Patents by Inventor Michihiro Kaai
Michihiro Kaai has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 11976220Abstract: Provided is a polishing composition which contains a water-soluble polymer and is suitable for reducing LPDs. The polishing composition provided in this application includes an abrasive, a water-soluble polymer, and a basic compound. In the polishing composition, the content of a reaction product of a polymerization initiator and a polymerization inhibitor is 0.1 ppb or less of the polishing composition on a weight basis.Type: GrantFiled: July 21, 2022Date of Patent: May 7, 2024Assignee: FUJIMI INCORPORATEDInventors: Kohsuke Tsuchiya, Hisanori Tansho, Yusuke Suga, Taiki Ichitsubo, Takayuki Takemoto, Naohiko Saito, Michihiro Kaai
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Patent number: 11643576Abstract: A pressure-sensitive adhesive composition includes a block copolymer containing a polymer block (A) and a (meth)acrylic polymer block (B), wherein the polymer block (A) contains either or both of a maleimide compound and an amide group-containing vinyl compound as a constitutional monomer thereof and has a glass transition temperature of 100° C. or higher, and the (meth)acrylic polymer block (B) contains at least one selected from compounds represented by general formula (1) as a major constitutional monomer thereof and has a glass transition temperature of 10° C. or below. CH2?CR1—C(?O)O(R2O)n—R3??(1) (wherein, R1 represents hydrogen or a methyl group; R2 represents a linear or branched C2-6 alkylene group; R3 represents hydrogen, a C1-20 alkyl group, or a C6-20 aryl group; and n represents 0 or an integer from 1 to 100.Type: GrantFiled: February 9, 2018Date of Patent: May 9, 2023Assignee: TOAGOSEI CO. LTD.Inventors: Michihiro Kaai, Kenichi Nakamura, Akitsugu Shibata
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Publication number: 20230073290Abstract: Provided is a polishing composition which contains a water-soluble polymer and is suitable for reducing LPDs. The polishing composition provided in this application includes an abrasive, a water-soluble polymer, and a basic compound. In the polishing composition, the content of a reaction product of a polymerization initiator and a polymerization inhibitor is 0.1 ppb or less of the polishing composition on a weight basis.Type: ApplicationFiled: July 21, 2022Publication date: March 9, 2023Applicant: FUJIMI INCORPORATEDInventors: Kohsuke TSUCHIYA, Hisanori TANSHO, Yusuke SUGA, Taiki ICHITSUBO, Takayuki TAKEMOTO, Naohiko SAITO, Michihiro KAAI
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Publication number: 20230002642Abstract: A curable composition containing: a methylene malonate compound, and a Lewis acidic compound. The methylene malonate compound is preferably a compound represented by formula (1) or formula (2). In the formulae (1) and (2), X1 to X4 each independently represent O, NR, or C(R)2, R's each independently represent a hydrogen atom, an alkyl group, or an aryl group, R1 and R2 each independently represent an alkyl group or an aryl group, and R3 represents an alkylene group, an arylene group, or a group obtained by combining two or more of these groups.Type: ApplicationFiled: September 10, 2020Publication date: January 5, 2023Inventors: Michihiro KAAI, Kento OOMURA, Gen OKABE
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Publication number: 20220380615Abstract: A curable composition containing: a methylene malonate compound; a 2-cyanoacrylate compound; and a Lewis acidic compound. The methylene malonate compound is preferably a compound represented by formula (1) or formula (2). In the formulae (1) and (2), X1 to X4 each independently represent O, NR, or C(R)2, R's each independently represent a hydrogen atom, an alkyl group, or an aryl group, R1 and R2 each independently represent an alkyl group or an aryl group, and R3 represents an alkylene group, an arylene group, or a group obtained by combining two or more of these groups.Type: ApplicationFiled: September 10, 2020Publication date: December 1, 2022Inventors: Michihiro KAAI, Kento OOMURA, Gen OKABE
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Publication number: 20220282135Abstract: Provided is a curable-type composition, including a methylene malonate compound, a Lewis acidic compound, and a photo base generator.Type: ApplicationFiled: September 10, 2020Publication date: September 8, 2022Inventors: Hiroyuki KAMIMURA, Kento OOMURA, Michihiro KAAI
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Patent number: 11421131Abstract: Provided is a polishing composition which contains a water-soluble polymer and is suitable for reducing LPDs. The polishing composition provided in this application includes an abrasive, a water-soluble polymer, and a basic compound. In the polishing composition, the content of a reaction product of a polymerization initiator and a polymerization inhibitor is 0.1 ppb or less of the polishing composition on a weight basis.Type: GrantFiled: October 19, 2018Date of Patent: August 23, 2022Assignees: FUJIMI INCORPORATED, TOAGOSEI CO., LTD.Inventors: Kohsuke Tsuchiya, Hisanori Tansho, Yusuke Suga, Taiki Ichitsubo, Takayuki Takemoto, Naohiko Saito, Michihiro Kaai
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Publication number: 20220059845Abstract: A binder for secondary battery electrodes, which enables the achievement of a secondary battery electrode that has higher binding properties than ever before contains a block polymer that has a polymer block (A) and a polymer block (B), and it is configured such that: the polymer block (A) includes less than 30% by mass of a structural unit derived from (meth)acrylic acid to a total structural units of the polymer block (A); and the polymer block (B) includes 30 mass % or more and 100 mass % or less of a structural unit derived from (meth)acrylic acid to a total structural units of the polymer block (B).Type: ApplicationFiled: December 10, 2019Publication date: February 24, 2022Applicant: TOAGOSEI CO. LTD.Inventors: Michihiro KAAI, Naohiko SAITO, Toshifumi KONDO
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Publication number: 20210189177Abstract: Provided is a polishing composition which contains a water-soluble polymer and is suitable for reducing LPDs. The polishing composition provided in this application includes an abrasive, a water-soluble polymer, and a basic compound. In the polishing composition, the content of a reaction product of a polymerization initiator and a polymerization inhibitor is 0.1 ppb or less of the polishing composition on a weight basis.Type: ApplicationFiled: October 19, 2018Publication date: June 24, 2021Applicants: FUJIMI INCORPORATED, TOAGOSEI CO., LTD.Inventors: Kohsuke TSUCHIYA, Hisanori TANSHO, Yusuke SUGA, Taiki ICHITSUBO, Takayuki TAKEMOTO, Naohiko SAITO, Michihiro KAAI
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Patent number: 10982115Abstract: An adhesive composition according to the present invention contains a polymerizable monomer (A) and a block copolymer (B) including a polymer block (a) which includes structural units derived from a styrene compound and from a maleimide compound, and an acrylic polymer block (b), in which the polymer block (a) and the acrylic polymer block (b) have a solubility parameter of 10.0 or more and 9.0 or more, respectively; the polymer block (a) contains the structural unit derived from a maleimide compound at a concentration from 30% by mass to 99% by mass with respect to the total mass of the polymer block (a); the polymer block (a) has a glass transition temperature of 150° C. or higher; and the polymer block (b) has a glass transition temperature of 20° C. or lower.Type: GrantFiled: April 26, 2018Date of Patent: April 20, 2021Assignee: TOAGOSEI CO., LTD.Inventors: Masaru Andou, Yuushi Andou, Akitsugu Shibata, Michihiro Kaai
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Publication number: 20200048499Abstract: An adhesive composition according to the present invention contains a polymerizable monomer (A) and a block copolymer (B) including a polymer block (a) which includes structural units derived from a styrene compound and from a maleimide compound, and an acrylic polymer block (b), in which the polymer block (a) and the acrylic polymer block (b) have a solubility parameter of 10.0 or more and 9.0 or more, respectively; the polymer block (a) contains the structural unit derived from a maleimide compound at a concentration from 30% by mass to 99% by mass with respect to the total mass of the polymer block (a); the polymer block (a) has a glass transition temperature of 150° C. or higher; and the polymer block (b) has a glass transition temperature of 20° C. or lower.Type: ApplicationFiled: April 26, 2018Publication date: February 13, 2020Applicant: TOAGOSEI CO., LTD.Inventors: Masaru ANDOU, Yuushi ANDOU, Akitsugu SHIBATA, Michihiro KAAI
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Publication number: 20200002580Abstract: A pressure-sensitive adhesive composition includes a block copolymer containing a polymer block (A) and a (meth)acrylic polymer block (B), wherein the polymer block (A) contains either or both of a maleimide compound and an amide group-containing vinyl compound as a constitutional monomer thereof and has a glass transition temperature of 100° C. or higher, and the (meth)acrylic polymer block (B) contains at least one selected from compounds represented by general formula (1) as a major constitutional monomer thereof and has a glass transition temperature of 10° C. or below. CH2?CR1—C(?O)O(R2O)n—R3??(1) (wherein, R1 represents hydrogen or a methyl group; R2 represents a linear or branched C2-6 alkylene group; R3 represents hydrogen, a C1-20 alkyl group, or a C6-20 aryl group; and n represents 0 or an integer from 1 to 100.Type: ApplicationFiled: February 9, 2018Publication date: January 2, 2020Applicant: TOAGOSEI CO., LTD.Inventors: Michihiro KAAI, Kenichi NAKAMURA, Akitsugu SHIBATA
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Patent number: 8415433Abstract: A process for producing polymer microparticles by suspension polymerization of a vinyl-based monomer in which, when polymer microparticles are produced by suspension polymerization of a vinyl-based monomer, a macromonomer having a radically polymerizable unsaturated group at a terminus of a vinyl-based monomer-derived polymer is used as a dispersion stabilizer.Type: GrantFiled: July 5, 2007Date of Patent: April 9, 2013Assignee: Toagosei Co., Ltd.Inventors: Hideo Matsuzaki, Akihiro Gotou, Tomotaka Mizuno, Michihiro Kaai
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Publication number: 20070265399Abstract: A continuous polymerization process for producing reactive polymers comprises continuously charging into a first reaction zone at least one functional monomer and polymerizing the monomers to produce a first polymeric product having at least one functional group. This first polymeric product is then continuously directly charged into a second reaction zone together with at least one modifier reactant having a functional group that is complementary to the functional group of the first polymeric product. At least a portion of the modifier reactant reacts with at least one of the functional groups of the first polymeric product to produce a second polymeric product which incorporates at least a portion of the modifier reactant, such that the second polymeric product is a reactive polymer.Type: ApplicationFiled: January 26, 2007Publication date: November 15, 2007Inventors: David Schatz, Warunee Srisiri-Sisson, Marco Villalobos, Michihiro Kaai, Yasuhiko Mori
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Patent number: 7230048Abstract: A continuous polymerization process for producing reactive polymers comprises continuously charging into a first reaction zone at least one functional monomer and polymerizing the monomers to produce a first polymeric product having at least one functional group. This first polymeric product is then continuously directly charged into a second reaction zone together with at least one modifier reactant having a functional group that is complementary to the functional group of the first polymeric product. At least a portion of the modifier reactant reacts with at least one of the functional groups of the first polymeric product to produce a second polymeric product which incorporates at least a portion of the modifier reactant, such that the second polymeric product is a reactive polymer.Type: GrantFiled: August 25, 2000Date of Patent: June 12, 2007Assignee: BASF CorporationInventors: David D. Schatz, Warunee Srisiri-Sisson, Marco A. Villalobos, Michihiro Kaai, Yasuhiko Mori
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Patent number: 7163992Abstract: A process for producing a copolymer which comprises reacting a vinyl monomer with a macromonomer composition containing a macromonomer. The macromonomer composition is obtained by polymerizing at a temperature of 160 to 350° C. a monomer mixture comprising 10 to 80 wt. % first vinyl monomer having an alkyl group in the ?-position, 0 to 30 wt. % styrene as an optional ingredient, and 0 to 90 wt. % one or more other vinyl monomers based on the total amount of all monomers.Type: GrantFiled: February 26, 2002Date of Patent: January 16, 2007Assignee: Toagosei Co., Ltd.Inventor: Michihiro Kaai
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Publication number: 20040171732Abstract: A water-based resin dispersion, a method for producing the water-based resin dispersion, and its applications. The water-based resin dispersion of the invention is excellent in permeability, leveling property and chemical stability. The water-based resin dispersion is produced by causing reaction of macromonomer composition and a vinyl monomer in an aqueous medium. The macromonomer composition is obtained by polymerization of a monomer mixture in a temperature range between 160° C. and 350° C., wherein a monomer mixture contains, with respect to the total amount of all monomers provided for the production of the macromonomer composition, for example: a vinyl monomer having alkyl group in the &agr;-position at 10 to 80 weight %; a non-aromatic vinyl monomer having hydrogen atom in the &agr;-position at 90 weight % or less; and styrene at 30 weight % or less. The macromonomer composition includes a hydrophilic monomer unit and a hydrophobic monomer unit.Type: ApplicationFiled: December 15, 2003Publication date: September 2, 2004Inventors: Hideo Matsuzaki, Hiroaki Ishii, Kotaro Yoneda, Michihiro Kaai, Akemi Koketsu
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Publication number: 20040162392Abstract: A thermoplastic resin composition which has high plasticization effect and excellent flexibility. It comprises a polymer and a thermoplastic resin. The polymer comprises at least 20 wt. % of at least one monomer unit represented by any of the following formulae (1) to (4) and up to 80 wt %. of another monomer unit. The resin may be a polymethyl methacrylate resin, poly(vinyl chloride) resin, ABS resin, etc.Type: ApplicationFiled: December 9, 2003Publication date: August 19, 2004Inventors: Michihiro Kaai, Madoka Furuta
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Publication number: 20040122195Abstract: A process for producing a copolymer which comprises reacting a vinyl monomer with a macromonomer composition containing a macromonomer. The macromonomer composition is obtained by polymerizing at a temperature of 160 to 350° C. a monomer mixture comprising 10 to 80 wt. % first vinyl monomer having an alkyl group in the &agr;-position, 0 to 30 wt. % styrene as an optional ingredient, and 0 to 90 wt. % one or more other vinyl monomers based on the total amount of all monomers.Type: ApplicationFiled: September 2, 2003Publication date: June 24, 2004Inventor: Michihiro Kaai
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Patent number: 6730763Abstract: A composition which is useful as a material with excellent weatherability, such as paints, printing ink, adhesive, filler, molding material, or resist, and is especially suitable for use in applications such as OPV and coating materials. The composition comprises as an active ingredient a polymer obtained by continuously polymerizing at a high temperature either a polymerizable monomer having a maleimide group and other polymerizable group or a polymerizable monomer having a succinimide group.Type: GrantFiled: September 27, 2002Date of Patent: May 4, 2004Assignee: Toagosei Co., Ltd.Inventors: Eiichi Okazaki, Michihiro Kaai