Abstract: Source and drain regions of a second conductivity type are formed in a stripe form in the surface area of a semiconductor substrate of a first conductivity type. A first insulation film is formed on the source and drain regions of the substrate. A second thin insulation film having a tunnel effect is formed on that part of the substrate which lies between the source and drain regions. A floating gate is formed on the second insulation film. A third insulation film is formed on the first insulation film, the floating gate and that part of the substrate which lies between the source and drain regions and on which the second insulation film is not formed. A control gate is formed on the third insulation film in a stripe form extending in a direction which intersects the source and drain regions. An impurity region of the first conductivity type having an impurity concentration higher than the substrate is formed in the substrate except the source and drain regions and the portions lying below the control gate.

Abstract: Source and drain regions of a second conductivity type are formed in a stripe form in the surface area of a semiconductor substrate of a first conductivity type. A first insulation film is formed on the source and drain regions of the substrate. A second thin insulation film having a tunnel effect is formed on that part of the substrate which lies between the source and drain regions. A floating gate is formed on the second insulation film. A third insulation film is formed on the first insulation film, the floating gate and that part of the substrate which lies between the source and drain regions and on which the second insulation film is not formed. A control gate is formed on the third insulation film in a stripe form extending in a direction which intersects the source and drain regions. An impurity region of the first conductivity type having an impurity concentration higher than the substrate is formed in the substrate except the source and drain regions and the portions lying below the control gate.

Abstract: A nonvolatile semiconductor memory includes a cell array in which electrically erasable programmable nonvolatile semiconductor memory cells, each using a cell transistor having source and drain regions in a semiconductor substrate, and a gate electrode with a three-layered structure on the semiconductor substrate are arranged in a matrix form. In the gate electrode having the three-layered structure, a first-layer floating gate electrode opposes a semiconductor substrate surface through a first gate insulating film, and a second- or third-layer gate electrode serves as one of erase and control gate electrodes. The erase gate electrode opposes a part of the floating gate electrode through a tunnel insulating film, and the control gate electrode opposes the floating gate electrode through a second gate insulating film. The erase and control gate electrodes are arranged to be parallel to each other, and to be perpendicular to the source and drain regions.