Abstract: It is disclosed that a metal cored board which comprises an electrically conductive layer whose one surface at least composed of a hardly oxidizable metal, an insulating organic polymer layer baked on the surface of the hardly oxidizable metal, and a metal core adhered on the insulating organic polymer layer, and a method for manufacturing a metal cored board, which comprises a step to coat the surface of a hardly oxidizable metal layer of an electrically conductive metal foil with an insulating varnish, a step to bake a layer of the varnish, and a step to adhere a metal core on the baked varnish layer.

Abstract: It is disclosed that a metal cored board which comprises a base metal core, an easily solderable metal plating layer formed on one surface of the base metal core, an electrically insulating layer formed on the another surface of the base metal core, and an electrically conductive metal layer formed on the electrically insulating layer, a method for manufacturing a metal cored board, which comprises a step to plate both surface of a base metal core with an easily solderable metal, a step to form an electrically insulating layer on one surface of the easily solderable metal plating layer, and a step to form an electrically conductive metal layer on the electrically insulating layer.