Patents by Inventor Michihiro Kaai

Michihiro Kaai has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11643576
    Abstract: A pressure-sensitive adhesive composition includes a block copolymer containing a polymer block (A) and a (meth)acrylic polymer block (B), wherein the polymer block (A) contains either or both of a maleimide compound and an amide group-containing vinyl compound as a constitutional monomer thereof and has a glass transition temperature of 100° C. or higher, and the (meth)acrylic polymer block (B) contains at least one selected from compounds represented by general formula (1) as a major constitutional monomer thereof and has a glass transition temperature of 10° C. or below. CH2?CR1—C(?O)O(R2O)n—R3??(1) (wherein, R1 represents hydrogen or a methyl group; R2 represents a linear or branched C2-6 alkylene group; R3 represents hydrogen, a C1-20 alkyl group, or a C6-20 aryl group; and n represents 0 or an integer from 1 to 100.
    Type: Grant
    Filed: February 9, 2018
    Date of Patent: May 9, 2023
    Assignee: TOAGOSEI CO. LTD.
    Inventors: Michihiro Kaai, Kenichi Nakamura, Akitsugu Shibata
  • Publication number: 20230073290
    Abstract: Provided is a polishing composition which contains a water-soluble polymer and is suitable for reducing LPDs. The polishing composition provided in this application includes an abrasive, a water-soluble polymer, and a basic compound. In the polishing composition, the content of a reaction product of a polymerization initiator and a polymerization inhibitor is 0.1 ppb or less of the polishing composition on a weight basis.
    Type: Application
    Filed: July 21, 2022
    Publication date: March 9, 2023
    Applicant: FUJIMI INCORPORATED
    Inventors: Kohsuke TSUCHIYA, Hisanori TANSHO, Yusuke SUGA, Taiki ICHITSUBO, Takayuki TAKEMOTO, Naohiko SAITO, Michihiro KAAI
  • Publication number: 20230002642
    Abstract: A curable composition containing: a methylene malonate compound, and a Lewis acidic compound. The methylene malonate compound is preferably a compound represented by formula (1) or formula (2). In the formulae (1) and (2), X1 to X4 each independently represent O, NR, or C(R)2, R's each independently represent a hydrogen atom, an alkyl group, or an aryl group, R1 and R2 each independently represent an alkyl group or an aryl group, and R3 represents an alkylene group, an arylene group, or a group obtained by combining two or more of these groups.
    Type: Application
    Filed: September 10, 2020
    Publication date: January 5, 2023
    Inventors: Michihiro KAAI, Kento OOMURA, Gen OKABE
  • Publication number: 20220380615
    Abstract: A curable composition containing: a methylene malonate compound; a 2-cyanoacrylate compound; and a Lewis acidic compound. The methylene malonate compound is preferably a compound represented by formula (1) or formula (2). In the formulae (1) and (2), X1 to X4 each independently represent O, NR, or C(R)2, R's each independently represent a hydrogen atom, an alkyl group, or an aryl group, R1 and R2 each independently represent an alkyl group or an aryl group, and R3 represents an alkylene group, an arylene group, or a group obtained by combining two or more of these groups.
    Type: Application
    Filed: September 10, 2020
    Publication date: December 1, 2022
    Inventors: Michihiro KAAI, Kento OOMURA, Gen OKABE
  • Publication number: 20220282135
    Abstract: Provided is a curable-type composition, including a methylene malonate compound, a Lewis acidic compound, and a photo base generator.
    Type: Application
    Filed: September 10, 2020
    Publication date: September 8, 2022
    Inventors: Hiroyuki KAMIMURA, Kento OOMURA, Michihiro KAAI
  • Patent number: 11421131
    Abstract: Provided is a polishing composition which contains a water-soluble polymer and is suitable for reducing LPDs. The polishing composition provided in this application includes an abrasive, a water-soluble polymer, and a basic compound. In the polishing composition, the content of a reaction product of a polymerization initiator and a polymerization inhibitor is 0.1 ppb or less of the polishing composition on a weight basis.
    Type: Grant
    Filed: October 19, 2018
    Date of Patent: August 23, 2022
    Assignees: FUJIMI INCORPORATED, TOAGOSEI CO., LTD.
    Inventors: Kohsuke Tsuchiya, Hisanori Tansho, Yusuke Suga, Taiki Ichitsubo, Takayuki Takemoto, Naohiko Saito, Michihiro Kaai
  • Publication number: 20220059845
    Abstract: A binder for secondary battery electrodes, which enables the achievement of a secondary battery electrode that has higher binding properties than ever before contains a block polymer that has a polymer block (A) and a polymer block (B), and it is configured such that: the polymer block (A) includes less than 30% by mass of a structural unit derived from (meth)acrylic acid to a total structural units of the polymer block (A); and the polymer block (B) includes 30 mass % or more and 100 mass % or less of a structural unit derived from (meth)acrylic acid to a total structural units of the polymer block (B).
    Type: Application
    Filed: December 10, 2019
    Publication date: February 24, 2022
    Applicant: TOAGOSEI CO. LTD.
    Inventors: Michihiro KAAI, Naohiko SAITO, Toshifumi KONDO
  • Publication number: 20210189177
    Abstract: Provided is a polishing composition which contains a water-soluble polymer and is suitable for reducing LPDs. The polishing composition provided in this application includes an abrasive, a water-soluble polymer, and a basic compound. In the polishing composition, the content of a reaction product of a polymerization initiator and a polymerization inhibitor is 0.1 ppb or less of the polishing composition on a weight basis.
    Type: Application
    Filed: October 19, 2018
    Publication date: June 24, 2021
    Applicants: FUJIMI INCORPORATED, TOAGOSEI CO., LTD.
    Inventors: Kohsuke TSUCHIYA, Hisanori TANSHO, Yusuke SUGA, Taiki ICHITSUBO, Takayuki TAKEMOTO, Naohiko SAITO, Michihiro KAAI
  • Patent number: 10982115
    Abstract: An adhesive composition according to the present invention contains a polymerizable monomer (A) and a block copolymer (B) including a polymer block (a) which includes structural units derived from a styrene compound and from a maleimide compound, and an acrylic polymer block (b), in which the polymer block (a) and the acrylic polymer block (b) have a solubility parameter of 10.0 or more and 9.0 or more, respectively; the polymer block (a) contains the structural unit derived from a maleimide compound at a concentration from 30% by mass to 99% by mass with respect to the total mass of the polymer block (a); the polymer block (a) has a glass transition temperature of 150° C. or higher; and the polymer block (b) has a glass transition temperature of 20° C. or lower.
    Type: Grant
    Filed: April 26, 2018
    Date of Patent: April 20, 2021
    Assignee: TOAGOSEI CO., LTD.
    Inventors: Masaru Andou, Yuushi Andou, Akitsugu Shibata, Michihiro Kaai
  • Publication number: 20200048499
    Abstract: An adhesive composition according to the present invention contains a polymerizable monomer (A) and a block copolymer (B) including a polymer block (a) which includes structural units derived from a styrene compound and from a maleimide compound, and an acrylic polymer block (b), in which the polymer block (a) and the acrylic polymer block (b) have a solubility parameter of 10.0 or more and 9.0 or more, respectively; the polymer block (a) contains the structural unit derived from a maleimide compound at a concentration from 30% by mass to 99% by mass with respect to the total mass of the polymer block (a); the polymer block (a) has a glass transition temperature of 150° C. or higher; and the polymer block (b) has a glass transition temperature of 20° C. or lower.
    Type: Application
    Filed: April 26, 2018
    Publication date: February 13, 2020
    Applicant: TOAGOSEI CO., LTD.
    Inventors: Masaru ANDOU, Yuushi ANDOU, Akitsugu SHIBATA, Michihiro KAAI
  • Publication number: 20200002580
    Abstract: A pressure-sensitive adhesive composition includes a block copolymer containing a polymer block (A) and a (meth)acrylic polymer block (B), wherein the polymer block (A) contains either or both of a maleimide compound and an amide group-containing vinyl compound as a constitutional monomer thereof and has a glass transition temperature of 100° C. or higher, and the (meth)acrylic polymer block (B) contains at least one selected from compounds represented by general formula (1) as a major constitutional monomer thereof and has a glass transition temperature of 10° C. or below. CH2?CR1—C(?O)O(R2O)n—R3??(1) (wherein, R1 represents hydrogen or a methyl group; R2 represents a linear or branched C2-6 alkylene group; R3 represents hydrogen, a C1-20 alkyl group, or a C6-20 aryl group; and n represents 0 or an integer from 1 to 100.
    Type: Application
    Filed: February 9, 2018
    Publication date: January 2, 2020
    Applicant: TOAGOSEI CO., LTD.
    Inventors: Michihiro KAAI, Kenichi NAKAMURA, Akitsugu SHIBATA
  • Patent number: 8415433
    Abstract: A process for producing polymer microparticles by suspension polymerization of a vinyl-based monomer in which, when polymer microparticles are produced by suspension polymerization of a vinyl-based monomer, a macromonomer having a radically polymerizable unsaturated group at a terminus of a vinyl-based monomer-derived polymer is used as a dispersion stabilizer.
    Type: Grant
    Filed: July 5, 2007
    Date of Patent: April 9, 2013
    Assignee: Toagosei Co., Ltd.
    Inventors: Hideo Matsuzaki, Akihiro Gotou, Tomotaka Mizuno, Michihiro Kaai
  • Publication number: 20070265399
    Abstract: A continuous polymerization process for producing reactive polymers comprises continuously charging into a first reaction zone at least one functional monomer and polymerizing the monomers to produce a first polymeric product having at least one functional group. This first polymeric product is then continuously directly charged into a second reaction zone together with at least one modifier reactant having a functional group that is complementary to the functional group of the first polymeric product. At least a portion of the modifier reactant reacts with at least one of the functional groups of the first polymeric product to produce a second polymeric product which incorporates at least a portion of the modifier reactant, such that the second polymeric product is a reactive polymer.
    Type: Application
    Filed: January 26, 2007
    Publication date: November 15, 2007
    Inventors: David Schatz, Warunee Srisiri-Sisson, Marco Villalobos, Michihiro Kaai, Yasuhiko Mori
  • Patent number: 7230048
    Abstract: A continuous polymerization process for producing reactive polymers comprises continuously charging into a first reaction zone at least one functional monomer and polymerizing the monomers to produce a first polymeric product having at least one functional group. This first polymeric product is then continuously directly charged into a second reaction zone together with at least one modifier reactant having a functional group that is complementary to the functional group of the first polymeric product. At least a portion of the modifier reactant reacts with at least one of the functional groups of the first polymeric product to produce a second polymeric product which incorporates at least a portion of the modifier reactant, such that the second polymeric product is a reactive polymer.
    Type: Grant
    Filed: August 25, 2000
    Date of Patent: June 12, 2007
    Assignee: BASF Corporation
    Inventors: David D. Schatz, Warunee Srisiri-Sisson, Marco A. Villalobos, Michihiro Kaai, Yasuhiko Mori
  • Patent number: 7163992
    Abstract: A process for producing a copolymer which comprises reacting a vinyl monomer with a macromonomer composition containing a macromonomer. The macromonomer composition is obtained by polymerizing at a temperature of 160 to 350° C. a monomer mixture comprising 10 to 80 wt. % first vinyl monomer having an alkyl group in the ?-position, 0 to 30 wt. % styrene as an optional ingredient, and 0 to 90 wt. % one or more other vinyl monomers based on the total amount of all monomers.
    Type: Grant
    Filed: February 26, 2002
    Date of Patent: January 16, 2007
    Assignee: Toagosei Co., Ltd.
    Inventor: Michihiro Kaai
  • Publication number: 20040171732
    Abstract: A water-based resin dispersion, a method for producing the water-based resin dispersion, and its applications. The water-based resin dispersion of the invention is excellent in permeability, leveling property and chemical stability. The water-based resin dispersion is produced by causing reaction of macromonomer composition and a vinyl monomer in an aqueous medium. The macromonomer composition is obtained by polymerization of a monomer mixture in a temperature range between 160° C. and 350° C., wherein a monomer mixture contains, with respect to the total amount of all monomers provided for the production of the macromonomer composition, for example: a vinyl monomer having alkyl group in the &agr;-position at 10 to 80 weight %; a non-aromatic vinyl monomer having hydrogen atom in the &agr;-position at 90 weight % or less; and styrene at 30 weight % or less. The macromonomer composition includes a hydrophilic monomer unit and a hydrophobic monomer unit.
    Type: Application
    Filed: December 15, 2003
    Publication date: September 2, 2004
    Inventors: Hideo Matsuzaki, Hiroaki Ishii, Kotaro Yoneda, Michihiro Kaai, Akemi Koketsu
  • Publication number: 20040162392
    Abstract: A thermoplastic resin composition which has high plasticization effect and excellent flexibility. It comprises a polymer and a thermoplastic resin. The polymer comprises at least 20 wt. % of at least one monomer unit represented by any of the following formulae (1) to (4) and up to 80 wt %. of another monomer unit. The resin may be a polymethyl methacrylate resin, poly(vinyl chloride) resin, ABS resin, etc.
    Type: Application
    Filed: December 9, 2003
    Publication date: August 19, 2004
    Inventors: Michihiro Kaai, Madoka Furuta
  • Publication number: 20040122195
    Abstract: A process for producing a copolymer which comprises reacting a vinyl monomer with a macromonomer composition containing a macromonomer. The macromonomer composition is obtained by polymerizing at a temperature of 160 to 350° C. a monomer mixture comprising 10 to 80 wt. % first vinyl monomer having an alkyl group in the &agr;-position, 0 to 30 wt. % styrene as an optional ingredient, and 0 to 90 wt. % one or more other vinyl monomers based on the total amount of all monomers.
    Type: Application
    Filed: September 2, 2003
    Publication date: June 24, 2004
    Inventor: Michihiro Kaai
  • Patent number: 6730763
    Abstract: A composition which is useful as a material with excellent weatherability, such as paints, printing ink, adhesive, filler, molding material, or resist, and is especially suitable for use in applications such as OPV and coating materials. The composition comprises as an active ingredient a polymer obtained by continuously polymerizing at a high temperature either a polymerizable monomer having a maleimide group and other polymerizable group or a polymerizable monomer having a succinimide group.
    Type: Grant
    Filed: September 27, 2002
    Date of Patent: May 4, 2004
    Assignee: Toagosei Co., Ltd.
    Inventors: Eiichi Okazaki, Michihiro Kaai
  • Publication number: 20030139554
    Abstract: An weather resistant plasticizer. The plasticizer contains an acrylic polymer, which is obtained by polymerization at a temperature range between 180 and 350° C. The preferred weight average molecular weight of the acrylic polymer is 500 to 10,000. The preferred viscosity of the acrylic polymer is 100,000 cP or less at 25° C. It is preferred that the plasticizer has plasticizing efficiency of 30 to 150. When plasticizing a vinyl chloride resin, it is preferred that the plasticizer contains an acrylic polymer having a Q-value of 11.5 to 16. When plasticizing an ABS resin, it is preferred that the plasticizer contains an acrylic polymer having a Q-value of 13.5 to 16.
    Type: Application
    Filed: October 25, 2002
    Publication date: July 24, 2003
    Inventors: Michihiro Kaai, Madoka Furuta, Satoshi Kayamori, Hiroshi Inukai, Yasuomi Maruyama, Ryoichi Aimiya, Katsuhiro Iwamura