Abstract: A thermal conduction sheet holder include, in the following order, an elongated carrier film, a plurality of thermal conduction sheets, and an elongated cover film covering the plurality of thermal conduction sheets, the shortest distance between adjacent thermal conduction sheets is 2 mm or more, the plurality of thermal conduction sheets are disposed at intervals in a longitudinal direction of the carrier film and the cover film, and the plurality of thermal conduction sheets are peelable from the cover film and the carrier film.

Abstract: A thermal conduction sheet includes graphite particles (A) of at least one kind selected from the group consisting of flake-shaped particles, ellipsoidal particles, and rod-shaped particles. When the graphite particles (A) are flake-shaped particles, a planar direction of the graphite particles (A) is oriented in a thickness direction of the thermal conduction sheet, when the graphite particles (A) are ellipsoidal particles, a major axis direction of the graphite particles (A) is oriented in the thickness direction of the thermal conduction sheet, when the graphite particles (A) are rod-like particles, a longitudinal direction of the graphite particles (A) is oriented in the thickness direction of the thermal conduction sheet, the thermal conduction sheet has an elastic modulus of 1.4 MPa or less under a compression stress of 0.1 MPa at 150° C., and the thermal conduction sheet has a tack strength of 5.0 N·mm or higher at 25° C.

Abstract: One embodiment of the present invention relates to a thermally conductive sheet containing graphite particles (A) including at least one selected from the group consisting of flake-like particles, ellipsoidal particles, and cylindrical particles, in which the graphite particles (A) are oriented in a thickness direction, and a thickness compression ratio is 24% or more at a temperature of 150° C. and a compressive stress of 0.14 MPa.

Abstract: A heat conduction sheet, includes at least one kind of graphite particle (A) selected from the group consisting of scale-like particles, ellipsoidal particles and rod-like particles; a polymer (B) having an isobutylene structure; an ethylene-propylene copolymer (C); and an ethylene octene elastomer (D), in which, in a case of scale-like particles, a plane direction of the particle is oriented in a thickness direction of the heat conduction sheet, and in a case of ellipsoidal particles or rod-like particles, a long axis direction of the particle is oriented in the thickness direction of the heat conduction sheet.

Abstract: A thermal conduction sheet includes graphite particles (A) of at least one kind selected from the group consisting of flake-shaped particles, ellipsoidal particles, and rod-shaped particles. When the graphite particles (A) are flake-shaped particles, a planar direction of the graphite particles (A) is oriented in a thickness direction of the thermal conduction sheet,when the graphite particles (A) are ellipsoidal particles, a major axis direction of the graphite particles (A) is oriented in the thickness direction of the thermal conduction sheet, when the graphite particles (A) are rod-like particles, a longitudinal direction of the graphite particles (A) is oriented in the thickness direction of the thermal conduction sheet, the thermal conduction sheet has an elastic modulus of 1.4 MPa or less under a compression stress of 0.1 MPa at 150° C., and the thermal conduction sheet has a tack strength of 5.0 N·mm or higher at 25° C.

Abstract: Provided is a thermal conduction sheet, including graphite particles (A) of at least one kind selected from the group consisting of flake-shaped particles, ellipsoidal particles, and rod-shaped particles, in which: when the graphite particles (A) are flake-shaped particles, a planar direction of the graphite particles (A) is oriented in a thickness direction of the thermal conduction sheet, when the graphite particles (A) are ellipsoidal particles, a major axis direction of the graphite particles (A) is oriented in the thickness direction of the thermal conduction sheet, when the graphite particles (A) are rod-like particles, a longitudinal direction of the graphite particles (A) is oriented in the thickness direction of the thermal conduction sheet, the thermal conduction sheet has an elastic modulus of 1.4 MPa or less under a compression stress of 0.1 MPa at 150° C., and the thermal conduction sheet has a tack strength of 5.0 N·mm or higher at 25° C.

Abstract: A method of manufacturing a semiconductor device includes: adhering together a heat generating body and a heat dissipating body via a thermally conductive sheet by applying a pressure on the heat generating body and the heat dissipating body in a thickness direction of the thermally conductive sheet with the thermally conductive sheet disposed therebetween, the thermally conductive sheet having a compression modulus of 1.40 MPa or less under a compressive stress of 0.10 MPa at 150° C., and a tack strength of 5.0 N·mm or more at 25° C.

Abstract: A method of manufacturing a semiconductor device includes adhering together a heat dissipating body and a plurality of heat generating bodies via a thermally conductive sheet, by applying pressure to the heat dissipating body and the plurality of heat generating bodies in a thickness direction of the thermally conductive sheet with the thermally conductive sheet disposed therebetween, the thermally conductive sheet having a compression modulus of 1.40 MPa or less under a compressive stress of 0.10 MPa at 150° C.

Abstract: A method of manufacturing a semiconductor device includes: adhering together a heat generating body and a heat dissipating body via a thermally conductive sheet by applying a pressure on the heat generating body and the heat dissipating body in a thickness direction of the thermally conductive sheet with the thermally conductive sheet disposed therebetween, the thermally conductive sheet having a compression modulus of 1.40 MPa or less under a compressive stress of 0.10 MPa at 150° C., and a tack strength of 5.0 N·mm or more at 25° C.

Abstract: A method of manufacturing a semiconductor device includes adhering together a heat dissipating body and a plurality of heat generating bodies via a thermally conductive sheet, by applying pressure to the heat dissipating body and the plurality of heat generating bodies in a thickness direction of the thermally conductive sheet with the thermally conductive sheet disposed therebetween, the thermally conductive sheet having a compression modulus of 1.40 MPa or less under a compressive stress of 0.10 MPa at 150° C.

Abstract: A method of manufacturing a semiconductor device includes: adhering together a heat generating body and a heat dissipating body via a thermally conductive sheet by applying a pressure on the heat generating body and the heat dissipating body in a thickness direction of the thermally conductive sheet with the thermally conductive sheet disposed therebetween, the thermally conductive sheet having a compression modulus of 1.40 MPa or less under a compressive stress of 0.10 MPa at 150° C., and a tack strength of 5.0 N·mm or more at 25° C.

Abstract: A method of manufacturing a semiconductor device includes adhering together a heat dissipating body and a plurality of heat generating bodies via a thermally conductive sheet, by applying pressure to the heat dissipating body and the plurality of heat generating bodies in a thickness direction of the thermally conductive sheet with the thermally conductive sheet disposed therebetween, the thermally conductive sheet having a compression modulus of 1.40 MPa or less under a compressive stress of 0.10 MPa at 150° C.

Abstract: Provided is a thermal conduction sheet, including graphite particles (A) of at least one kind selected from the group consisting of flake-shaped particles, ellipsoidal particles, and rod-shaped particles, in which: when the graphite particles (A) are flake-shaped particles, a planar direction of the graphite particles (A) is oriented in a thickness direction of the thermal conduction sheet, when the graphite particles (A) are ellipsoidal particles, a major axis direction of the graphite particles (A) is oriented in the thickness direction of the thermal conduction sheet, when the graphite particles (A) are rod-like particles, a longitudinal direction of the graphite particles (A) is oriented in the thickness direction of the thermal conduction sheet, the thermal conduction sheet has an elastic modulus of 1.4 MPa or less under a compression stress of 0.1 MPa at 150° C., and the thermal conduction sheet has a tack strength of 5.0 N·mm or higher at 25° C.

Abstract: A heat conduction sheet, includes at least one kind of graphite particle (A) selected from the group consisting of scale-like particles, ellipsoidal particles and rod-like particles; a polymer (B) having an isobutylene structure; an ethylene-propylene copolymer (C); and an ethylene octene elastomer (D), in which, in a case of scale-like particles, a plane direction of the particle is oriented in a thickness direction of the heat conduction sheet, and in a case of ellipsoidal particles or rod-like particles, a long axis direction of the particle is oriented in the thickness direction of the heat conduction sheet.

Abstract: A heat radiation sheet having high heat-radiation property and excellent handleability and having sheet properties permitting the sheet to cope with changes in use temperature thereof. Also provided is a heat radiation device using the sheet. The heat radiation sheet comprises: a binder component comprising: (A) a thermoplastic rubber component; (B) a thermosetting rubber component; and (C) a thermosetting rubber curing agent crosslinkable with the thermosetting rubber component (B); and an anisotropic graphite powder oriented into a specified direction in the binder component.

Abstract: The thermal conductive sheet of the present invention includes a base sheet and, on one surface of the base sheet, a metal foil (C) that has a thickness of from 1 to 30% of a thickness of the base sheet. The base sheet includes a binder component (A) that exhibits elasticity at room temperature and a graphite powder (B) that has anisotropy, and the graphite powder (B) is oriented in a thickness direction.

Abstract: A thermally conductive sheet includes a composition containing graphite particles (A) in the form of a scale, an elliptic sphere or a rod, a 6-membered ring plane in a crystal thereof being oriented in the plane direction of the scale, the major axis direction of the elliptic sphere, or the major axis direction of the rod, and an organic polymeric compound (B) having a Tg of 50° C. or lower. The plane direction of the scale, the major axis direction of the elliptic sphere, or the major axis direction of the rod of the graphite particles (A) is oriented in the thickness direction of the thermally conductive sheet, the area of the graphite particles (A) exposed onto surfaces of the thermally conductive sheet is 25% or more and 80% or less, and the Ascar C hardness of the sheet is 60 or less at 70° C.

Abstract: The thermal conductive sheet of the present invention includes a base sheet and, on one surface of the base sheet, a metal foil (C) that has a thickness of from 1 to 30% of a thickness of the base sheet. The base sheet includes a binder component (A) that exhibits elasticity at room temperature and a graphite powder (B) that has anisotropy, and the graphite powder (B) is oriented in a thickness direction.

Abstract: A heat radiation sheet having high heat-radiation property and excellent handleability and having sheet properties permitting the sheet to cope with changes in use temperature thereof. Also provided is a heat radiation device using the sheet. The heat radiation sheet comprises: a binder component comprising: (A) a thermoplastic rubber component; (B) a thermosetting rubber component; and (C) a thermosetting rubber curing agent crosslinkable with the thermosetting rubber component (B); and an anisotropic graphite powder oriented into a specified direction in the binder component.

Abstract: A solar cell has a non-light-receiving side and a light-receiving side that faces a backside of an optically-transparent cover plate. A heatsink has a backside that faces the non-light-receiving side of the solar cell. The heatsink is formed of a graphite-containing material having a concave and convex texture as a radiating fin.