Abstract: A shield casing, which is configured to surround an electronic component mounted on a circuit board, includes a frame body including an engagement recess and a lid body including a hook unit configured to engage with the engagement recess. The lid body is fitted to the frame body to cover the frame body. The hook unit is elastically deformable in a second direction that is opposite to a first direction in which the lid body is fitted to the frame body as the lid body is fitted to the frame body, and then snaps into mating engagement in the engagement recess.

Abstract: A portable terminal 1 comprises a judgment section 23 which judges whether or not digital broadcasting corresponding to an interactive service is received, and a control section 24 which enables an operation section 10 corresponding to the interactive service, in case that transmission of data corresponding to the interactive service is possible when it is judged by the judgment section 23 that the interactive service is received, and which disables the operation section 10, in case that transmission of data corresponding to the interactive service is impossible when it is judged by the judgment section 23 that the interactive service is received.

Abstract: A substrate for mounting an optical component includes a first groove formed in a surface of a substrate, a second groove formed in the surface of the substrate, the second groove having a depth greater than the first groove. In the present invention, the first groove and the second groove are related to each other by the following equation, (2D sin &thgr;)/R≧C where D denotes a depth of the first groove, &thgr; denotes an angle between a horizontal plane and a slanted surface of the first groove (0°<&thgr;<90°), R=F/E (E denotes an etching rate of a slanted surface of the first groove, F denotes an etching rate of a bottom surface of the groove, C denotes a top opening width of the groove.

Abstract: On one principal plane of a silicon substrate 1, a silicon oxide film 2 having an opening 2a is formed, and a silicon nitride film 3 having an opening 3b overlapping the opening 2a and a recessed marker 3b is stacked on the silicon oxide film 2. Next, the substrate 1 is etched through the openings 2a, 3a to provide an alignment groove 1a for an optical waveguide, and an electrode pattern 5 is formed. Light of which wavelength transmits through the substrate 1 and the silicon oxide film 2 is radiated from the other principal plane of the substrate 1, and the optical element is assembled with the marker 3b serving as the reference while the marker 3b and the optical element are monitored.