Patents by Inventor Michihiro Kawakami

Michihiro Kawakami has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Semiconductor wafer
    Patent number: 5239191
    Abstract: Upon the making of a die-sort testing for a predetermined IC pattern formed on each chip area, a plurality of sets of output pads selectively supplied with output signals are formed on the chip area and connected with a connection pattern on a dicing line area, and one testing pad is provided for the respective set of the pads. The IC patterns are tested by electrically contacting the testing pad with corresponding probe needle of probe card in a die-sort machine.
    Type: Grant
    Filed: May 27, 1992
    Date of Patent: August 24, 1993
    Assignee: Kabushiki Kaisha Toshiba
    Inventors: Aiichiro Sakumoto, Michihiro Kawakami