Patents by Inventor Michiharu Horibe

Michiharu Horibe has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Epoxy resin adhesive compositions
    Patent number: 4447579
    Abstract: The present invention relates to a room temperature curable epoxy resin adhesive composition having excellent T-peel strength, comprising an epoxy resin containing more than one epoxy group in a molecule on an average, and a hardener in the form of a polyamide-amine, which is obtained from reaction of polyamine with diene rubber having carboxyl terminal groups and other compound having carboxyl groups.
    Type: Grant
    Filed: April 20, 1982
    Date of Patent: May 8, 1984
    Assignees: Cemedine Co., Ltd., Tohto Kasei Co., Ltd.
    Inventors: Yasuo Takagi, Michiharu Horibe