-stamped scratch off foil label) may be provided in at least partially overlapping relation to a data field of a card (e.g., including proprietary information unique to the specific card). The obstruction layer may render all or at least a portion of the card data field unreadable in the presentation position. All or at least a portion of an exposed data field, such e.g., as an activation field, may be disposed on an outer surface of the obstruction layer such that the activation field is readable with the obstruction layer in the presentation position. Displacement of the obstruction layer may render the exposed data field, e.g., activation field, unreadable (e.g., via destruction of all or at least a portion of the obstruction layer) and the data field readable.Type: ApplicationFiled: May 7, 2014Publication date: October 30, 2014Applicant: CPI Card Group - Colorado, Inc.Inventors: Paul Boge, John P. Dwyer, Stacy Michelle Jensen
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Patent number: 8720786Abstract: Card security apparatus and methods are provided. An obstruction layer (e.g., a hot-stamped scratch off foil label) may be provided in at least partially overlapping relation to a data field of a card (e.g., including proprietary information unique to the specific card). The obstruction layer may render all or at least a portion of the card data field unreadable in the presentation position. All or at least a portion of an exposed data field, such e.g., as an activation field, may be disposed on an outer surface of the obstruction layer such that the activation field is readable with the obstruction layer in the presentation position. Displacement of the obstruction layer may render the exposed data field, e.g., activation field, unreadable (e.g., via destruction of all or at least a portion of the obstruction layer) and the data field readable.Type: GrantFiled: April 2, 2012Date of Patent: May 13, 2014Assignee: CPI Card Group—Colorado, Inc.Inventors: Paul Boge, John P. Dwyer, Stacy Michelle Jensen
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Publication number: 20120256003Abstract: Card security apparatus and methods are provided. An obstruction layer (e.g., a hot-stamped scratch off foil label) may be provided in at least partially overlapping relation to a data field of a card (e.g., including proprietary information unique to the specific card). The obstruction layer may render all or at least a portion of the card data field unreadable in the presentation position. All or at least a portion of an exposed data field, such e.g., as an activation field, may be disposed on an outer surface of the obstruction layer such that the activation field is readable with the obstruction layer in the presentation position. Displacement of the obstruction layer may render the exposed data field, e.g., activation field, unreadable (e.g., via destruction of all or at least a portion of the obstruction layer) and the data field readable.Type: ApplicationFiled: April 2, 2012Publication date: October 11, 2012Applicant: CPI Card Group, Inc.Inventors: Paul Boge, John P. Dwyer, Stacy Michelle Jensen
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Patent number: 7820005Abstract: A method for making a multilayer chemical mechanical polishing pad comprising: providing a polishing layer, providing a subpad layer, optionally providing additional layers, providing an unset reactive hot melt adhesive, applying the unset reactive hot melt adhesive in a pattern on a surface of at least one of the layers, applying one of the other layers over the pattern of unset reactive hot melt adhesive, pressing the two layers together with the unset reactive hot melt adhesive interposed therebetween, allowing the unset reactive hot melt adhesive to set forming a reactive hot melt adhesive bond between the two layers.Type: GrantFiled: July 18, 2008Date of Patent: October 26, 2010Assignee: Rohm and Haas Electronic Materials CMP Holdings, Inc.Inventors: Michelle Jensen, John Gifford Nowland, Brenda Harding, Carol Corder
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Patent number: 7794562Abstract: A method of manufacturing a chemical mechanical polishing pad is provided, comprising: providing a polishing layer; providing a chemical mechanical polishing pad manufacturing assembly, comprising: a subpad layer having a top surface, a bottom surface and at least two wrap around tabs; a backing plate having a top side and a bottom side; a sacrificial layer having at least two recessed areas designed to facilitate attachment of the subpad layer to the backing plate; an unset reactive hot melt adhesive applied to the top surface of the subpad layer, wherein the unset reactive hot melt adhesive is applied in a pattern of parallel lines; wherein the subpad layer is disposed on the top side of the backing plate and the sacrificial layer is disposed on the bottom side of the backing plate, and wherein the at least two wrap around tabs extend to the bottom side of the backing plate; stacking the polishing layer and the chemical mechanical polishing pad manufacturing assembly with the unset reactive hot melt adhesivType: GrantFiled: November 9, 2009Date of Patent: September 14, 2010Assignee: rohm and Hass Electronic Materials CMP Holdings, Inc.Inventors: Michelle Jensen, John Gifford Nowland, Brenda Harding, Carol Corder
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Publication number: 20100051198Abstract: A method of manufacturing a chemical mechanical polishing pad is provided, comprising: providing a polishing layer; providing a chemical mechanical polishing pad manufacturing assembly, comprising: a subpad layer having a top surface, a bottom surface and at least two wrap around tabs; a backing plate having a top side and a bottom side; a sacrificial layer having at least two recessed areas designed to facilitate attachment of the subpad layer to the backing plate; an unset reactive hot melt adhesive applied to the top surface of the subpad layer, wherein the unset reactive hot melt adhesive is applied in a pattern of parallel lines; wherein the subpad layer is disposed on the top side of the backing plate and the sacrificial layer is disposed on the bottom side of the backing plate, and wherein the at least two wrap around tabs extend to the bottom side of the backing plate; stacking the polishing layer and the chemical mechanical polishing pad manufacturing assembly with the unset reactive hot melt adhesivType: ApplicationFiled: November 9, 2009Publication date: March 4, 2010Applicant: Rohm and Haas Electronic Materials CMP Holdings, Inc.Inventors: Michelle Jensen, John Gifford Nowland, Brenda Harding, Carol Corder
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Publication number: 20100015902Abstract: A chemical mechanical polishing pad manufacturing assembly is provided having a subpad layer having a top surface and a bottom surface; a backing plate having a top side and a bottom side; a sacrificial layer having at least two recessed areas designed to facilitate attachment of a subpad layer to the backing plate; wherein the subpad layer is disposed on the top side of the backing plate and the sacrificial layer is disposed on the bottom side of the backing plate, and wherein the at least two wrap around tabs extend to the bottom side of the backing plate. Also provide is a method of manufacturing a chemical mechanical polishing pad using the chemical mechanical polishing pad manufacturing assembly.Type: ApplicationFiled: July 18, 2008Publication date: January 21, 2010Inventors: Michelle Jensen, John Gifford Nowland, Brenda Harding, Carol Corder
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Patent number: 7645186Abstract: A chemical mechanical polishing pad manufacturing assembly is provided having a subpad layer having a top surface and a bottom surface; a backing plate having a top side and a bottom side; a sacrificial layer having at least two recessed areas designed to facilitate attachment of a subpad layer to the backing plate; wherein the subpad layer is disposed on the top side of the backing plate and the sacrificial layer is disposed on the bottom side of the backing plate, and wherein the at least two wrap around tabs extend to the bottom side of the backing plate. Also provide is a method of manufacturing a chemical mechanical polishing pad using the chemical mechanical polishing pad manufacturing assembly.Type: GrantFiled: July 18, 2008Date of Patent: January 12, 2010Assignee: Rohm and Haas Electronic Materials CMP Holdings, Inc.Inventors: Michelle Jensen, John Gifford Nowland, Brenda Harding, Carol Corder