Abstract: A radiation-sensitive composition contains a polymer having an acid-releasable group, and a compound represented by formula (1). In the formula (1), L1 represents a group having a (thio)acetal ring or the like. W1 represents a single bond or a (b+1)-valent organic group having 1 to 40 carbon atoms. R1, R2, and R3 each independently represent a hydrogen atom, a hydrocarbon group having 1 to 10 carbon atoms, a fluorine atom, or a fluoroalkyl group. Rf represents a fluorine atom or a fluoroalkyl group. a represents an integer of 0 to 8. b represents an integer of 1 to 4. d represents 1 or 2. When a represents 2 or more, a plurality of R1 are the same or different, and a plurality of R2 are the same or different. M+ represents a monovalent cation.

Abstract: A radiation-sensitive composition contains a polymer having an acid-releasable group, and a compound represented by formula (1). In the formula (1), A1 represents a (m+n+2)-valent aromatic ring group. Both —OH and —COO? are bound to a common benzene ring in A1. Atom to which —OH is bound is located next to an atom to which —COO31 is bound. R1 represents a monovalent group comprising a cyclic (thio)acetal structure. m is an integer of ?0. n is an integer of ?0. M+ represents a monovalent organic cation.

Abstract: A radiation-sensitive resin composition includes: a compound A represented by formula (I); a resin B including a structural unit having an acid-dissociable group; a radiation-sensitive acid generator other than the compound A; and a solvent. R1 is an (m+m?)-valent organic group and comprises a cyclopropane ring skeleton, a cyclobutane ring skeleton, or both; X1 is a group represented by formula (1-1) or a group represented by formula (1-2); X2 is a group represented by formula (2-1) or a group represented by formula (2-2); Y+ is a monovalent onium cation; m is an integer of 1 to 2, and m? is an integer of 0 to 1. * represents a bond to another group.

Abstract: A resist pattern coating agent includes a hydroxyl group-containing resin and a solvent. The solvent includes an alcohol shown by a following formula (1) in an amount of about 30 mass % or more, R—OH??(1) wherein R represents a branched alkyl group having 3 to 10 carbon atoms. The resist pattern coating agent is used in a resist pattern-forming method. The method includes forming a first resist pattern on a substrate using a first radiation-sensitive resin composition. The first resist pattern is treated with the resist pattern coating agent. A second resist pattern is formed on the substrate treated with the resist pattern coating agent using a second radiation-sensitive resin composition.

Abstract: A resist pattern coating agent includes a hydroxyl group-containing resin, a solvent, and at least two compounds including at least two groups shown by a following formula (1), compounds including a group shown by a following formula (2), and compounds including a group shown by a following formula (4).

Abstract: A laminate including: a first silica-based film; a second silica-based film; and an organic film, wherein the second silica-based film includes an organic group containing a carbon-carbon double bond or a carbon-carbon triple bond. A method of forming the laminate includes: forming a first coating for a first silica-based film on a substrate; forming a second coating for a second silica-based film on the first coating, the second coating including an organic group containing a carbon-carbon double bond or a carbon-carbon triple bond; forming a third coating for an organic film on the second coating; and curing a multilayer film including the first to third coatings.

Abstract: A laminate including: a first silica-based film; a second silica-based film; and an organic film, wherein the second silica-based film includes an organic group containing a carbon-carbon double bond or a carbon-carbon triple bond. A method of forming the laminate includes: forming a first coating for a first silica-based film on a substrate; forming a second coating for a second silica-based film on the first coating, the second coating including an organic group containing a carbon-carbon double bond or a carbon-carbon triple bond; forming a third coating for an organic film on the second coating; and curing a multilayer film including the first to third coatings.

Abstract: A method of processing an organosiloxane film includes loading, into a reaction container (1), a substrate (W) with a coating film of a polysiloxane base solution applied thereon. The solution contains bond of a silicon atom with a functional group selected from the group consisting of a methyl group, phenyl group, and vinyl group. The method also includes subjecting the substrate (W) to a heat process in the reaction container (1) to bake the coating film. The heat process is performed in a process atmosphere that includes a catalytic agent gas containing a mixture of ammonia and water, at a process temperature of from 300 to 400° C.