Abstract: A method for mounting a metal substrate to a first substrate comprises a metal substrate having a plurality of through holes in at least a portion of the metal substrate and the application of a one part moisture curing adhesive on the adherend first surface, adherend metal surface or both. The first substrate and metal substrate are contacted interposing the adhesive between the adherend first surface and the adherend metal surface such that a portion of the length of at least one through hole is penetrated by the adhesive. The adhesive is cured in the presence of moisture.

Abstract: The present invention relates to methods for attaching a plastic component to another component where the plastic component is bonded to the other component with an adhesive in the absence of a primer on the plastic component and the adhesive is substantially solvent free. In one embodiment, a coated transparent or translucent polycarbonate substrate is connected to a frame with a polyurethane adhesive containing silicon in the absence of a primer on the substrate; or with a substantially solvent free adhesive. The inventions also related to bonded articles made according to the disclosed methods.