Patents by Inventor Michelle Lynn BOCKMAN

Michelle Lynn BOCKMAN has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20220009172
    Abstract: An example of an apparatus is provided. The apparatus includes an input device to receive design data. The design data includes information about a geometry and load characteristics of an object. The apparatus further includes a structural design engine to generate print data to print the object on a three-dimensional printer based on the design data. The apparatus also includes a fluid design engine to generate fluidic data. The fluidic data represents a fluid channel within the object.
    Type: Application
    Filed: March 29, 2019
    Publication date: January 13, 2022
    Applicant: Hewlett-Packard Development Company, L.P.
    Inventors: David James TUCKER, David WOODLOCK, Jun ZENG, Michelle Lynn BOCKMAN
  • Publication number: 20220012952
    Abstract: An example device includes: a memory storing instructions; and a processor connected to the memory. The instructions are to cause the processor to: receive predetermined locations of a fluidic input location and fluidic output locations at a three-dimensional (3D) object model; generate respective paths between the fluidic input and each of the fluidic outputs via associated portions of the 3D object model; replace the respective paths with respective hollow connectors that have respective fluidic resistance selected such that each of the fluidic outputs have a predetermined flow rate from the fluidic input to the fluid outputs; and store, at the memory, data indicative of locations and dimensions of the respective hollow connectors, relative to the fluidic input and the fluidic outputs, the data for use by a three-dimensional printer to print a part that includes the fluidic input, the fluidic outputs and the respective hollow connectors.
    Type: Application
    Filed: March 29, 2019
    Publication date: January 13, 2022
    Applicant: Hewlett-Packard Development Company, L.P.
    Inventors: David James Tucker, David Woodlock, Jun Zeng, Michelle Lynn Bockman