Patents by Inventor Michiharu Motonishi

Michiharu Motonishi has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20060072245
    Abstract: A holding portion, on which a slider having a magnetic element for recording and/or replaying is held is provided on a second supporting portion of a supporting member, in which conductive patterns are formed. A plurality of fixing portions are formed in the holding portion and when the slider is sandwiched between the plurality of fixing portions, the slider is electrically connected with the conductive patterns.
    Type: Application
    Filed: August 26, 2005
    Publication date: April 6, 2006
    Inventors: Michiharu Motonishi, Kanji Sawai
  • Patent number: 6902099
    Abstract: The invention provides a magnetic head capable of positively preventing electrostatic breakdown of an MR magnetic head device, and a method of manufacturing the magnetic head. A circuit board comprises at least a pair of leads for constructing a circuit, lands connected respectively to the leads, and solder bumps formed respectively on the lands. The solder bumps are arranged in an adjacent relationship and, when the solder bumps are crushed, peripheral portions of the solder bumps are pressed or spread so as to overlap with each other. The magnetic head includes the circuit board.
    Type: Grant
    Filed: April 10, 2002
    Date of Patent: June 7, 2005
    Assignee: Alps Electric Co., Ltd.
    Inventors: Michiharu Motonishi, Michiaki Moroe
  • Publication number: 20050099730
    Abstract: A method for mounting a flexible flexure, which has a slider fixed thereto and having an electro-magnetic conversion element integrally, on a load beam includes the steps of joining a main flexure, which has a junction piece for joining the load beam, to the load beam with the junction piece therebetween; inspecting characteristics by floating the electromagnetic conversion element onto a magnetic disc; when the characteristics do not satisfy a reference as a result of the inspection, removing the main flexure from the load beam by cleaving the main flexure at a cleavage part disposed in a vicinity of the junction piece; and at least one time joining a sub-flexure having no junction piece to the load beam, from which the main flexure is removed.
    Type: Application
    Filed: August 5, 2003
    Publication date: May 12, 2005
    Inventors: Michiharu Motonishi, Tohru Nakazawa
  • Patent number: 6731476
    Abstract: The invention provides a magnetic head capable of positively preventing electrostatic breakdown of an MR magnetic head device, and a method of manufacturing the magnetic head. A circuit board comprises at least a pair of leads for constructing a circuit, lands connected respectively to the leads, and solder bumps formed respectively on the lands. The solder bumps are arranged in an adjacent relationship and, when the solder bumps are crushed, peripheral portions of the solder bumps are pressed or spread so as to overlap with each other. The magnetic head includes the circuit board.
    Type: Grant
    Filed: July 31, 2000
    Date of Patent: May 4, 2004
    Assignee: Alps Electric Co., Ltd.
    Inventors: Michiharu Motonishi, Michiaki Moroe
  • Publication number: 20040075946
    Abstract: A head gimbal assembly has a gimbal suspension that includes a metal flexure bonded to a slider having a magnetic head element. This head gimbal assembly prevents damage from electrostatic discharge more efficiently. In the head gimbal assembly, a region of an oxide film on a slider-bonding surface of the flexure is completely or incompletely removed to form a film-removed region, and conductive adhesive resin is disposed between the film-removed region and the slider.
    Type: Application
    Filed: October 8, 2003
    Publication date: April 22, 2004
    Applicant: Alps Electric Co., Ltd.
    Inventors: Michiharu Motonishi, Mitsuru Watanabe
  • Patent number: 6717068
    Abstract: The invention provides a magnetic head capable of positively preventing electrostatic breakdown of an MR magnetic head device, and a method of manufacturing the magnetic head. A circuit board comprises at least a pair of leads for constructing a circuit, lands connected respectively to the leads, and solder bumps formed respectively on the lands. The solder bumps are arranged in an adjacent relationship and, when the solder bumps are crushed, peripheral portions of the solder bumps are pressed or spread so as to overlap with each other. The magnetic head includes the circuit board.
    Type: Grant
    Filed: October 2, 2002
    Date of Patent: April 6, 2004
    Assignee: Alps Electric Co., Ltd.
    Inventors: Michiharu Motonishi, Michiaki Moroe
  • Publication number: 20030035252
    Abstract: The invention provides a magnetic head capable of positively preventing electrostatic breakdown of an MR magnetic head device, and a method of manufacturing the magnetic head. A circuit board comprises at least a pair of leads for constructing a circuit, lands connected respectively to the leads, and solder bumps formed respectively on the lands. The solder bumps are arranged in an adjacent relationship and, when the solder bumps are crushed, peripheral portions of the solder bumps are pressed or spread so as to overlap with each other. The magnetic head includes the circuit board.
    Type: Application
    Filed: October 2, 2002
    Publication date: February 20, 2003
    Applicant: ALPS ELECTRIC CO., LTD.
    Inventors: Michiharu Motonishi, Michiaki Moroe
  • Publication number: 20020149888
    Abstract: The invention provides a magnetic head capable of positively preventing electrostatic breakdown of an MR magnetic head device, and a method of manufacturing the magnetic head. A circuit board comprises at least a pair of leads for constructing a circuit, lands connected respectively to the leads, and solder bumps formed respectively on the lands. The solder bumps are arranged in an adjacent relationship and, when the solder bumps are crushed, peripheral portions of the solder bumps are pressed or spread so as to overlap with each other. The magnetic head includes the circuit board.
    Type: Application
    Filed: April 10, 2002
    Publication date: October 17, 2002
    Inventors: Michiharu Motonishi, Michiaki Moroe
  • Patent number: 5959450
    Abstract: A fastening portion 1a of a plate spring 1 of a head unit H supported by a support member 12 and an arm portion 1d is pressed by a pressurizing pin 22a to impart the same displacement to a slider 4 as a Z-height when the head unit is mounted to an apparatus. In this condition, the inclination of the slider 4 is measured, and, further, the arm portion 1d is twisted by a tool 30 to correct deformation in the roll direction. Since the plate spring 1 is corrected in the same condition as when the unit is mounted to the apparatus, an accurate correcting operation is conducted.
    Type: Grant
    Filed: January 27, 1998
    Date of Patent: September 28, 1999
    Assignee: Alps Electric Co., Ltd.
    Inventors: Michiaki Moroe, Michiharu Motonishi, Hitoshi Yamazaki, Kazunari Takida