Abstract: A radio frequency module comprises a first component, a second component and a pedestal all supported by a first surface. The first component, the second component and pedestal all extend along a first axis perpendicular to the first surface. Along the first axis, the first component is longer than the second component and the pedestal is between the second component and the first surface. A first solder is between the first surface and the first component, a second solder is between the pedestal and the second component, and a third solder is between the first surface and the pedestal. Along a second axis which is parallel to the first surface, a first dimension of the first solder is greater than a second dimension of the second solder, and a third dimension of the third solder is greater than the second dimension.

Abstract: A sub-module includes a plurality of electronic components and a first support. Each of the plurality of electronic components includes a plurality of internal terminals. The first support covers and supports the plurality of electronic components to expose the plurality of internal terminals. A first conductive film is disposed on at least a part of the first support. A second support supports the sub-module and supports an antenna. A plurality of external terminals exposed from the second support are connected to the plurality of internal terminals.

Abstract: Electronic components are included in each one of submodules. Each electronic component includes inner terminals. A first support member covers and supports, the electronic components so as to expose the inner terminals. A second support member supports the submodules. Each one of the submodules includes outer terminals, and the outer terminals are coupled to respective inner terminals and exposed from the second support member. At least one of the submodules has a first conductive film formed on at least part of the first support member.

Abstract: An antenna module includes a dielectric substrate and a radiation element disposed on the dielectric substrate. The dielectric substrate includes a flat portion (131) and a flat portion (130) having mutually different normal directions, and a bent portion connecting the flat portion (131) and the flat portion (130) to each other. The flat portion (131) has a protruding portion partially protruding in a direction toward the flat portion (130) along the flat portion (131) from a boundary portion between the bent portion and the flat portion (131). The flat portion (131) and the bent portion are connected to each other at a position where the protruding portion is not provided in the flat portion (131). At least a part of the radiation element is disposed on the protruding portion.

Abstract: An antenna module includes an antenna substrate and a feed circuit. The antenna substrate has an upper surface and a lower surface, and a radiating element having a flat plate shape is arranged in the antenna substrate. The feed circuit 105 is mounted on the lower surface of the antenna substrate and supplies a radio frequency signal to the radiating element. The antenna substrate includes a dielectric substrate on which the radiating element is arranged, a ground electrode, a feed wiring, and carbides. The ground electrode is arranged between the radiating element and the lower surface in the dielectric substrate. The feed wiring transmits the radio frequency signal supplied from the feed circuit to the radiating element. The carbides are disposed on at least a part of a side surface connecting the upper surface and the lower surface in the dielectric substrate.

Abstract: A wiring substrate for supplying a radio frequency signal to an antenna module having a first antenna element and a second antenna element includes a dielectric substrate having a laminated structure, a first power supply wiring that is formed in the dielectric substrate and supplies a radio frequency signal to the first antenna element, a second power supply wiring that is formed in the dielectric substrate and supplies a radio frequency signal to the second antenna element, and a ground conductor that is formed in a layer different from any one of a layer in which the first power supply wiring is formed and a layer in which the second power supply wiring is formed, and in which a hole portion is formed in a portion between the first power supply wiring and the second power supply wiring of the dielectric substrate toward the ground conductor.

Abstract: An antenna module includes a dielectric substrate and a radiation element disposed on the dielectric substrate. The dielectric substrate includes a flat portion (131) and a flat portion (130) having mutually different normal directions, and a bent portion connecting the flat portion (131) and the flat portion (130) to each other. The flat portion (131) has a protruding portion partially protruding in a direction toward the flat portion (130) along the flat portion (131) from a boundary portion between the bent portion and the flat portion (131). The flat portion (131) and the bent portion are connected to each other at a position where the protruding portion is not provided in the flat portion (131). At least a part of the radiation element is disposed on the protruding portion.

Abstract: An antenna module includes a dielectric substrate and a radiation element disposed on the dielectric substrate. The dielectric substrate includes a flat portion (131) and a flat portion (130) having mutually different normal directions, and a bent portion connecting the flat portion (131) and the flat portion (130) to each other. The flat portion (131) has a protruding portion partially protruding in a direction toward the flat portion (130) along the flat portion (131) from a boundary portion between the bent portion and the flat portion (131). The flat portion (131) and the bent portion are connected to each other at a position where the protruding portion is not provided in the flat portion (131). At least a part of the radiation element is disposed on the protruding portion.

Abstract: An antenna module includes a dielectric substrate and a radiation element disposed on the dielectric substrate. The dielectric substrate includes a flat portion (131) and a flat portion (130) having mutually different normal directions, and a bent portion connecting the flat portion (131) and the flat portion (130) to each other. The flat portion (131) has a protruding portion partially protruding in a direction toward the flat portion (130) along the flat portion (131) from a boundary portion between the bent portion and the flat portion (131). The flat portion (131) and the bent portion are connected to each other at a position where the protruding portion is not provided in the flat portion (131). At least a part of the radiation element is disposed on the protruding portion.

Abstract: An antenna module includes a dielectric substrate and a radiation element disposed on the dielectric substrate. The dielectric substrate includes a flat portion (131) and a flat portion (130) having mutually different normal directions, and a bent portion connecting the flat portion (131) and the flat portion (130) to each other. The flat portion (131) has a protruding portion partially protruding in a direction toward the flat portion (130) along the flat portion (131) from a boundary portion between the bent portion and the flat portion (131). The flat portion (131) and the bent portion are connected to each other at a position where the protruding portion is not provided in the flat portion (131). At least a part of the radiation element is disposed on the protruding portion.

Abstract: A wiring substrate for supplying a radio frequency signal to an antenna module having a first antenna element and a second antenna element includes a dielectric substrate having a laminated structure, a first power supply wiring that is formed in the dielectric substrate and supplies a radio frequency signal to the first antenna element, a second power supply wiring that is formed in the dielectric substrate and supplies a radio frequency signal to the second antenna element, and a ground conductor that is formed in a layer different from any one of a layer in which the first power supply wiring is formed and a layer in which the second power supply wiring is formed, and in which a hole portion is formed in a portion between the first power supply wiring and the second power supply wiring of the dielectric substrate toward the ground conductor.

Abstract: A multilayer substrate includes a first dielectric layer and a conductor pattern disposed in at least an interior of the first dielectric layer. A second dielectric layer formed of a different material from a material of the first dielectric layer is disposed on the multilayer substrate. At least one radiation element is formed on the second dielectric layer. A feeding wire connects the radiation element and the conductor pattern. The feeding wire includes a conductor pin that is conductive and extends in a thickness direction of the second dielectric layer. The conductor pin electrically connects the radiation element and the conductor pattern. Provided is an antenna-integrated type communication module having such a structure that the accuracy of circuit simulation is easily enhanced and the degree of freedom in selection of dielectric materials is large.

Abstract: An antenna module includes a dielectric substrate and a radiation element disposed on the dielectric substrate. The dielectric substrate includes a flat portion (131) and a flat portion (130) having mutually different normal directions, and a bent portion connecting the flat portion (131) and the flat portion (130) to each other. The flat portion (131) has a protruding portion partially protruding in a direction toward the flat portion (130) along the flat portion (131) from a boundary portion between the bent portion and the flat portion (131). The flat portion (131) and the bent portion are connected to each other at a position where the protruding portion is not provided in the flat portion (131). At least a part of the radiation element is disposed on the protruding portion.

Abstract: An antenna that is formed of a conductor pattern is disposed on a dielectric substrate. A high-frequency semiconductor device that supplies a high-frequency signal to the antenna is mounted on the bottom surface of the dielectric substrate. A plurality of conductor columns project from the bottom surface. The conductor columns are embedded in a dielectric member that is disposed on the bottom surface. An end of each of the conductor columns is exposed through the dielectric member. The dielectric member defines a mounting surface that faces a mounting substrate. A step is formed in a side surface of a composite structure that includes the dielectric substrate and the dielectric member, and a side surface extending from the mounting surface to the step is more recessed than a side surface that is located above the step.

Abstract: An antenna that is formed of a conductor pattern is disposed on a dielectric substrate. A high-frequency semiconductor device that supplies a high-frequency signal to the antenna is mounted on the bottom surface of the dielectric substrate. A plurality of conductor columns project from the bottom surface. The conductor columns are embedded in a dielectric member that is disposed on the bottom surface. An end of each of the conductor columns is exposed through the dielectric member. The dielectric member defines a mounting surface that faces a mounting substrate. A step is formed in a side surface of a composite structure that includes the dielectric substrate and the dielectric member, and a side surface extending from the mounting surface to the step is more recessed than a side surface that is located above the step.

Abstract: A multilayer substrate includes a first dielectric layer and a conductor pattern disposed in at least an interior of the first dielectric layer. A second dielectric layer formed of a different material from a material of the first dielectric layer is disposed on the multilayer substrate. At least one radiation element is formed on the second dielectric layer. A feeding wire connects the radiation element and the conductor pattern. The feeding wire includes a conductor pin that is conductive and extends in a thickness direction of the second dielectric layer. The conductor pin electrically connects the radiation element and the conductor pattern. Provided is an antenna-integrated type communication module having such a structure that the accuracy of circuit simulation is easily enhanced and the degree of freedom in selection of dielectric materials is large.

Abstract: An antenna that is formed of a conductor pattern is disposed on a dielectric substrate. A high-frequency semiconductor device that supplies a high-frequency signal to the antenna is mounted on the bottom surface of the dielectric substrate. A plurality of conductor columns project from the bottom surface. The conductor columns are embedded in a dielectric member that is disposed on the bottom surface. An end of each of the conductor columns is exposed through the dielectric member. The dielectric member defines a mounting surface that faces a mounting substrate. A step is formed in a side surface of a composite structure that includes the dielectric substrate and the dielectric member, and a side surface extending from the mounting surface to the step is more recessed than a side surface that is located above the step.

Abstract: Two high frequency antennas are provided in a multilayer substrate. Each high frequency antenna is configured of a radiation element, a high frequency power supply line, and a high frequency power supply unit. A low frequency antenna is configured of a series radiation element, a low frequency power supply line, and a lower frequency power supply unit. The series radiation element is formed of two radiation elements connected by a radiation element connection line. One end side of the series radiation element is connected to the low frequency power supply unit via the low frequency power supply line. Open stubs to block transmission of a high frequency signal (SH) are connected to the radiation element connection line and the low frequency power supply line. Short stubs to block transmission of a low frequency signal (SL) are connected to the high frequency power supply lines.