Patents by Inventor Michiharu OGAMI
Michiharu OGAMI has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 10113875Abstract: A module includes a first rigid substrate including an analog circuit; a second rigid substrate including a digital circuit; a third rigid substrate including an angular velocity sensor; a first connecting portion that connects the first rigid substrate and the second rigid substrate so as to electrically connect the analog circuit and the digital circuit, and that has flexibility; and a second connecting portion that connects the first rigid substrate and the third rigid substrate so as to electrically connect the analog circuit and the angular velocity sensor, and that has flexibility.Type: GrantFiled: March 15, 2016Date of Patent: October 30, 2018Assignee: Seiko Epson CorporationInventors: Masayasu Sakuma, Yoshihiro Kobayashi, Shojiro Kitamura, Taketo Chino, Michiharu Ogami
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Patent number: 10072954Abstract: A module includes a sensor device, a mounting substrate that has a plurality of mounting faces, a portion between the mounting faces adjacent to each other being foldable, a supporting member having fixing faces, wherein the sensor device is mounted on at least one of the mounting faces, each of the mounting faces is disposed along each of the fixing faces, and the sensor device is disposed on the supporting member side.Type: GrantFiled: December 16, 2015Date of Patent: September 11, 2018Assignee: Seiko Epson CorporationInventors: Masayasu Sakuma, Yoshihiro Kobayashi, Shojiro Kitamura, Taketo Chino, Michiharu Ogami
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Publication number: 20160195396Abstract: A module includes a first rigid substrate including an analog circuit; a second rigid substrate including a digital circuit; a third rigid substrate including an angular velocity sensor; a first connecting portion that connects the first rigid substrate and the second rigid substrate so as to electrically connect the analog circuit and the digital circuit, and that has flexibility; and a second connecting portion that connects the first rigid substrate and the third rigid substrate so as to electrically connect the analog circuit and the angular velocity sensor, and that has flexibility.Type: ApplicationFiled: March 15, 2016Publication date: July 7, 2016Inventors: Masayasu SAKUMA, Yoshihiro KOBAYASHI, Shojiro KITAMURA, Taketo CHINO, Michiharu OGAMI
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Patent number: 9316499Abstract: A module includes a first rigid substrate including an analog circuit; a second rigid substrate including a digital circuit; a third rigid substrate including an angular velocity sensor; a first connecting portion that connects the first rigid substrate and the second rigid substrate so as to electrically connect the analog circuit and the digital circuit, and that has flexibility; and a second connecting portion that connects the first rigid substrate and the third rigid substrate so as to electrically connect the analog circuit and the angular velocity sensor, and that has flexibility.Type: GrantFiled: May 23, 2012Date of Patent: April 19, 2016Assignee: Seiko Epson CorporationInventors: Masayasu Sakuma, Yoshihiro Kobayashi, Shojiro Kitamura, Taketo Chino, Michiharu Ogami
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Publication number: 20160097660Abstract: A module includes a sensor device, a mounting substrate that has a plurality of mounting faces, a portion between the mounting faces adjacent to each other being foldable, a supporting member having fixing faces, wherein the sensor device is mounted on at least one of the mounting faces, each of the mounting faces is disposed along each of the fixing faces, and the sensor device is disposed on the supporting member side.Type: ApplicationFiled: December 16, 2015Publication date: April 7, 2016Inventors: Masayasu SAKUMA, Yoshihiro KOBAYASHI, Shojiro KITAMURA, Taketo CHINO, Michiharu OGAMI
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Patent number: 9243909Abstract: A module includes a sensor device, a mounting substrate that has a plurality of mounting faces, a portion between the mounting faces adjacent to each other being foldable, a supporting member having fixing faces, wherein the sensor device is mounted on at least one of the mounting faces, each of the mounting faces is disposed along each of the fixing faces, and the sensor device is disposed on the supporting member side.Type: GrantFiled: May 23, 2012Date of Patent: January 26, 2016Assignee: Seiko Epson CorporationInventors: Masayasu Sakuma, Yoshihiro Kobayashi, Shojiro Kitamura, Taketo Chino, Michiharu Ogami
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Patent number: 9052220Abstract: A maintaining member includes alignment portions that determine a maintaining position of a module, in which each of the alignment portions has a mounting face to fix the module. When the maintaining member is partitioned into a first region to a fourth region by a first axis and a second axis that are orthogonal to each other in plan view with respect to the center of the maintaining member, the alignment portions are provided at the regions one by one.Type: GrantFiled: May 23, 2012Date of Patent: June 9, 2015Assignee: SEIKO EPSON CORPORATIONInventors: Masayasu Sakuma, Yoshihiro Kobayashi, Shojiro Kitamura, Taketo Chino, Michiharu Ogami
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Publication number: 20120304768Abstract: A module includes a first rigid substrate including an analog circuit; a second rigid substrate including a digital circuit; a third rigid substrate including an angular velocity sensor; a first connecting portion that connects the first rigid substrate and the second rigid substrate so as to electrically connect the analog circuit and the digital circuit, and that has flexibility; and a second connecting portion that connects the first rigid substrate and the third rigid substrate so as to electrically connect the analog circuit and the angular velocity sensor, and that has flexibility.Type: ApplicationFiled: May 23, 2012Publication date: December 6, 2012Applicant: SEIKO EPSON CORPORATIONInventors: Masayasu SAKUMA, Yoshihiro KOBAYASHI, Shojiro KITAMURA, Taketo CHINO, Michiharu OGAMI
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Publication number: 20120304765Abstract: A module includes a sensor device, a mounting substrate that has a plurality of mounting faces, a portion between the mounting faces adjacent to each other being foldable, a supporting member having fixing faces, wherein the sensor device is mounted on at least one of the mounting faces, each of the mounting faces is disposed along each of the fixing faces, and the sensor device is disposed on the supporting member side.Type: ApplicationFiled: May 23, 2012Publication date: December 6, 2012Applicant: SEIKO EPSON CORPORATIONInventors: Masayasu SAKUMA, Yoshihiro KOBAYASHI, Shojiro KITAMURA, Taketo CHINO, Michiharu OGAMI
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Publication number: 20120307459Abstract: A maintaining member includes alignment portions that determine a maintaining position of a module, in which each of the alignment portions has a mounting face to fix the module. When the maintaining member is partitioned into a first region to a fourth region by a first axis and a second axis that are orthogonal to each other in plan view with respect to the center of the maintaining member, the alignment portions are provided at the regions one by one.Type: ApplicationFiled: May 23, 2012Publication date: December 6, 2012Applicant: SEIKO EPSON CORPORATIONInventors: Masayasu SAKUMA, Yoshihiro KOBAYASHI, Shojiro KITAMURA, Taketo CHINO, Michiharu OGAMI