Abstract: In an electromagnetic valve, a composite valve case has a cylindrical hollow and a composite valve body formed in spool shape is slidably housed in the cylindrical hollow. The composite valve body has not only an inherent valve function for changing fluid path area according to its movement in the cylindrical hollow but also an armature function for constituting a magnetic circuit. The composite valve case has not only a cylinder function for allowing the valve body to slidably move but also a stator function for constituting a magnetic circuit. The composite valve body and the composite valve case are made of soft magnetic material and are provided at their surfaces with thin hardened layers formed by surface or heat treatment.

Abstract: In an electromagnetic valve, a composite valve case has a cylindrical hollow and a composite valve body formed in spool shape is slidably housed in the cylindrical hollow. The composite valve body has not only an inherent valve function for changing fluid path area according to its movement in the cylindrical hollow but also an armature function for constituting a magnetic circuit. The composite valve case has not only a cylinder function for allowing the valve body to slidably move but also a stator function for constituting a magnetic circuit.

Abstract: A metal paste comprising ultrafine particles of a metal. The particles have a particle size of 1000 angstroms (0.1 micron) or less and are individually uniformly dispersed in an organic solvent. A process for producing a metal paste comprises the steps of evaporating a metal in a vacuum chamber in an atmosphere of an inert gas at a pressure of 10 Torr or less and of collecting the vapor of the evaporated metal on a cooling surface in the form of ultrafine particles having a particle size of 1000 angstroms (0.1 micron) or less, wherein a vapor of an organic solvent is introduced into the vacuum chamber while the metal is being evaporated. A method for preparing a metallic thin film having a thickness of between 0.01 micron and 1 micron uses a metal paste containing ultrafine metal particles having a diameter of 0.1 micron or less uniformly dispersed in an organic solvent. In the method, the metal paste is coated on a substrate, dried and sintered.

Abstract: A metal paste comprising ultrafine particles of a metal. The particles have a particle size of 1000 angstroms (0.1 micron) or less and are individually uniformly dispersed in an organic solvent. A process for producing a metal paste comprises the steps of evaporating a metal in a vacuum chamber in an atmosphere of an inert gas at a pressure of 10 Torr or less and of collecting the vapor of the evaporated metal on a cooling surface in the form of ultrafine particles having a particle size of 1000 angstroms (0.1 micron) or less, wherein a vapor of an organic solvent is introduced into the vacuum chamber while the metal is being evaporated. A method for preparing a metallic thin film having a thickness of between 0.01 micron and 1 micron uses a metal paste containing ultrafine metal particles having a diameter of 0.1 micron or less uniformly dispersed in an organic solvent. In the method, the metal paste is coated on a substrate, dried and sintered.

Abstract: A metal paste comprising ultrafine particles of a metal. The particles have a particle size of 1000 angstroms (0.1 micron) or less and are individually uniformly dispersed in an organic solvent.A process for producing a metal paste comprises the steps of evaporating a metal in a vacuum chamber in an atmosphere of an inert gas at a pressure of 10 Torr or less and of collecting the vapor of the evaporated metal on a cooling surface in the form of ultrafine particles having a particle size of 1000 angstroms (0.1 micron) or less, wherein a vapor of an organic solvent is introduced into the vacuum chamber while the metal is being evaporated.A method for preparing a metallic thin film having a thickness of between 0.01 micron and 1 micron. A metal paste containing ultrafine metal particles having a diameter of 0.1 micron or less uniformly dispersed in an organic solvent is coated on a substrate, dried and sintered.