Abstract: An injection moldable composition, comprising: A) a silicone resin (I) [R13SiO1/2]a[R2R3SiO2/2]b[SiO4/2]c, wherein R1, R2, and R3 are hydrocarbyl, hydrocarbyloxy, or hydroxyl, at least one of R2 or R3 is alkenyl, subscripts a, b, and c are each >0 and a+b+c=1, B) 0 to 90% (w/w), based on the weight of A) and B), of a silicone resin (II) [R43SiO1/2]d[SiO4/2]e wherein R4 is hydrocarbyl, hydrocarbyloxy, or hydroxyl, at least one of R4 is alkenyl, subscripts d and e are each >0, and d+e=1, C) a siloxane polymer having formula (III), [R53SiO1/2]fR6R7SiO2/2]g. wherein R5-7 are hydrocarbyl or hydroxyl, at least one of R5-7 is alkenyl, subscripts f and g are each >0, and f+g=1, D) a silicone crosslinker having at least two silicon-bonded hydrogen atoms per molecule, and E) a hydrosilylation catalyst, wherein the ratio of silicon-bonded hydrogen atoms to carbon-carbon double bonds is from 1.2 to 2.2.

Abstract: Vacuum lamination methods for forming conformally coated articles having a preformed lamination layer conformally coated to or on an object such as an LED array are provided. These vacuum lamination methods utilize a single heating step to heat a middle portion of the preformed lamination layer to a flowable condition prior to the preformed lamination layer being conformally coated over the article, such as the array of light emitting diodes disposed on an inner portion of a first side of a submount wafer.

Abstract: Vacuum lamination methods for forming conformally coated articles having a preformed lamination layer conformally coated to or on an object such as an LED array are provided. These vacuum lamination methods utilize a single heating step to heat a middle portion of the preformed lamination layer to a flowable condition prior to the preformed lamination layer being conformally coated over the article, such as the array of light emitting diodes disposed on an inner portion of a first side of a submount wafer.