Patents by Inventor Michiaki Furukawa

Michiaki Furukawa has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Semiconductor device and process for producing the same, and lead frame used in said process
    Patent number: 5234866
    Abstract: According to the present invention, as improvement in the adhesion of inner leads with a packaging resin in a resin-sealed semiconductor device is attained by spreading leads on or near the circuit-forming face of a pellet, or on or near the main non-circuit-forming face of the pellet to extend the lengths of the inner leads on or under the pellet.
    Type: Grant
    Filed: April 3, 1992
    Date of Patent: August 10, 1993
    Assignees: Hitachi, Ltd., Hitachi VLSI Engineering Corp.
    Inventors: Takayuki Okinaga, Hiroshi Tachi, Hiroshi Ozaki, Kanji Otsuka, Michiaki Furukawa, Yasuyuki Yamasaki
  • Semiconductor device having inner leads extending over a surface of a semiconductor pellet
    Patent number: 5126821
    Abstract: According to the present invention, as improvement in the adhesion of inner leads with a packaging resin in a resin-sealed semiconductor device is attained by spreading leads on or near the circuit-forming face of a pellet, or on or near the main non-circuit-forming face of the pellet to extend the lengths of the inner leads on or under the pellet.
    Type: Grant
    Filed: May 29, 1990
    Date of Patent: June 30, 1992
    Assignees: Hitachi, Ltd., Hitachi VLSI Engineering Corp.
    Inventors: Takayuki Okinaga, Hiroshi Tachi, Hiroshi Ozaki, Kanji Otsuka, Michiaki Furukawa, Yasuyuki Yamasaki
  • Semiconductor device
    Patent number: 4943843
    Abstract: According to the present invention, as improvement in the adhesion of inner leads with a packaging resin in a resin-sealed semiconductor device is attained by spreading leads on or near the circuit-forming face of a pellet, or on or near the main non-circuit-forming face of the pellet to extend the lengths of the inner leads on or under the pellet.
    Type: Grant
    Filed: December 8, 1989
    Date of Patent: July 24, 1990
    Assignees: Hitachi, Ltd., Hitachi VLSI Engineering Corp.
    Inventors: Takayuki Okinaga, Hiroshi Tachi, Hiroshi Ozaki, Kanji Otsuka, Michiaki Furukawa, Yasuyuki Yamasaki