Patents by Inventor Michiel A. de Monchy

Michiel A. de Monchy has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Materials for use with interconnects of electrical devices and related methods
    Patent number: 10123430
    Abstract: Certain examples disclosed herein are directed to materials that are designed for use in interconnects of electrical devices such as, for example, printed circuit boards and solar cells. In certain examples, a two-step solder may be used to reduce stresses on the materials used in the production of the electrical devices.
    Type: Grant
    Filed: October 17, 2007
    Date of Patent: November 6, 2018
    Assignee: Alpha Assembly Solutions Inc.
    Inventors: Michael T. Marczi, Paul Koep, Michiel A. de Monchy, Martinus N Finke, Brian Lewis
  • SYSTEMS AND METHODS FOR VOID REDUCTION IN A SOLDER JOINT
    Publication number: 20140328039
    Abstract: In accordance with one or more aspects, a method of reducing void formation in a solder joint may comprise applying a solder paste deposit to a substrate, placing a solder preform in the solder paste deposit, disposing a device on the solder preform and the solder paste deposit, and processing the solder paste deposit and the solder preform to form the solder joint between the device and the substrate. In some aspects, the substrate is a printed circuit board and the device is an integrated circuit package.
    Type: Application
    Filed: September 25, 2012
    Publication date: November 6, 2014
    Inventors: Paul J. Koep, Michiel A. de Monchy, Ellen S. Tormey