Patents by Inventor Michihiro Ohtaka

Michihiro Ohtaka has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 5092647
    Abstract: A wire harness mounting structure for a motor vehicle door comprising a door frame and planar mounting means, detachably attached to said door frame at an internal side of its motor vehicle, having a wire harness mounted thereon and extending in a plane generally parallel to the door frame. The mounting means is either in the form of a covering board, or a combination of the covering board and an internal side board mounted between the vehicle door frame and the covering board, and, is either integrally formed with the covering board or independently, rigidly formed as in the case of an internal side board.
    Type: Grant
    Filed: January 3, 1990
    Date of Patent: March 3, 1992
    Assignee: Yazaki Corporation
    Inventors: Shinichi Ueda, Michihiro Ohtaka, Yoshiaki Nakayama, Hiroaki Shinba, Hiroshi Ichikawa
  • Patent number: 4907836
    Abstract: A wire harness mounting structure for a motor vehicle door comprising a door frame and planar mounting means, detachably attached to said door frame at an internal side of its motor vehicle, having a wire harness mounted thereon and extending in a plane generally parallel to the door frame. The mounting means is either in the form of a covering board, or a combination of the covering board and an internal side board mounted between the vehicle door frame and the covering board, and, is either integrally formed with the covering board or independently, rigidly formed as in the case of an internal side board.
    Type: Grant
    Filed: August 16, 1988
    Date of Patent: March 13, 1990
    Assignee: Yazaki Corporation
    Inventors: Shinichi Ueda, Michihiro Ohtaka, Yoshiaki Nakayama, Hiroaki Shinba, Hiroshi Ichikawa
  • Patent number: 4831278
    Abstract: A wire harness can be replaced partly or in its entirety with a circuit board which is composed of an insulator substrate and a plurality of conductive strip members provided thereon. The above mentioned conductive strip members are arranged on the insulator substrate parallel with each other. This parallel arrangement of the conductive strips corresponds to bundling of wires in a wire harness. By providing branch paths extending from the conductive strip members, the circuit board can replace a substantial part of the wire harness.
    Type: Grant
    Filed: August 16, 1988
    Date of Patent: May 16, 1989
    Assignee: Yazaki Corporation
    Inventors: Shinichi Ueda, Michihiro Ohtaka, Yoshiaki Nakayama