Patents by Inventor Michihiko Nakamura

Michihiko Nakamura has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20250032652
    Abstract: Described is a stable radiopharmaceutical composition in which the decrease in the radiochemical purity over time is suppressed even in the case where the radioactivity concentration is high immediately after production. The stabilized radiopharmaceutical composition includes a polypeptide labeled with a radionuclide and having a group selected from the group consisting of a thioether group and a thiol group, as an active ingredient, a solubilizing agent having an ethylene glycol group, a solvent including water, and a stabilizer selected from the group consisting of a sulfur-containing amino acid or a salt thereof, a sulfur-containing amino acid derivative or a salt thereof, and a polysaccharide.
    Type: Application
    Filed: November 29, 2022
    Publication date: January 30, 2025
    Applicant: NIHON MEDI-PHYSICS CO., LTD.
    Inventors: Hiroaki ICHIKAWA, Shunsuke NAKAMURA, Michihiko TSUSHIMA, Takumi SATO, Satoshi KISHIMOTO, Yuta OTSUKA
  • Patent number: 5633289
    Abstract: A process and a polyurethane material for molding a semi-rigid integral skin foam which comprising an integral skin having a low degree of foaming and a core having a high degree of foaming. The process includes evacuating a mold cavity to reduce the pressure thereof below atmospheric pressure; injecting into the evacuated mold cavity a polyurethane material; and foaming the material to fill the cavity. The polyurethane material contains a polyol component and an isocyanate component with, at most, 5 parts by weight of a solvent for 100 parts by weight of the polyol component, in the absence of freon.
    Type: Grant
    Filed: March 14, 1994
    Date of Patent: May 27, 1997
    Assignee: Toyoda Gosei Co., Ltd.
    Inventors: Michihiko Nakamura, Masanao Ishikake, Yukio Kawakita, Akira Mabuchi, Osamu Yamanaka
  • Patent number: 5476619
    Abstract: A process for molding a semi-rigid integral skin foam which comprising an integral skin having a low degree of foaming and a core having a high degree of foaming. The process includes evacuating a mold cavity to a pressure of from above 50 to 700 Torr; injecting, into the evacuated mold cavity, a polyurethane material which contains a polyol component and an isocyanate component with air bubbles introduced therein by air loading, in the substantial absence of a foaming agent; and foaming the material to fill the cavity.
    Type: Grant
    Filed: April 13, 1994
    Date of Patent: December 19, 1995
    Assignee: Toyoda Gosei Co., Ltd.
    Inventors: Michihiko Nakamura, Masanao Ishikake, Yukio Kawakita, Akira Mabuchi, Osamu Yamanaka