Patents by Inventor Michiko Nishiwaki

Michiko Nishiwaki has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20060075972
    Abstract: A substrate processing apparatus comprises a processing chamber; a susceptor on which a substrate to be processed is to be placed; and a heating unit disposed below the susceptor for heating the substrate to be processed placed on the susceptor. The susceptor and the heating unit are accommodated in the processing chamber, and in a state in which the susceptor and the heating unit are relatively rotated, the substrate to be processed is processed. At least the susceptor is lifted and lowered in the processing chamber, and a substrate to be processed lifting and lowering apparatus for lifting and lowering the substrate to be processed with respect to at least a portion of the susceptor is disposed in the processing chamber.
    Type: Application
    Filed: October 25, 2005
    Publication date: April 13, 2006
    Inventors: Seiyo Nakashima, Michiko Nishiwaki, Yukinori Aburatani, Satoshi Okada, Eisuke Nishitani, Kazuhiro Nakagomi, Kazuhito Ikeda, Kazuhiro Shimeno, Gakuji Ohta, Katsuhisa Kasanami
  • Patent number: 6541344
    Abstract: A substrate processing apparatus includes a heater which heats a substrate through a susceptor on which the substrate is placed. The heater is divided into a plurality of zone heaters, and a reflecting member is interposed between at least two of the plurality of zone heaters.
    Type: Grant
    Filed: October 16, 2001
    Date of Patent: April 1, 2003
    Assignee: Hitachi Kokusai Electric Inc.
    Inventors: Katsuhisa Kasanami, Eisuke Nishitani, Michiko Nishiwaki, Satoshi Okada
  • Patent number: 6483989
    Abstract: A substrate processing apparatus is disclosed for heating a substrate by a heater through a susceptor in a state in which the substrate is placed on the susceptor, to process the substrate. The heater is divided into a plurality of respectively controlled zone heaters to form gaps therebetween, a center position of a gap of the gaps which is positioned closer to an end of the substrate than any other gap is located in a range from an inner side 10 mm to an outer side 6 mm in a radial direction of the substrate with respect to the end of the substrate.
    Type: Grant
    Filed: November 8, 2001
    Date of Patent: November 19, 2002
    Assignee: Hitachi Kokusai Electric Inc.
    Inventors: Satoshi Okada, Michiko Nishiwaki, Katsuhisa Kasanami, Eisuke Nishitani
  • Publication number: 20020160560
    Abstract: A substrate processing apparatus is disclosed for heating a substrate by a heater through a susceptor in a state in which the substrate is placed on the susceptor, to process the substrate. The heater is divided into a plurality of respectively controlled zone heaters to form gaps therebetween, a center position of a gap of the gaps which is positioned closer to an end of the substrate than any other gap is located in a range from an inner side 10 mm to an outer side 6 mm in a radial direction of the substrate with respect to the end of the substrate.
    Type: Application
    Filed: November 8, 2001
    Publication date: October 31, 2002
    Inventors: Satoshi Okada, Michiko Nishiwaki, Katsuhisa Kasanami, Eisuke Nishitani
  • Publication number: 20020072165
    Abstract: In a substrate processing apparatus for heating a substrate by a heater through a susceptor in a state in which the substrate is placed on the susceptor, to process the substrate, the heater is divided into a plurality of zone heaters, and a reflecting member is interposed between at least two of the plurality of zone heaters. Preferably, space exists between the susceptor and the heater. Preferably, the heater is divided into an outer peripheral zone heater and at least one inner zone heater inside the outer peripheral zone heater, the reflecting member has a recessed cross section, and the reflecting member surrounds the inner zone heater except the outer peripheral zone heater.
    Type: Application
    Filed: October 16, 2001
    Publication date: June 13, 2002
    Applicant: HITACHI KOKUSAI ELECTRIC INC.
    Inventors: Katsuhisa Kasanami, Eisuke Nishitani, Michiko Nishiwaki, Satoshi Okada
  • Publication number: 20020017363
    Abstract: A substrate processing apparatus comprises a processing chamber; a susceptor on which a substrate to be processed is to be placed; and a heating unit disposed below the susceptor for heating the substrate to be processed placed on the susceptor. The susceptor and the heating unit are accommodated in the processing chamber, and in a state in which the susceptor and the heating unit are relatively rotated, the substrate to be processed is processed. At least the susceptor is lifted and lowered in the processing chamber, and a substrate to be processed lifting and lowering apparatus for lifting and lowering the substrate to be processed with respect to at least a portion of the susceptor is disposed in the processing chamber.
    Type: Application
    Filed: March 23, 2001
    Publication date: February 14, 2002
    Inventors: Seiyo Nakashima, Michiko Nishiwaki, Yukinori Aburatani, Satoshi Okada, Eisuke Nishitani, Kazuhiro Nakagomi, Kazuhito Ikeda, Kazuhiro Shimeno, Gakuji Ohta, Katsuhisa Kasanami
  • Patent number: 6217663
    Abstract: A substrate processing apparatus comprises a hot-wall type processing chamber for processing a substrate, a heater capable of heating an interior of the processing chamber, a substrate holder capable of holding the substrate and processing the substrate in the processing chamber in a state where the substrate holder holds the substrate, and a mechanism, which is capable of allowing the substrate holder to hold the substrate and then transferring the substrate holder holding the substrate into the processing chamber, and/or which is capable of carrying out the substrate holder from the processing chamber in a state where the substrate holder holds the substrate, and then separating the substrate from the substrate holder.
    Type: Grant
    Filed: June 20, 1997
    Date of Patent: April 17, 2001
    Assignee: Kokusai Electric Co., Ltd.
    Inventors: Yasuhiro Inokuchi, Fumihide Ikeda, Michiko Nishiwaki, Masatoshi Takada, Mamoru Sueyoshi